EP1C3T10017N - 2,910 LEs Cyclone FPGA, TQFP-100 | Intel / Altera
MPN: EP1C3T10017N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $9.6 | $9,600.00 |
EP1C3T10017N Overview
The Cyclone family is Intel's first SRAM-based, low-cost FPGA architecture, positioned in the broader taxonomy as FPGA -> programmable logic device -> logic IC -> integrated circuit. Cyclone devices were introduced in 2002 to address cost-sensitive ASIC replacement and are typically used where logic density in the 2K-20K LE range is sufficient but a microcontroller lacks flexibility. Cyclone FPGAs are fabricated on a 0.13-micron CMOS process with a 4-input look-up table (LUT) based logic element, embedded M4K RAM blocks, and dedicated I/O structures supporting LVTTL, LVCMOS, PCI, and other common single-ended standards.
Key features of the EP1C3T10017N include 2,910 LEs, 13 embedded M4K RAM blocks (58,848 total RAM bits), one PLL providing clock multiplication, division, and phase shifting, and up to 65 user I/O pins across 4 I/O banks. The device supports configuration via passive serial (PS), active serial (AS) with an Altera configuration device, or JTAG. The TQFP-100 (1.0 mm pitch, 14x14 mm body) package enables low-cost PCB assembly on standard FR-4 substrates without the need for advanced HDI stack-ups.
The Cyclone LE architecture combines a 4-input LUT with a configurable register, allowing each LE to implement either combinational logic or a flip-flop. Embedded multiplier blocks (in larger Cyclone variants) and the distributed M4K memory blocks provide on-chip storage for FIFO buffers, look-up tables, and small data caches. The single PLL block supports output frequencies up to several hundred MHz and can deskew external clocks, generate multiple phase-related domains, or compensate for board-level skew.
Typical applications for the EP1C3T10017N include consumer-electronics glue logic, custom interface bridging (I2C/SPI/UART expansion, LCD/LED display controllers), industrial control and sensor aggregation, low-cost prototyping for ASIC replacement, education kits, and legacy system maintenance. Designers often select the EP1C3 for its combination of small footprint, low unit cost, and compatibility with the mature Quartus II design toolchain.
When designing with the EP1C3T10017N, pay careful attention to I/O bank voltage compatibility - the device supports separate VREF and VCCIO rails per bank, but mixing 3.3V and 5V TTL inputs on the same bank without proper VCCIO selection can cause long-term reliability issues. Use Quartus II 13.0sp1 or earlier for legacy support, or migrate to a Cyclone IV or Cyclone 10 LP device for new designs.
This page consolidates distributor pricing, drop-in same-family alternatives, and practical design notes that go beyond the manufacturer datasheet, helping procurement and FPGA engineers evaluate the EP1C3T10017N for both new and legacy designs.
Drop-in alternatives for EP1C3T10017N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1C3T10017N (same form factor and footprint) — differing in Package, RoHS Status, Speed Grade, Operating Temperature, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1C3T100C8N
✅ Drop-In✓ In Stock
$14.2 / Unit
View Datasheet →EP1C3T100I7N
✅ Drop-In✓ In Stock
$13.85 / Unit
View Datasheet →EP1C3T144I7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$55.8 / Unit
View Datasheet →EP1C3T100C6N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$13.5 / Unit
View Datasheet →EP1C4F324C8N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$14.2 / Unit
View Datasheet →EP1C3T10017N Maximum Ratings & Electrical Characteristics
| Family | Cyclone |
| Logic Elements | 2,910 LEs |
| Embedded RAM | 58,848 bits (13 M4K blocks) |
| PLLs | 1 |
| Maximum User I/O | 65 |
| Package | TQFP-100 (14x14 mm, 1.0 mm pitch) |
| Speed Grade | -7 (industrial, commercial temp) |
| Operating Temperature | 0C to +85C (commercial, N suffix) |
| Process Technology | 0.13-micron SRAM CMOS |
| Supply Voltage (Core) | 1.5 V |
| Configuration Modes | PS, AS, JTAG |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant (lead-free N suffix) |
| Lead-Free | Yes (N suffix) |
EP1C3T10017N Pin Configuration
