EP1SGX10CF672C7N - Stratix GX FPGA 10K LE 672-FBGA | Intel
부품 번호: EP1SGX10CF672C7N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $248 | $248.00 |
| 10 | $232.5 | $2,325.00 |
| 100 | $215.8 | $21,580.00 |
| 250 | $198.4 | $49,600.00 |
| 500 | $182.1 | $91,050.00 |
EP1SGX10CF672C7N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that allow a designer to implement arbitrary digital logic after fabrication. FPGAs sit hierarchically above ASICs in flexibility and below microcontrollers in software-driven reconfigurability; within the Stratix GX family they add embedded transceivers targeting high-speed serial I/O. This positions the EP1SGX10CF672C7N in the power-management-adjacent role of high-bandwidth glue logic, packet processing, and protocol bridging.
Key features of the EP1SGX10CF672C7N include 1,200 CLBs, embedded multiplier blocks, TriMatrix memory, support for multiple I/O standards including LVDS, and dedicated high-speed serial transceivers that enable multi-gigabit interconnect. The 672-pin FC-FBGA package uses a 33 × 33 mm body with 1 mm ball pitch, providing ample I/O density while keeping board-routing complexity manageable on standard FR-4 stack-ups.
Architecturally, the Stratix GX family pairs the classic Stratix ALM-based logic fabric with embedded transceivers, PLLs, and DSP blocks, all clocked by a hierarchical clock network. The 130 nm process and dedicated silicon for I/O serdes provide a stable balance between logic density and signal-integrity margin for line-card and backplane designs of its generation.
Typical applications include telecommunications line cards, high-speed serial bridging, industrial control and instrumentation, test equipment, and embedded DSP pipelines. When designing with this part, pay close attention to power-rail sequencing, decoupling, and thermal dissipation on the FC-BGA substrate, since BGA packages depend on the PCB copper pour for heat removal.
드롭인 대체품: EP1SGX10CF672C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX10CF672C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, Package Dimensions, Total RAM Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX10CF672C7
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →EP1SGX10CF672C7GA
✅ 드롭인✓ 재고 있음
$199.5 / 개
데이터시트 보기 →EP1SGX10CF672C6N
✅ 드롭인✓ 재고 있음
$152 / 개
데이터시트 보기 →EP1SGX10CF672C6
✅ 드롭인✓ 재고 있음
$158 / 개
데이터시트 보기 →EP1SGX10CF672C6NGA
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP1SGX10CF672C7N 최대 정격 & 전기적 특성
| Series | Stratix GX |
| Logic Elements | 10,570 |
| Number of LABs/CLBs | 1057 |
| Total RAM Bits | 920448 |
| Number of I/O | 362 |
| 공급 전압 | 1.5 V |
| 동작 온도 | 0 °C to 85 °C |
| 패키지 / 케이스 | 672-BBGA (FC-FBGA), 33 × 33 mm, 1 mm pitch |
| 실장 유형 | Surface Mount |
| Process Technology | 130 nm CMOS |
| Maximum Frequency | 4385.97 MHz |
| Logic Family | CMOS |
| RoHS 상태 | Compliant |
| Lead-Free Terminal Finish | Yes (N suffix) |
EP1SGX10CF672C7N 672-bbga (fc-fbga), 33 × 33 mm, 1 mm pitch 핀 구성 가이드
EP1SGX10CF672C7N(672-bbga (fc-fbga), 33 × 33 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX10CF672C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX10CF672C7N 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, High-Speed Serial Protocol Bridging, Industrial Control and Instrumentation, Test and Measurement Equipment, Embedded DSP Pipelines, Legacy System Maintenance and Drop-In Replacement.
Telecommunications Line Cards
The EP1SGX10CF672C7N fits telecommunications line cards because its Stratix GX architecture integrates multi-gigabit transceivers alongside 10,570 logic elements in a single 672-FBGA package. With 362 user I/Os and embedded transceiver channels, the device can terminate backplane SERDES links and process framer payloads without external PHY chips. Compared to a discrete transceiver-plus-FPGA solution, this single-chip integration reduces board area and BOM cost. Designers should follow Stratix GX reference designs for jitter-cleaning PLLs and AC-coupling caps.
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High-Speed Serial Protocol Bridging
The EP1SGX10CF672C7N excels at high-speed serial protocol bridging — for example, converting between Aurora, Serial RapidIO, and custom proprietary links. The embedded transceivers run at multi-gigabit data rates, while the 10,570 LEs provide generous headroom for state machines, FIFOs, and link-layer logic. The 672-FBGA package keeps critical RX/TX traces short and matched. Use the Quartus II transceiver toolkit for eye-diagram validation during bring-up.
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Industrial Control and Instrumentation
In industrial control and instrumentation, the EP1SGX10CF672C7N is well suited for motor-control DSP, multi-axis data acquisition, and protocol conversion. Its 130 nm CMOS process provides mature, well-characterized timing closure, while the 1.5 V core keeps power dissipation manageable. Note the commercial 0 °C to 85 °C operating range; for harsher environments, choose an 'I' grade variant or migrate to a Cyclone IV/V GX with industrial qualification.
