EP1C3T10017N - 2,910 LEs Cyclone FPGA, TQFP-100 | Intel / Altera
Référence : EP1C3T10017N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $11.4 | $5 700,00 |
| 1 000 | $9.6 | $9 600,00 |
EP1C3T10017N Présentation
The Cyclone family is Intel's first SRAM-based, low-cost FPGA architecture, positioned in the broader taxonomy as FPGA -> programmable logic device -> logic IC -> integrated circuit. Cyclone devices were introduced in 2002 to address cost-sensitive ASIC replacement and are typically used where logic density in the 2K-20K LE range is sufficient but a microcontroller lacks flexibility. Cyclone FPGAs are fabricated on a 0.13-micron CMOS process with a 4-input look-up table (LUT) based logic element, embedded M4K RAM blocks, and dedicated I/O structures supporting LVTTL, LVCMOS, PCI, and other common single-ended standards.
Key features of the EP1C3T10017N include 2,910 LEs, 13 embedded M4K RAM blocks (58,848 total RAM bits), one PLL providing clock multiplication, division, and phase shifting, and up to 65 user I/O pins across 4 I/O banks. The device supports configuration via passive serial (PS), active serial (AS) with an Altera configuration device, or JTAG. The TQFP-100 (1.0 mm pitch, 14x14 mm body) package enables low-cost PCB assembly on standard FR-4 substrates without the need for advanced HDI stack-ups.
The Cyclone LE architecture combines a 4-input LUT with a configurable register, allowing each LE to implement either combinational logic or a flip-flop. Embedded multiplier blocks (in larger Cyclone variants) and the distributed M4K memory blocks provide on-chip storage for FIFO buffers, look-up tables, and small data caches. The single PLL block supports output frequencies up to several hundred MHz and can deskew external clocks, generate multiple phase-related domains, or compensate for board-level skew.
Typical applications for the EP1C3T10017N include consumer-electronics glue logic, custom interface bridging (I2C/SPI/UART expansion, LCD/LED display controllers), industrial control and sensor aggregation, low-cost prototyping for ASIC replacement, education kits, and legacy system maintenance. Designers often select the EP1C3 for its combination of small footprint, low unit cost, and compatibility with the mature Quartus II design toolchain.
When designing with the EP1C3T10017N, pay careful attention to I/O bank voltage compatibility - the device supports separate VREF and VCCIO rails per bank, but mixing 3.3V and 5V TTL inputs on the same bank without proper VCCIO selection can cause long-term reliability issues. Use Quartus II 13.0sp1 or earlier for legacy support, or migrate to a Cyclone IV or Cyclone 10 LP device for new designs.
This page consolidates distributor pricing, drop-in same-family alternatives, and practical design notes that go beyond the manufacturer datasheet, helping procurement and FPGA engineers evaluate the EP1C3T10017N for both new and legacy designs.
Alternatives de remplacement direct pour EP1C3T10017N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C3T10017N (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Speed Grade, Operating Temperature, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C3T100C8N
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EP1C3T100I7N
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EP1C3T144I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$55.8 / unité
Voir la fiche technique →EP1C3T100C6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13.5 / unité
Voir la fiche technique →EP1C4F324C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.2 / unité
Voir la fiche technique →EP1C3T10017N Valeurs maximales et caractéristiques électriques
| Family | Cyclone |
| Logic Elements | 2,910 LEs |
| Embedded RAM | 58,848 bits (13 M4K blocks) |
| PLLs | 1 |
| Maximum User I/O | 65 |
| Boîtier | TQFP-100 (14x14 mm, 1.0 mm pitch) |
| Speed Grade | -7 (industrial, commercial temp) |
| Température de fonctionnement | 0C to +85C (commercial, N suffix) |
| Process Technology | 0.13-micron SRAM CMOS |
| Supply Voltage (Core) | 1.5 V |
| Configuration Modes | PS, AS, JTAG |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant (lead-free N suffix) |
| Lead-Free | Yes (N suffix) |
Configuration des broches de EP1C3T10017N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 2) |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | VCCINT — Core supply voltage (1.5 V) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O pin (bank 3) |
| Broche 33 | I/O — User I/O pin (bank 3) |
| Broche 34 | I/O — User I/O pin (bank 3) |
| Broche 35 | I/O — User I/O pin (bank 3) |
| Broche 36 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | GND — Ground |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | VCCINT — Core supply voltage (1.5 V) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | GND — Ground |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | I/O — User I/O pin (bank 4) |
| Broche 54 | I/O — User I/O pin (bank 4) |
| Broche 55 | I/O — User I/O pin (bank 4) |