| Pin 1 | I/O — User I/O pin (bank 1) |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | I/O — User I/O pin (bank 1) |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | I/O — User I/O pin (bank 1) |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O pin (bank 2) |
| Pin 13 | I/O — User I/O pin (bank 2) |
| Pin 14 | I/O — User I/O pin (bank 2) |
| Pin 15 | I/O — User I/O pin (bank 2) |
| Pin 16 | VCCINT — Core supply voltage (1.5 V) |
| Pin 17 | I/O — User I/O pin (bank 2) |
| Pin 18 | I/O — User I/O pin (bank 2) |
| Pin 19 | I/O — User I/O pin (bank 2) |
| Pin 20 | I/O — User I/O pin (bank 2) |
| Pin 21 | GND — Ground |
| Pin 22 | I/O — User I/O pin (bank 2) |
| Pin 23 | I/O — User I/O pin (bank 2) |
| Pin 24 | I/O — User I/O pin (bank 2) |
| Pin 25 | I/O — User I/O pin (bank 2) |
| Pin 26 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 27 | I/O — User I/O pin (bank 2) |
| Pin 28 | I/O — User I/O pin (bank 2) |
| Pin 29 | I/O — User I/O pin (bank 2) |
| Pin 30 | I/O — User I/O pin (bank 2) |
| Pin 31 | GND — Ground |
| Pin 32 | I/O — User I/O pin (bank 3) |
| Pin 33 | I/O — User I/O pin (bank 3) |
| Pin 34 | I/O — User I/O pin (bank 3) |
| Pin 35 | I/O — User I/O pin (bank 3) |
| Pin 36 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 37 | I/O — User I/O pin (bank 3) |
| Pin 38 | I/O — User I/O pin (bank 3) |
| Pin 39 | I/O — User I/O pin (bank 3) |
| Pin 40 | I/O — User I/O pin (bank 3) |
| Pin 41 | GND — Ground |
| Pin 42 | I/O — User I/O pin (bank 3) |
| Pin 43 | I/O — User I/O pin (bank 3) |
| Pin 44 | I/O — User I/O pin (bank 3) |
| Pin 45 | I/O — User I/O pin (bank 3) |
| Pin 46 | VCCINT — Core supply voltage (1.5 V) |
| Pin 47 | I/O — User I/O pin (bank 3) |
| Pin 48 | I/O — User I/O pin (bank 3) |
| Pin 49 | I/O — User I/O pin (bank 3) |
| Pin 50 | I/O — User I/O pin (bank 3) |
| Pin 51 | GND — Ground |
| Pin 52 | I/O — User I/O pin (bank 4) |
| Pin 53 | I/O — User I/O pin (bank 4) |
| Pin 54 | I/O — User I/O pin (bank 4) |
| Pin 55 | I/O — User I/O pin (bank 4) |
| Pin 56 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 57 | I/O — User I/O pin (bank 4) |
| Pin 58 | I/O — User I/O pin (bank 4) |
| Pin 59 | I/O — User I/O pin (bank 4) |
| Pin 60 | I/O — User I/O pin (bank 4) |
| Pin 61 | GND — Ground |
| Pin 62 | I/O — User I/O pin (bank 4) |
| Pin 63 | I/O — User I/O pin (bank 4) |
| Pin 64 | I/O — User I/O pin (bank 4) |
| Pin 65 | I/O — User I/O pin (bank 4) |
| Pin 66 | VCCINT — Core supply voltage (1.5 V) |
| Pin 67 | I/O — User I/O pin (bank 4) |
| Pin 68 | I/O — User I/O pin (bank 4) |
| Pin 69 | I/O — User I/O pin (bank 4) |
| Pin 70 | I/O — User I/O pin (bank 4) |
| Pin 71 | GND — Ground |
| Pin 72 | I/O — User I/O pin (bank 1) |
| Pin 73 | I/O — User I/O pin (bank 1) |
| Pin 74 | I/O — User I/O pin (bank 1) |
| Pin 75 | I/O — User I/O pin (bank 1) |
| Pin 76 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 77 | I/O — User I/O pin (bank 1) |
| Pin 78 | I/O — User I/O pin (bank 1) |
| Pin 79 | I/O — User I/O pin (bank 1) |
| Pin 80 | I/O — User I/O pin (bank 1) |
| Pin 81 | GND — Ground |
| Pin 82 | CLK0 — Dedicated clock input 0 (PLL reference) |
| Pin 83 | CLK1 — Dedicated clock input 1 |
| Pin 84 | nCONFIG — Configuration control (active-low) |
| Pin 85 | nSTATUS — Configuration status (active-low) |
| Pin 86 | CONF_DONE — Configuration done indicator |
| Pin 87 | DCLK — Configuration clock |
| Pin 88 | DATA0 — Configuration data input |
| Pin 89 | MSEL0 — Configuration mode select 0 |
| Pin 90 | MSEL1 — Configuration mode select 1 |
| Pin 91 | TDI — JTAG test data input |
| Pin 92 | TMS — JTAG test mode select |
| Pin 93 | TCK — JTAG test clock |
| Pin 94 | TDO — JTAG test data output |
| Pin 95 | VCCINT — Core supply voltage (1.5 V) |
| Pin 96 | I/O — User I/O pin (bank 1) |
| Pin 97 | I/O — User I/O pin (bank 1) |
| Pin 98 | I/O — User I/O pin (bank 1) |
| Pin 99 | I/O — User I/O pin (bank 1) |
| Pin 100 | I/O — User I/O pin (bank 1) |
Typical Applications
EP1C3T10017N is suitable for 6 applications: Legacy Industrial Glue Logic Replacement, Custom LCD / LED Display Controller, Sensor Aggregation and Data Pre-Processing, Legacy Communication Protocol Bridge, Education and FPGA Training Boards, Low-Cost ASIC Replacement for Consumer Electronics.