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Test and Measurement Equipment
Test and measurement equipment leverages the EP1SGX10CF672C7N's combination of 362 LVDS-capable I/Os, embedded transceivers, and 10,570 LEs to build protocol analyzers, bit-error-rate testers, and arbitrary waveform generators. The 672-FBGA package supports the dense routing required for high-channel-count instruments. Quartus II synthesis with SignalTap II logic analyzer enables real-time waveform capture for validation. Plan adequate thermal dissipation on the PCB since BGA packages rely on copper pour.
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Embedded DSP Pipelines
Embedded DSP pipelines — such as baseband processing, software-defined radio front-ends, and real-time image processing — fit naturally on the EP1SGX10CF672C7N. The Stratix GX family includes dedicated multiplier blocks and DSP slices that accelerate FIR filters and FFTs far beyond what 10K general-purpose LEs can achieve alone. The 672-FBGA package supports high-bandwidth memory interfaces for streaming data. Target pipelining with parallel sample streams to fully exploit the architecture.
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Legacy System Maintenance and Drop-In Replacement
The EP1SGX10CF672C7N is widely used as a drop-in replacement for legacy Stratix GX-based line cards in long-lifecycle programs such as defense, aerospace, and industrial automation. Its 672-BGA footprint and pinout allow board-level substitution without redesign. Lead-time planning is critical — the family is in last-time-buy — so engineers should qualify C6 and I7 variants in parallel and stockpile Pb-free inventory. Migration to Cyclone V GX is recommended for new designs with extended support windows.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX10CF672C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX10CF672C7 | EP1SGX10CF672C7GA | EP1SGX10CF672C6N | EP1SGX10CF672C6 | EP1SGX10CF672C6NGA |
|---|---|---|---|---|---|---|
| Package | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch |
| Brand | Intel | Intel (Altera legacy) | Intel (Altera legacy) | Intel (Altera legacy) | Intel (Altera legacy) | Intel (Altera legacy) |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Speed Grade | C7 | C7 | C7 | C6 (slower Fmax) | C6 (slower Fmax) | C6 (slower Fmax) |
| Lead-Free Finish | Yes (N suffix) | No (SnPb) | Yes (N in GA suffix) | Yes (N suffix) | No (SnPb) | Yes (N in GA suffix) |
| User I/O Count | 362 | 362 | 362 | 362 | 362 | 362 |
| Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
주요 차별점
- Speed grade C7 gives the highest Fmax in the EP1SGX10CF672 672-FBGA family (vs EP1SGX10CF672C6N)
- Lead-free (Pb-free) ball finish for RoHS-compliant assembly (vs EP1SGX10CF672C7)
- Stratix GX architecture with integrated multi-gigabit transceivers (vs EP1S10F672C7N)
설계 노트
The EP1SGX10CF672C7N requires multiple supply rails (1.5 V core, 3.3 V/2.5 V/1.8 V VCCIO, and an isolated transceiver supply). Per the Stratix GX handbook, sequence the rails so VCCINT comes up first and VCCIO follows after — failing to do so can cause latch-up during configuration. Decouple each rail with a 0.1 µF X7R close to every ball-pair plus bulk polymer capacitors at the supply input. Estimated: at 50% resource utilization with active transceivers, expect 1.5–2.0 A on the 1.5 V core.
The 672-FBGA package dissipates heat almost entirely through the PCB copper pour and internal vias — there is no exposed thermal pad. Per Stratix GX guidance, maximize the ground-plane area under the device and use a minimum 1 oz copper layer on outer planes plus a 2 oz inner layer if possible. Estimated: at full utilization with all transceivers active, junction-to-ambient (θJA) on a 4-layer JEDEC board is approximately 12 °C/W, giving roughly a 60 °C rise at 5 W dissipation. Forced airflow is required for sustained full-load operation in sealed enclosures.
Route high-speed transceiver differential pairs (RX/TX) with 100 Ω differential impedance and length-matched within 150 mil per the Stratix GX device family datasheet. Use AC-coupling capacitors (typically 100 nF X7R 0402) on each RX pair close to the receiver. Reference plane continuity under transceivers is critical — never route signals over plane splits. Pin 1A1 identification follows the chamfered corner of the 672-FBGA package; the Quartus II pin-planner .qsf file provides the full ball map.
Common pitfalls when designing with the EP1SGX10CF672C7N include: (1) forgetting the JTAG TCK/TMS/TDO/TDI pull-ups, which can leave the device unconfigurable; (2) using the wrong configuration mode (AS/PS/Fast Passive) without the correct companion EEPROM; (3) ignoring the MSEL pin settings during PCB layout; and (4) assuming 'C7N' and 'C7' parts are interchangeable — the C7N is lead-free only. Quartus II 13.0sp1 is the last officially supported software; newer Quartus versions will not program this legacy device.
규정 준수 정보
Lead-free per N suffix and RoHS compliant per Intel/Alteray product page. Halogen-free status not explicitly stated in verified data; AEC-Q100 not applicable to commercial-grade FPGAs.
