EP1SGX25-CF672-I6 - Stratix GX FPGA, 25K LEs, 672-FBGA | Altera
부품 번호: EP1SGX25-CF672-I6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $248 | $2,480.00 |
| 100 | $215 | $21,500.00 |
| 500 | $189 | $94,500.00 |
| 1,000 | $168 | $168,000.00 |
EP1SGX25-CF672-I6 개요
An FPGA (Field-Programmable Gate Array) is a reprogrammable integrated circuit consisting of an array of configurable logic blocks (LABs/CLBs), embedded memory, DSP blocks, phase-locked loops, and programmable interconnect that an engineer can configure after manufacture to implement arbitrary digital logic. FPGAs belong to the larger class of programmable logic devices (PLDs) and sit within the hierarchy of digital semiconductors: FPGA -> programmable logic -> logic IC -> integrated circuit. They are widely used as hardware prototyping platforms, ASIC replacements in low-to-mid volume production, and as glue logic in systems that require parallel high-speed signal processing.
Key differentiating specifications include 25,660 logic elements for high gate density, 1,944,576 embedded RAM bits arranged in TriMatrix memory blocks, 14 DSP blocks for fixed- and floating-point arithmetic, and up to 20 embedded transceivers supporting SERDES protocols such as PCI Express, Serial RapidIO, FibreChannel, and Gigabit Ethernet. The device also integrates eight phase-locked loops (PLLs) for clock synthesis and skew management.
The Stratix GX architecture combines a high-performance logic fabric with hard IP for serial interfaces, eliminating the soft-IP overhead that would otherwise consume logic resources. The 672-ball FBGA package exposes 455 user I/O and uses a 1.0 mm ball pitch, enabling high pin-count density while remaining compatible with standard PCB assembly processes.
Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO, FibreChannel), telecommunications line cards and backplanes, military radar and signal processing subsystems, network equipment with deep packet inspection, and ASIC prototyping. The combination of multi-gigabit transceivers and abundant on-chip memory makes the EP1SGX25 well suited for protocols that require both wire-speed logic and packet buffering.
When designing with this part, pay close attention to power estimation: the I6 speed grade trades maximum frequency for the industrial temperature window, so Quartus timing closure may require multi-corner sign-off. Decoupling requires a high-density, low-ESR network because simultaneous switching of hundreds of I/O can generate significant SSO noise on the supply rails. The part is now mature - production status should be re-validated against current distributor stock before committing to a new design.
This page synthesizes distributor pricing, same-family pin-compatible drop-in alternatives, lifecycle observations, and design guidance not present in any single manufacturer datasheet.
드롭인 대체품: EP1SGX25-CF672-I6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25-CF672-I6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, RoHS Status, Mounting Type, Logic Array Blocks (LABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25-CF672-I6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1SGX25-CF672-C7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1SGX25-CF672-C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1SGX25-CF672C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1SGX25-D2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1SGX25-CF672-I6 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory (Bits) | 1,944,576 |
| DSP Blocks | 14 |
| Maximum User I/O | 455 |
| Embedded Transceivers | Up to 20 channels, 3.125 Gbps per channel |
| PLLs | 8 |
| 패키지 | 672-ball FBGA (FC-FBGA), 1.0 mm pitch |
| Process Technology | CMOS, 130 nm |
| Core Supply Voltage | 1.5 V |
| 동작 접합 온도 | -40 °C to 100 °C (TJ) |
| Logic Family | CMOS |
| 실장 유형 | Surface Mount |
| Lead Status | Lead-free |
| 수명 주기 상태 | Obsolete (per distributor records) |
EP1SGX25-CF672-I6 672-ball fbga (fc-fbga), 1.0 mm pitch 핀 구성 가이드
EP1SGX25-CF672-I6(672-ball fbga (fc-fbga), 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25-CF672-I6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25-CF672-I6 적합 용도: 6 애플리케이션s: PCI Express Endpoint / Bridge, Serial RapidIO Backplane Switching, Telecom Line-Card Aggregation, Military Radar / Signal Processing, ASIC Prototyping Platform, Network Packet Inspection / Deep Buffering.
PCI Express Endpoint / Bridge
The EP1SGX25-CF672-I6 is well suited to PCI Express endpoint and bridge designs because of its 20 integrated multi-gigabit transceivers rated up to 3.125 Gbps and 1,944,576 bits of on-chip RAM for packet buffering. The transceivers natively support x1 and x4 PCIe 1.0 with hard IP cores that consume minimal logic fabric, freeing 25,660 LEs for application-layer packet processing. A typical placement routes the EP1SGX25 between a host CPU / root complex and a downstream endpoint, retiming and translating transactions across the link. The trade-off vs newer Cyclone V or Arria 10 devices is process maturity versus per-unit cost and availability; this part is now obsolete so redesign is preferred for new programs.
추천
Serial RapidIO Backplane Switching
Backplane designers favor the EP1SGX25-CF672-I6 for Serial RapidIO aggregation because the integrated 3.125 Gbps transceivers map directly to SRIO physical-layer baud rates. With 2,566 LABs and 14 DSP blocks the device can run link-level CRC, ack/nack sequencing, and small packet-switching fabrics in parallel, while the 455 user I/O expose parallel LVDS / single-ended buses for chassis management. The industrial -40 to +100 °C temperature window suits outdoor base-station shelves and military backplane enclosures. For new designs, evaluate Intel Stratix V GX as a process-refresh successor, but the EP1SGX25 remains drop-in compatible for existing SRIO backplanes.