Legacy Industrial Glue Logic Replacement
The EP1C3T10017N is well suited as a drop-in replacement in legacy industrial control boards where a CPLD or small ASIC originally performed glue-logic functions such as address decoding, bus arbitration, and interrupt steering. With 2,910 LEs and 65 user I/O pins, the device can absorb both the combinational glue logic and small state machines previously split across a CPLD plus a discrete logic gate array. Designers can implement custom peripheral expansion (additional UART, SPI, or I2C controllers) without changing the host processor or PCB layout. The TQFP-100 footprint with 0.5 mm pitch supports hand-rework and visual inspection during field repairs. Combined with its commercial temperature range and Cyclone I maturity, the EP1C3T10017N extends the service life of installed industrial equipment.
Recommended
Custom LCD / LED Display Controller
The EP1C3T10017N's 13 M4K RAM blocks totaling 58,848 bits are ideal for frame-buffer storage and character-generator ROMs in custom LCD or LED matrix display controllers. Each M4K block can be configured as dual-port RAM, allowing the host processor to update the display buffer via one port while the FPGA reads pixel data through the other port, freeing the host CPU from refresh duties. The 4-input LUT architecture efficiently implements font ROMs and small character-rendering state machines in just a few hundred LEs. The TQFP-100 package exposes up to 65 user I/O, sufficient to drive 8-bit RGB panels plus control signals. Commercial temperature grade is adequate for indoor kiosk and instrumentation displays.
Recommended
Sensor Aggregation and Data Pre-Processing
With 2,910 LEs and 65 I/O pins, the EP1C3T10017N serves as a multi-sensor aggregator in environmental monitoring and building automation systems, collecting data from SPI, I2C, and analog-front-end devices and presenting a unified interface to the host processor. The 13 M4K RAM blocks provide 58,848 bits of FIFO buffering for burst data from accelerometers, temperature sensors, and humidity sensors, allowing the host CPU to wake only periodically. The single PLL can generate multiple clock domains for sensors with different sampling rates (1 kHz temperature, 100 Hz humidity, 10 kHz vibration). The TQFP-100 package enables compact PCB integration in sensor hubs, and commercial temperature range is sufficient for indoor and protected-outdoor installations.
Recommended
Legacy Communication Protocol Bridge
The EP1C3T10017N is commonly used as a protocol-conversion bridge between mismatched industrial buses (RS-232 to RS-485, UART to SPI, parallel to I2C), a function too complex for a CPLD but well within the Cyclone I's capability. With 2,910 LEs, designers can implement multi-channel UARTs with hardware flow control, plus a state machine to coordinate bus turnaround and arbitration - tasks that would otherwise require a microcontroller and custom firmware. The 65 user I/O support simultaneous multiple bus interfaces (e.g., 4x UART + 2x SPI + 1x I2C) without external mux logic. TQFP-100 with 0.5 mm pitch supports both automated assembly and field replacement in legacy telecom or industrial networking equipment.
