EP1SGX10DF672C6N - Stratix GX FPGA, 10K LE, 672-FBGA | Altera
부품 번호: EP1SGX10DF672C6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $268 | $2,680.00 |
| 100 | $238 | $23,800.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
EP1SGX10DF672C6N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources like block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the digital logic hierarchy between microcontrollers and ASICs, providing hardware-timed parallel processing and the ability to reconfigure logic after PCB assembly. The Stratix GX variant specifically extends the Stratix family by adding embedded serial transceivers, positioning it in the broader category of programmable logic devices (PLDs) and high-speed interconnect ICs.
Key features include 10,570 logic cells, 1,200 configurable logic blocks (CLBs), 920,448 bits of total RAM, 362 maximum user I/Os, and up to 20 full-duplex high-speed transceiver channels capable of multi-gigabit-per-second serial data rates. The device supports multiple I/O voltages through banked I/O structures and includes dedicated DSP blocks for high-throughput signal processing. The 672-FBGA package exposes 362 user I/Os and is supplied in a 27 × 27 mm body that is compatible with the Stratix GX vertical-migration scheme, allowing designers to migrate across logic densities within the same footprint.
The EP1SGX10DF672C6N uses a CMOS process with a 1.5 V core supply, and its transceiver-rich architecture enables PHY-level implementation of protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI directly in silicon. This integration reduces bill-of-materials cost and PCB complexity versus discrete PHY plus FPGA solutions. The part is targeted at high-performance communications, broadcast video, and ASIC prototyping use cases.
Typical applications include high-speed serial interface bridging, telecom backplane aggregation, custom protocol bridging ASIC prototyping, broadcast video processing, and high-throughput DSP pipelines. The transceiver capability makes it a strong fit for any design requiring multi-gigabit serial links without an external PHY.
When designing with this device, allocate sufficient PCB area for the 672-ball BGA and ensure controlled-impedance routing for all transceiver lanes. Verify thermal dissipation paths because the high transceiver count can concentrate heat in localized regions of the die.
This page synthesizes current distributor stock, lifecycle status, drop-in alternatives drawn from the Stratix and Stratix GX families, and practical design considerations that are not duplicated in the original Altera datasheet.
드롭인 대체품: EP1SGX10DF672C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX10DF672C6N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Total RAM Bits, RoHS Status, Package Dimensions.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX10CF672C6N
✅ 드롭인✓ 재고 있음
$152 / 개
데이터시트 보기 →EP1SGX10DF672C5N
✅ 드롭인✓ 재고 있음
$192 / 개
데이터시트 보기 →EP1SGX10DF672C7N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1SGX10CF672C6
✅ 드롭인✓ 재고 있음
$158 / 개
데이터시트 보기 →EP1SGX10CF672C7N
✅ 드롭인✓ 재고 있음
$182.1 / 개
데이터시트 보기 →EP1SGX10CF672C7
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →EP1SGX10DF672C6N 최대 정격 & 전기적 특성
| Manufacturer | Altera (Intel) |
| Series | Stratix GX |
| Family | Stratix GX |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Cells | 10,570 |
| Configurable Logic Blocks (CLBs) | 1,200 |
| Total RAM Bits | 920,448 |
| Maximum User I/Os | 362 |
| Supply Voltage (Core) | 1.425 V to 1.575 V (1.5 V nominal) |
| Logic Family | CMOS |
| Package Type | 672-FBGA (FineLine BGA, 27 × 27 mm, 1 mm pitch) |
| 핀 수 | 672 |
| 실장 유형 | Surface Mount |
| Operating Temperature (Commercial) | 0 °C to +85 °C |
| Transceivers | Up to 20 high-speed serial channels |
EP1SGX10DF672C6N 672-fbga (fineline bga, 27 × 27 mm, 1 mm pitch) 핀 구성 가이드
EP1SGX10DF672C6N(672-fbga (fineline bga, 27 × 27 mm, 1 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX10DF672C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX10DF672C6N 적합 용도: 6 애플리케이션s: Custom Protocol Bridging ASIC Prototyping, Telecom Backplane Aggregation, Broadcast Video Processing, Industrial High-Speed Data Acquisition, Legacy PCI Express Endpoint / Root Complex Prototyping, ASIC Emulation and Prototyping.
Custom Protocol Bridging ASIC Prototyping
The EP1SGX10DF672C6N's 20 integrated multi-gigabit transceivers and 10,570 logic cells make it well suited for prototyping custom serial-protocol bridges that later migrate to an ASIC. Engineers can implement PHY-layer state machines, link training, and adaptation logic directly in FPGA fabric, replacing the typical ASSP-plus-FPGA two-chip approach with a single device. With 920 Kbits of embedded RAM and dedicated DSP blocks, the device sustains line-rate processing for protocols such as Serial RapidIO, XAUI, and proprietary backplane SerDes. The 672-FBGA package provides ample I/O for parallel side-band signals alongside the serial lanes, which is critical when bridging between mismatched clock domains.
추천
Telecom Backplane Aggregation
The EP1SGX10DF672C6N is widely deployed in telecom aggregation line cards that need to terminate many high-speed serial links from a backplane while performing framing, deframing, and traffic shaping. Its 20 transceiver channels at multi-gigabit rates map directly to typical backplane lane counts, and the 362 user I/Os handle parallel fabric interfaces to network processors. The 1.5 V core plus bank-selectable VCCIO rails let designers mix 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O without external level shifters. Stratix GX vertical migration within the 672-FBGA footprint enables density upgrades without board rework.
