EP1M120F15FC484 - Mercury FPGA, 120K Gates, FCBGA-484 | Intel / Altera
부품 번호: EP1M120F15FC484 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EP1M120F15FC484 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the integration density of an ASIC with the design flexibility of a mask-programmed gate array. FPGAs belong to the broader hierarchy of programmable logic -> logic IC -> integrated circuit -> semiconductor. The Mercury family occupies a tier between the ACEX 1K and the APEX series, integrating Look-Up Table (LUT)-based logic elements, Embedded System Blocks (ESBs) for memory, and high-speed I/O standards including LVDS, SSTL, and GTL+.
Key features of the EP1M120F15FC484 include 4,800 logic elements (LEs), 49,152 RAM bits distributed across embedded memory blocks, and 303 user I/O pins. The "F15" speed grade corresponds to a -1.5 device in Altera's nomenclature, and the FCBGA-484 package offers a 1.0 mm ball pitch suitable for high-density surface-mount assembly.
The Mercury architecture pairs four-input LUTs with dedicated carry chains for fast arithmetic and a MultiTrack interconnect for predictable timing closure. A built-in PLL supports clock multiplication and phase shifting, while per-pin delay chains simplify source-synchronous interface tuning for DDR-style memories and LVDS links.
Typical applications include high-speed serial backplanes, telecom line cards, networking switches, DSP co-processing engines, and prototyping platforms that demand high I/O count with deterministic timing.
When designing with this device, plan for a 1.5 V core supply (VCCINT) and a 3.3 V I/O supply (VCCIO), and use Altera Quartus II for synthesis, place-and-route, and bitstream generation. Always provision configuration memory through EPC4/EPC8/EPC16 enhanced configuration devices or a download cable.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, making it useful for engineers validating BOM risk and for procurement teams evaluating Mercury family substitutes.
드롭인 대체품: EP1M120F15FC484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1M120F15FC484 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Operating Temperature, Speed Grade, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1M120F484C6
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP1M120F484I6
✅ 드롭인✓ 재고 있음
$95 / 개
데이터시트 보기 →EP1M120B484C7A
✅ 드롭인✓ 재고 있음
$52 / 개
데이터시트 보기 →EP1M120B484I6
✅ 드롭인✓ 재고 있음
$213.75 / 개
데이터시트 보기 →EP1M120B484C8A
✅ 드롭인✓ 재고 있음
$62 / 개
데이터시트 보기 →EP1M120F15FC484 최대 정격 & 전기적 특성
| Family | Mercury |
| Logic Elements | 4,800 |
| Typical Gates | 120,000 |
| Maximum User I/O Pins | 303 |
| Total RAM Bits | 49,152 |
| Embedded Memory Blocks | Embedded System Blocks (ESBs) |
| Speed Grade | F15 (-1.5) |
| 패키지 | 484-ball FineLine BGA (FCBGA) |
| Ball Pitch | 1.0 mm |
| Process Technology | 0.18 um SRAM |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 3.3 V |
| Configuration | SRAM, supports EPC4/EPC8/EPC16 |
| 실장 유형 | Surface Mount (BGA) |
EP1M120F15FC484 484-ball fineline bga (fcbga) 핀 구성 가이드
EP1M120F15FC484(484-ball fineline bga (fcbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1M120F15FC484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1M120F15FC484 적합 용도: 6 애플리케이션s: Telecom Backplane Interface, DSP Co-Processing Engine, Networking Switch Glue Logic, DDR Memory Controller Front-End, Industrial Control Logic, ASIC Prototyping Platform.
Telecom Backplane Interface
The EP1M120F15FC484 fits telecom backplane interface cards because it combines 303 user I/O pins with LVDS and SSTL I/O support, enabling multi-channel source-synchronous links between line cards and a switch fabric. Its 4,800 LEs deliver enough logic for 8b/10b encoding, CRC generation, and per-channel framing without external glue logic. The 1.5 V core keeps dynamic power manageable on a 3.3 V backplane, while the dedicated PLL multiplies a 77.76 MHz reference to the 311 MHz rates used in standard telecom fabrics. Drop-in compatibility with the -6 speed grade (EP1M120F484C6) lets designers reserve the right to upgrade Fmax without PCB rework.
추천
DSP Co-Processing Engine
The EP1M120F15FC484 suits DSP co-processing because its 49,152 bits of embedded RAM (ESBs) provide single-cycle access for FIR filter coefficients and data samples. The 4,800 LEs deliver roughly 4 GMACs of throughput when implementing 16-bit MAC pipelines, and the carry chains support fast adders and accumulators. The 1.5 V core keeps power within a 2 W envelope, suitable for plug-in DSP modules on host cards. Designers can pipeline an entire FFT butterfly or correlate-and-sum operation into one device, offloading the host processor.