Recommended
Education and FPGA Training Boards
The EP1C3T10017N's combination of low unit cost, 2,910 LE capacity, 100-pin TQFP hand-solderable package, and mature Quartus II toolchain support makes it a classic teaching vehicle in university digital-logic and computer-architecture courses. Students can implement simple RISC processors, UART controllers, VGA drivers, and VGA-pattern generators entirely within 2,910 LEs, exposing the boundary between firmware and hardware description. The TQFP-100 footprint on 0.5 mm pitch is forgiving of student hand-soldering compared to BGA alternatives, and the commercial temperature range is appropriate for indoor lab environments. Quartus II 13.0sp1 remains freely available for educational download, preserving a low-cost entry path for FPGA pedagogy.
Recommended
Low-Cost ASIC Replacement for Consumer Electronics
The EP1C3T10017N originated as a low-cost ASIC alternative for consumer products like set-top boxes, DVD players, and digital cameras where fixed-function silicon was uneconomical at low volumes. Today, the same logic capacity and TQFP-100 footprint serve as a maintenance-part supply for installed consumer products and as a rapid-prototyping platform for derivative designs. Designers can implement custom video-processing pipelines, audio mixing, or user-interface controllers in 2,910 LEs with 13 M4K RAM blocks providing frame and audio buffer storage. The single PLL generates pixel-clock and audio-clock domains from a common reference. Commercial temperature range is appropriate for indoor consumer environments, and the Cyclone I roadmap remains supported for legacy consumer designs through 2026.
Recommended
Recommended Products Summary
Engineering reference data for EP1C3T10017N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C3T100C8N | EP1C3T100I7N | EP1C3T144I7N | EP1C3T100C6N | EP1C4F324C8N |
|---|---|---|---|---|---|---|
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-144 - different | TQFP-100 - same | FBGA-324 - different |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 2,910 LEs | 2,910 LEs | 2,910 LEs | 2,910 LEs | 2,910 LEs | 4,000 LEs (+37%) |
| Embedded RAM | 58,848 bits | 58,848 bits | 58,848 bits | 58,848 bits | 58,848 bits | 78,336 bits |
| Maximum User I/O | 65 | 65 | 65 | 104 | 65 | 249 |
| Speed Grade | -7 | -8 (-12% slower) | -7 (same) | -7 (same) | -6 (faster) | -8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- TQFP-100 with 65 user I/O - largest I/O in the EP1C3 family at lowest package cost (vs EP1C3T144I7N)
- Commercial temperature grade at lower cost than industrial -7 variant (vs EP1C3T100I7N)
- Single PLL sufficient for moderate clock-domain designs without complexity overhead (vs EP1C4F324C8N)
Design Notes
The EP1C3T10017N requires a stable 1.5 V core supply (VCCINT) and separate VCCIO rails for each I/O bank. Decoupling requires at least one 100 uF bulk capacitor per rail plus 0.1 uF and 0.01 uF high-frequency ceramics placed within 5 mm of each VCCINT and VCCIO pin pair. During configuration, the nCONFIG pin must be held low for at least 2 us after VCCINT ramps past the POR threshold; failure to meet this timing causes configuration failure and a nSTATUS low signal. Per the Cyclone device handbook, the ramp rate of VCCINT should be between 0.5 V/ms and 100 V/ms for reliable POR behavior.
The TQFP-100 package with 0.5 mm pin pitch requires 4-layer PCB stack-up for signal integrity on high-speed clock and JTAG traces. Route JTAG signals (TDI, TDO, TMS, TCK) as a 50-ohm impedance-controlled chain with stubs shorter than 5 mm; the chain must be terminated at the EP1C3T10017N with a 10 kohm pull-up on TCK per IEEE 1149.1. Clock inputs CLK0 and CLK1 should be guarded by GND vias on each side to prevent crosstalk from adjacent I/O. Estimated: ground-plane stitching vias every 25 mm across the FPGA footprint improve return-path integrity for the 4 I/O banks.
Do not mix 5 V TTL inputs and 3.3 V LVCMOS outputs on the same I/O bank unless VCCIO is set to 3.3 V - 5 V-tolerant inputs are not supported on Cyclone I banks. Mismatched VCCIO rail voltages between banks cause long-term oxide stress and premature failure. Second, the Quartus II toolchain drops support for Cyclone I starting from Quartus Prime 14.0; pin your toolchain to Quartus II 13.0sp1 or use the open-source yosys + nextpnr community flow. Third, the EP1C3T10017N is NRND per Intel PCN - for new designs use the Cyclone IV EP4CE6 or Cyclone 10 LP 10CL006 instead.
Compliance Information
N suffix indicates lead-free per Altera / Intel ordering information. RoHS and REACH compliance per Altera product declaration. Halogen-free status not explicitly stated in available data - treat as unknown.