추천
Broadcast Video Processing
Broadcast video processing systems often require real-time pixel-rate manipulation such as color-space conversion, scaling, de-interlacing, and overlay compositing. The EP1SGX10DF672C6N's embedded DSP blocks and 920 Kbits of block RAM deliver the throughput needed for SD-SDI, HD-SDI, and 3G-SDI pipelines, while 362 user I/Os accept parallel video buses from external decoders. Designers commonly implement multiple independent video pipelines in a single device, taking advantage of the deterministic latency and parallel architecture versus general-purpose CPUs.
추천
Industrial High-Speed Data Acquisition
In high-channel-count industrial test, scientific instrumentation, and radar front-ends, the EP1SGX10DF672C6N's combination of 20 serial transceivers and large logic capacity lets designers build multi-channel digitizer aggregation in a single chip. Each transceiver lane can carry digitized IF data from an ADC across a backplane to a host processor, eliminating parallel LVDS routing that would otherwise consume hundreds of pins. The 1.5 V core supply and commercial 0 to 85 °C operating range suit controlled-environment test racks and laboratory instrumentation.
추천
Legacy PCI Express Endpoint / Root Complex Prototyping
Engineers historically used the EP1SGX10DF672C6N to prototype PCI Express Gen1 endpoints and root complexes because its transceivers directly drive the PCIe physical layer. The Stratix GX hard IP block plus fabric logic implement transaction, data link, and physical layers with deterministic latency, while the 672-FBGA package exposes enough I/O for auxiliary control and status signals. Although newer Cyclone and Stratix families are recommended for new designs, the EP1SGX10DF672C6N remains a viable platform for sustaining legacy PCIe Gen1 test fixtures.
추천
ASIC Emulation and Prototyping
With 10,570 logic cells and 920 Kbits of embedded RAM, the EP1SGX10DF672C6N is large enough to emulate mid-complexity ASIC RTL blocks for verification and early software development before tape-out. The 672-FBGA package exposes 362 user I/Os for chip-to-chip bridging on multi-FPGA emulation boards, and the 1.5 V core allows relatively straightforward power-tree design. Designers chain multiple Stratix GX devices together using the high-speed transceivers to share clocks and trace data across the emulation array, accelerating pre-silicon validation cycles.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX10DF672C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX10CF672C6N | EP1SGX10DF672C5N | EP1SGX10DF672C7N | EP1SGX10CF672C6 | EP1SGX10CF672C7N | EP1SGX10CF672C7 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera | Altera | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-FBGA (27x27, 1mm pitch) | 672-FBGA (27x27, 1mm pitch) - same | 672-FBGA (27x27, 1mm pitch) - same | 672-FBGA (27x27, 1mm pitch) - same | 672-FBGA (27x27, 1mm pitch) - same | 672-FBGA (27x27, 1mm pitch) - same | 672-FBGA (27x27, 1mm pitch) - same |
| Logic Cells | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Total RAM Bits | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 |
| Speed Grade | C6 | C6 | C5 (slower) | C7 (faster) | C6 | C7 (faster) | C7 (faster) |
| Core Voltage | 1.5 V (1.425 V - 1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Maximum User I/Os | 362 | 362 | 362 | 362 | 362 | 362 | 362 |
주요 차별점
- 20 integrated multi-gigabit transceivers in a 672-FBGA package (vs EP1SGX10CF672C6N)
- Stratix GX vertical-migration pin-compatible package (vs EP1SGX10DF672C5N)
- Faster C7 speed grade for timing-margin critical designs (vs EP1SGX10DF672C7N)
설계 노트
The 672-FBGA package concentrates heat under the central die region. At full transceiver utilization (20 lanes at multi-gigabit rates) the device can exceed 5–8 W of dissipation. Provide at least four thermal vias per thermal pad ball and connect them to inner-plane copper pours to spread heat. Designers targeting production deployment should measure the case temperature under worst-case traffic to verify the 85 °C commercial limit. Estimated: at 6 W dissipation with 4-layer FR-4 and no heatsink, the junction can approach the operating limit; a small clip-on heatsink is recommended for sustained full-load operation.
Use the Stratix GX vertical-migration pin tables to keep the 672-FBGA footprint reusable across densities in the family. Route all 20 high-speed transceiver lanes with controlled 100 Ω differential impedance, length-matched within the tolerance specified in the Stratix GX handbook. Place AC-coupling capacitors for each transceiver lane within 1 cm of the corresponding BGA ball; their placement is mandatory because the on-chip transceivers expect AC-coupled inputs. Decouple every VCC and VCCIO pin with a 0.1 µF plus 10 µF combination placed as close as BGA fanout allows.
Do not assume the EP1SGX10DF672C6N can be hot-swapped on a board designed for the EP1SGX10CF672C6N without verifying JTAG IDs and configuration bitstream compatibility. Altera/Intel Stratix GX devices use SRAM configuration, so an unprogrammed device will not boot on its own - always include a configuration memory (EPCS or compatible) on the schematic. Also note that obsolete part stock often carries older date codes that may not match the latest Quartus II supported-device database, which can complicate programming-file generation.
규정 준수 정보
RoHS/REACH/lead-free status not explicitly stated in the provided web data for this obsolete part. Original Altera Stratix GX family shipped before RoHS was widely enforced; later date codes (post-2006) typically carry lead-free ball finish. Compliance should be verified per specific lot date code with the supplier.