| Broche 56 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 57 | I/O — User I/O pin (bank 4) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | GND — Ground |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | VCCINT — Core supply voltage (1.5 V) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O pin (bank 1) |
| Broche 73 | I/O — User I/O pin (bank 1) |
| Broche 74 | I/O — User I/O pin (bank 1) |
| Broche 75 | I/O — User I/O pin (bank 1) |
| Broche 76 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 77 | I/O — User I/O pin (bank 1) |
| Broche 78 | I/O — User I/O pin (bank 1) |
| Broche 79 | I/O — User I/O pin (bank 1) |
| Broche 80 | I/O — User I/O pin (bank 1) |
| Broche 81 | GND — Ground |
| Broche 82 | CLK0 — Dedicated clock input 0 (PLL reference) |
| Broche 83 | CLK1 — Dedicated clock input 1 |
| Broche 84 | nCONFIG — Configuration control (active-low) |
| Broche 85 | nSTATUS — Configuration status (active-low) |
| Broche 86 | CONF_DONE — Configuration done indicator |
| Broche 87 | DCLK — Configuration clock |
| Broche 88 | DATA0 — Configuration data input |
| Broche 89 | MSEL0 — Configuration mode select 0 |
| Broche 90 | MSEL1 — Configuration mode select 1 |
| Broche 91 | TDI — JTAG test data input |
| Broche 92 | TMS — JTAG test mode select |
| Broche 93 | TCK — JTAG test clock |
| Broche 94 | TDO — JTAG test data output |
| Broche 95 | VCCINT — Core supply voltage (1.5 V) |
| Broche 96 | I/O — User I/O pin (bank 1) |
| Broche 97 | I/O — User I/O pin (bank 1) |
| Broche 98 | I/O — User I/O pin (bank 1) |
| Broche 99 | I/O — User I/O pin (bank 1) |
| Broche 100 | I/O — User I/O pin (bank 1) |
Applications typiques
EP1C3T10017N convient pour 6 applications: Legacy Industrial Glue Logic Replacement, Custom LCD / LED Display Controller, Sensor Aggregation and Data Pre-Processing, Legacy Communication Protocol Bridge, Education and FPGA Training Boards, Low-Cost ASIC Replacement for Consumer Electronics.
Legacy Industrial Glue Logic Replacement
The EP1C3T10017N is well suited as a drop-in replacement in legacy industrial control boards where a CPLD or small ASIC originally performed glue-logic functions such as address decoding, bus arbitration, and interrupt steering. With 2,910 LEs and 65 user I/O pins, the device can absorb both the combinational glue logic and small state machines previously split across a CPLD plus a discrete logic gate array. Designers can implement custom peripheral expansion (additional UART, SPI, or I2C controllers) without changing the host processor or PCB layout. The TQFP-100 footprint with 0.5 mm pitch supports hand-rework and visual inspection during field repairs. Combined with its commercial temperature range and Cyclone I maturity, the EP1C3T10017N extends the service life of installed industrial equipment.
Recommandé
Custom LCD / LED Display Controller
The EP1C3T10017N's 13 M4K RAM blocks totaling 58,848 bits are ideal for frame-buffer storage and character-generator ROMs in custom LCD or LED matrix display controllers. Each M4K block can be configured as dual-port RAM, allowing the host processor to update the display buffer via one port while the FPGA reads pixel data through the other port, freeing the host CPU from refresh duties. The 4-input LUT architecture efficiently implements font ROMs and small character-rendering state machines in just a few hundred LEs. The TQFP-100 package exposes up to 65 user I/O, sufficient to drive 8-bit RGB panels plus control signals. Commercial temperature grade is adequate for indoor kiosk and instrumentation displays.
Recommandé
Sensor Aggregation and Data Pre-Processing
With 2,910 LEs and 65 I/O pins, the EP1C3T10017N serves as a multi-sensor aggregator in environmental monitoring and building automation systems, collecting data from SPI, I2C, and analog-front-end devices and presenting a unified interface to the host processor. The 13 M4K RAM blocks provide 58,848 bits of FIFO buffering for burst data from accelerometers, temperature sensors, and humidity sensors, allowing the host CPU to wake only periodically. The single PLL can generate multiple clock domains for sensors with different sampling rates (1 kHz temperature, 100 Hz humidity, 10 kHz vibration). The TQFP-100 package enables compact PCB integration in sensor hubs, and commercial temperature range is sufficient for indoor and protected-outdoor installations.
Recommandé
Legacy Communication Protocol Bridge
The EP1C3T10017N is commonly used as a protocol-conversion bridge between mismatched industrial buses (RS-232 to RS-485, UART to SPI, parallel to I2C), a function too complex for a CPLD but well within the Cyclone I's capability. With 2,910 LEs, designers can implement multi-channel UARTs with hardware flow control, plus a state machine to coordinate bus turnaround and arbitration - tasks that would otherwise require a microcontroller and custom firmware. The 65 user I/O support simultaneous multiple bus interfaces (e.g., 4x UART + 2x SPI + 1x I2C) without external mux logic. TQFP-100 with 0.5 mm pitch supports both automated assembly and field replacement in legacy telecom or industrial networking equipment.