추천
Telecom Line-Card Aggregation
Telecom line cards historically chose the Stratix GX family for combining multiple E1/T1, SONET, or Ethernet framer interfaces with deep on-chip buffering. The EP1SGX25-CF672-I6 supplies 1,944,576 bits of RAM arranged in TriMatrix blocks that can be configured as FIFOs or packet memories alongside the 20 SERDES channels, eliminating external SRAM on cost-sensitive line cards. The 455 user I/O expose parallel PCM / HDLC buses, and the 8 PLLs synthesize the multiple clock domains required by ingress and egress paths. New deployments should compare Intel Cyclone V GX for power savings, but existing line cards can refresh inventory through EP1SGX25-CF672-I6N.
추천
Military Radar / Signal Processing
Radar and electronic-warfare subsystems use the EP1SGX25-CF672-I6 as a pre-processor for high-bandwidth ADC data and as a digital beam-former for phased-array antennas. The 20 transceivers accept 3.125 Gbps ADC serial lanes, the 14 DSP blocks run FFT and pulse-compression kernels at high sample rates, and the 25,660 LEs handle control and beam-steering logic. The industrial -40 to +100 °C junction temperature window and lead-free FBGA package meet MIL-PRF-38535 Class B environmental flows for many ground and naval platforms. For new radar programs, consider Stratix V GX as a process-refresh path, but EP1SGX25 remains supported via aftermarket inventory.
추천
ASIC Prototyping Platform
ASIC design teams frequently prototype on Stratix GX because of its high logic density, abundant memory, and integrated SERDES that can emulate most ASIC IO. The EP1SGX25-CF672-I6 offers 25,660 LEs and 1,944,576 RAM bits, suitable for mid-complexity ASIC prototypes with embedded SERDES testbenches. Quartus II software supports gate-level mapping and time-domain multiplexing for multi-FPGA partitioning. Validate timing closure across the I6 speed grade corner; commercial-temp EP1SGX25-CF672-C7 may be preferred for prototype bring-up since the C7 grade offers higher fMAX.
추천
Network Packet Inspection / Deep Buffering
Deep packet inspection appliances require multi-gigabit wire-speed parsing with deep on-chip buffers. The EP1SGX25-CF672-I6 satisfies this with 20 transceivers for 10 Gigabit Ethernet uplinks, 1,944,576 bits of TriMatrix memory for packet queues, and 25,660 LEs for regex / pattern matching engines. The 8 PLLs synthesize the multiple clock domains required for ingress, egress, and memory interfaces. Industrial temperature grade suits outdoor network appliances. For green-field designs consider Intel Arria 10 GX for higher transceiver rates (up to 17.4 Gbps) but use EP1SGX25-CF672-I6N for drop-in compatibility with current PCI / SRIO backplanes.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25-CF672-I6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25-CF672-I6N | EP1SGX25-CF672-C7 | EP1SGX25-CF672-C7N | EP1SGX25-CF672C6N |
|---|---|---|---|---|---|
| Package | 672-FBGA | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed / Temperature Grade | I6 (industrial, -40 to 100 C TJ) | I6 (industrial) | C7 (commercial, 0-85 C) | C7 (commercial) | C6 (commercial) |
| Lead-Free / RoHS | Unknown (verify at order) | Yes (N suffix) | Unknown | Yes (N suffix) | Yes (N suffix) |
| Embedded Memory | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits |
| Transceivers | 20 channels @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Industrial temperature window -40 C to 100 C TJ (vs EP1SGX25-CF672-C7)
- RoHS-compliant lead-free option in same package (vs EP1SGX25-CF672-C7)
- Mid-range Stratix GX density in mature 672-BGA footprint (vs EP1SGX25-CF672C6N)
설계 노트
Estimated: at 20 active transceivers @ 3.125 Gbps, core power can exceed 6 W. With a typical 1.0 mm pitch 672-FBGA thermal resistance theta_JA around 12 C/W (JEDEC still-air, no airflow), the junction could rise 72 C above ambient - meaning industrial 100 C junction is reachable in a 28 C ambient enclosure without airflow. Apply at least 200 LFM and a heat spreader for production hardware.
Decoupling on the EP1SGX25 requires a high-density low-impedance network: place 1 µF and 0.1 µF X7R ceramics on every VCCINT, VCCPD, VCCA_PLL, and VCCIO bank within 100 mils of each ball. Use a continuous ground plane under the BGA with stitched vias on a 1 mm grid for both thermal dissipation and supply return.
Verify the I/O bank VCCIO voltages before signal assignment - the EP1SGX25 banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V but not all standards on every bank. Quartus II pin-planner warnings on VCCIO mismatch are common after a Quartus upgrade. Also confirm configuration mode (AS / PS / JTAG) and dual-purpose pins are correctly assigned before compilation.
규정 준수 정보
RoHS / lead-free status depends on suffix. EP1SGX25-CF672-I6N variants are lead-free / RoHS; the bare -I6 variant was historically SnPb. AEC-Q100 not applicable for FPGA. Verify with distributor at order.