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Networking Switch Glue Logic
The EP1M120F15FC484 fits networking switch glue logic because its 303 I/O pins accept LVTTL, LVCMOS, GTL+, and SSTL standards used by PHY and switch ASICs of the era. The Mercury MultiTrack interconnect gives predictable timing on fanout-heavy glue paths such as LED drivers, port-status aggregation, and I2C/SPI management bus muxes. With 4,800 LEs the device comfortably absorbs a full 24-port managed Ethernet switch's logic tail. The 1.5 V core / 3.3 V I/O split simplifies power sequencing with adjacent switch ASICs.
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DDR Memory Controller Front-End
The EP1M120F15FC484 fits DDR memory controller front-ends because its per-pin delay chains and SSTL-2 I/O support compensate for DDR timing skew at up to 167 MHz. The ESB-based FIFO buffers isolate read/write domains, and 4,800 LEs absorb the command scheduler, refresh logic, and parity generation. The 1.5 V core interfaces cleanly to 2.5 V SSTL I/O through VCCIO bank programming. Designers can prototype a DDR controller before committing to ASIC flow.
추천
Industrial Control Logic
The EP1M120F15FC484 fits industrial control because the Mercury die integrates 4,800 LEs with 49,152 RAM bits for state-machine and lookup-table based control logic. The 303 I/O pins support 24 mA drive strength for opto-isolated inputs and relay drivers, and the dedicated PLL cleans noisy industrial clock sources. Its 0.18-um process tolerates extended thermal stress when paired with the industrial-temperature EP1M120F484I6 drop-in. Engineers typically implement PID loops, motion-control state machines, and protocol bridges (Modbus, CAN) on this device.
추천
ASIC Prototyping Platform
The EP1M120F15FC484 fits ASIC prototyping because the 4,800 LEs are large enough to map representative RTL blocks and the 49,152 RAM bits model embedded SRAM accurately. Designers can validate IO ring behaviour with LVDS, SSTL, and GTL+ standards before committing to a 0.18-um ASIC shuttle. The SRAM-based configuration allows infinite design iterations, and JTAG-based downloads accelerate regression cycles. The Mercury family shares the Quartus II flow with Cyclone, easing migration once the prototype is verified.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1M120F15FC484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1M120F484C6 | EP1M120F484I6 | EP1M120B484C7A |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball FCBGA | 484-ball FCBGA (same) | 484-ball FCBGA (same) | 484-ball FCBGA (same) |
| Speed Grade | F15 (-1.5) | -6 (faster) | -6 (faster) | -7 (slower) |
| Logic Elements | 4,800 | 4,800 (same die) | 4,800 (same die) | 4,800 (same die) |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 |
| Maximum User I/O | 303 | 303 | 303 | 303 |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Typical Unit Price (2026-09-07) | USD 145 | USD 165 (faster grade premium) | USD 195 (industrial premium) | USD 110 (slower grade discount) |
주요 차별점
- Slowest speed grade in Mercury family (vs EP1M120F484C6)
- Commercial temperature grade (vs EP1M120F484I6)
- FCBGA-484 high-density package (vs EP1M120B484C7A)
설계 노트
Estimated: The EP1M120F15FC484 has a 1.5 V core (VCCINT) and 3.3 V I/O (VCCIO). With all 303 I/O at 24 mA and a 50% toggle rate, I/O power can exceed 1.2 W; the core adds another 0.5-1.5 W depending on utilization. Provide at least four 100 uF bulk capacitors and sixteen 0.1 uF decoupling capacitors around the FCBGA-484 footprint to keep the VCCINT ripple under 50 mVpp.
Estimated: For a 1.5 W core and 1.2 W I/O load on the FCBGA-484 package (theta_JA ~12 C/W on a 4-layer JEDEC test board), junction temperature rises about 32 C above ambient. In a sealed enclosure at 55 C ambient, junction temperature stays below the 125 C commercial limit, but designers should still specify a thermal pad under the BGA and thermal vias to the inner ground plane.
Use a 1.0 mm pitch FCBGA land pattern with non-solder-mask-defined (NSMD) pads to improve solder joint reliability. Place 0.1 uF decoupling capacitors on the inner layer directly beneath the BGA, and route all VCCINT/VCCIO power planes as split planes with stitching vias every 5 mm. Maintain 50 ohm controlled impedance for LVDS pairs and length-match within 150 mil across an 8-bit bus.
Do not confuse the F15 speed grade with a -6 grade: F15 corresponds to -1.5 (slowest tier) and runs significantly slower than -6. Do not assume EPC16 configuration works without 3.3 V VCCIO on dedicated configuration pins. Do not omit the JTAG TCK pull-down resistor when designing boundary-scan fixtures.
규정 준수 정보
Operating temperature grade not specified in provided data. RoHS and REACH status unknown - the Altera Mercury family predates Intel's RoHS compliance disclosures.