Recommandé
Education and FPGA Training Boards
The EP1C3T10017N's combination of low unit cost, 2,910 LE capacity, 100-pin TQFP hand-solderable package, and mature Quartus II toolchain support makes it a classic teaching vehicle in university digital-logic and computer-architecture courses. Students can implement simple RISC processors, UART controllers, VGA drivers, and VGA-pattern generators entirely within 2,910 LEs, exposing the boundary between firmware and hardware description. The TQFP-100 footprint on 0.5 mm pitch is forgiving of student hand-soldering compared to BGA alternatives, and the commercial temperature range is appropriate for indoor lab environments. Quartus II 13.0sp1 remains freely available for educational download, preserving a low-cost entry path for FPGA pedagogy.
Recommandé
Low-Cost ASIC Replacement for Consumer Electronics
The EP1C3T10017N originated as a low-cost ASIC alternative for consumer products like set-top boxes, DVD players, and digital cameras where fixed-function silicon was uneconomical at low volumes. Today, the same logic capacity and TQFP-100 footprint serve as a maintenance-part supply for installed consumer products and as a rapid-prototyping platform for derivative designs. Designers can implement custom video-processing pipelines, audio mixing, or user-interface controllers in 2,910 LEs with 13 M4K RAM blocks providing frame and audio buffer storage. The single PLL generates pixel-clock and audio-clock domains from a common reference. Commercial temperature range is appropriate for indoor consumer environments, and the Cyclone I roadmap remains supported for legacy consumer designs through 2026.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C3T10017N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C3T100C8N | EP1C3T100I7N | EP1C3T144I7N | EP1C3T100C6N | EP1C4F324C8N |
|---|---|---|---|---|---|---|
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-144 - different | TQFP-100 - same | FBGA-324 - different |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 2,910 LEs | 2,910 LEs | 2,910 LEs | 2,910 LEs | 2,910 LEs | 4,000 LEs (+37%) |
| Embedded RAM | 58,848 bits | 58,848 bits | 58,848 bits | 58,848 bits | 58,848 bits | 78,336 bits |
| Maximum User I/O | 65 | 65 | 65 | 104 | 65 | 249 |
| Speed Grade | -7 | -8 (-12% slower) | -7 (same) | -7 (same) | -6 (faster) | -8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- TQFP-100 with 65 user I/O - largest I/O in the EP1C3 family at lowest package cost (vs EP1C3T144I7N)
- Commercial temperature grade at lower cost than industrial -7 variant (vs EP1C3T100I7N)
- Single PLL sufficient for moderate clock-domain designs without complexity overhead (vs EP1C4F324C8N)
Notes de conception
The EP1C3T10017N requires a stable 1.5 V core supply (VCCINT) and separate VCCIO rails for each I/O bank. Decoupling requires at least one 100 uF bulk capacitor per rail plus 0.1 uF and 0.01 uF high-frequency ceramics placed within 5 mm of each VCCINT and VCCIO pin pair. During configuration, the nCONFIG pin must be held low for at least 2 us after VCCINT ramps past the POR threshold; failure to meet this timing causes configuration failure and a nSTATUS low signal. Per the Cyclone device handbook, the ramp rate of VCCINT should be between 0.5 V/ms and 100 V/ms for reliable POR behavior.
The TQFP-100 package with 0.5 mm pin pitch requires 4-layer PCB stack-up for signal integrity on high-speed clock and JTAG traces. Route JTAG signals (TDI, TDO, TMS, TCK) as a 50-ohm impedance-controlled chain with stubs shorter than 5 mm; the chain must be terminated at the EP1C3T10017N with a 10 kohm pull-up on TCK per IEEE 1149.1. Clock inputs CLK0 and CLK1 should be guarded by GND vias on each side to prevent crosstalk from adjacent I/O. Estimated: ground-plane stitching vias every 25 mm across the FPGA footprint improve return-path integrity for the 4 I/O banks.
Do not mix 5 V TTL inputs and 3.3 V LVCMOS outputs on the same I/O bank unless VCCIO is set to 3.3 V - 5 V-tolerant inputs are not supported on Cyclone I banks. Mismatched VCCIO rail voltages between banks cause long-term oxide stress and premature failure. Second, the Quartus II toolchain drops support for Cyclone I starting from Quartus Prime 14.0; pin your toolchain to Quartus II 13.0sp1 or use the open-source yosys + nextpnr community flow. Third, the EP1C3T10017N is NRND per Intel PCN - for new designs use the Cyclone IV EP4CE6 or Cyclone 10 LP 10CL006 instead.
Informations de conformité
N suffix indicates lead-free per Altera / Intel ordering information. RoHS and REACH compliance per Altera product declaration. Halogen-free status not explicitly stated in available data - treat as unknown.
