EP1SGX25CF672I6 - 25K LEs Stratix GX FPGA, 672-FBGA | Intel
부품 번호: EP1SGX25CF672I6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP1SGX25CF672I6 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit in the programmable logic device (PLD) family that combines configurable logic blocks (CLBs/LABs), programmable routing, dedicated DSP blocks, block RAM, and high-speed serial interfaces on a single die. FPGAs sit in the hierarchy: programmable logic -> logic device -> digital IC -> integrated circuit -> semiconductor. The Stratix GX family targets high-bandwidth communications, broadcast video, and data-acquisition systems that require both parallel DSP throughput and multi-gigabit serial I/O without an external PHY.
Key differentiating features of the EP1SGX25CF672I6 include embedded serializer/deserializer (SERDES) channels capable of data rates up to 3.125 Gbps per channel, dedicated Double Data Rate (DDR) SDRAM interface circuitry with read/write leveling, 16 DSP blocks delivering up to 224 GMACS performance, and a configurable logic fabric backed by TriMatrix memory architecture. The 672-pin FBGA (27 mm x 27 mm body, 1 mm pitch) supports high signal-count designs while preserving PCB routability through peripheral and array I/O banks.
Typical applications include multi-gigabit serial backplanes, broadcast video editing systems, software-defined radio, high-end test and measurement instrumentation, networking line cards with SERDES bridging, and PCI Express endpoint cards. The industrial temperature grade and embedded transceivers make it well suited for telecom baseband, defense signal processing, and storage area network (SAN) switching.
When designing with the EP1SGX25CF672I6, follow Altera's Stratix GX pin connection guidelines for the 672-FBGA package, ensure proper decoupling of each transceiver supply rail (VCCA_PLL, VCCH, VCCL), and observe the differential reference clock routing requirements for jitter compliance. Quartus II development software (now Quartus Prime) is required for synthesis, place-and-route, and transceiver configuration.
드롭인 대체품: EP1SGX25CF672I6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25CF672I6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, RoHS Status, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25CF672I6N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25CF672C7N
✅ 드롭인✓ 재고 있음
$338.5 / 개
데이터시트 보기 →EP1SGX25CF672C7
✅ 드롭인✓ 재고 있음
$340 / 개
데이터시트 보기 →EP1SGX25CF672C6N
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP1SGX25CF672C6
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25CF672C5
✅ 드롭인✓ 재고 있음
$1304.99 / 개
데이터시트 보기 →EP1SGX25-CF672-I6
✅ 드롭인✓ 재고 있음
$168 / 개
데이터시트 보기 →EP1SGX25CF672I6 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Total RAM Bits | 1,944,576 |
| User I/O Pins | 455 |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V typical) |
| Process Technology | 130 nm CMOS |
| Internal Clock Performance | Up to 5000 MHz |
| 패키지 | 672-ball FBGA (27 x 27 mm, 1 mm pitch) |
| 실장 유형 | Surface Mount |
| 동작 접합 온도 | -40C to +100C |
| RoHS 상태 | Compliant (lead-free FBGA) |
| Lead-Free | Yes |
EP1SGX25CF672I6 672-ball fbga (27 x 27 mm, 1 mm pitch) 핀 구성 가이드
EP1SGX25CF672I6(672-ball fbga (27 x 27 mm, 1 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25CF672I6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25CF672I6 적합 용도: 6 애플리케이션s: Multi-Gigabit Serial Backplane Routing, Broadcast Video Editing Systems, Software-Defined Radio (SDR) Platforms, PCI Express Endpoint Cards, Telecom Line Card Aggregation, High-Speed Test and Measurement Instrumentation.
Multi-Gigabit Serial Backplane Routing
The EP1SGX25CF672I6 integrates up to twenty SERDES channels at data rates up to 3.125 Gbps per the Stratix GX handbook, enabling direct backplane serial links without external PHY chips. With 455 user I/O pins and 25,660 logic elements, the device can implement custom MAC-layer packet processing, link-state management, and aggregation logic alongside the serial I/O. Channel-bonding to standards such as SerialLite II, XAUI (4x3.125 Gbps), and PCI Express x4/x8 reduces board area and BOM cost in chassis-to-chassis interconnects.
추천
Broadcast Video Editing Systems
The EP1SGX25CF672I6's combination of 1.94 Mbit embedded RAM, 16 DSP blocks (per the Stratix GX handbook), and multi-gigabit serial transceivers suits uncompressed HD-SDI video routers and editing systems. The fabric performs real-time color-space conversion, frame-buffer management, and embedded audio de-embed/re-embed, while the SERDES links transport SDI streams to back-end storage. The 455 I/O count accommodates parallel video bus capture alongside serial I/O on the same device.
추천
Software-Defined Radio (SDR) Platforms
The EP1SGX25CF672I6 supports SDR waveform implementation through its DSP block array (224 GMACS performance per the Stratix GX handbook), high-speed ADC/DAC interfaces, and SERDES for digital RF data transport. The 25K logic elements implement channelization, FFT/iFFT engines, and modulation/demodulation algorithms, while SERDES links provide low-latency paths to RF front-end digitizers. Industrial temperature range (-40C to 100C) supports outdoor and military SDR installations.
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PCI Express Endpoint Cards
The EP1SGX25CF672I6's hard PCI Express IP core supports x1, x4, and x8 endpoint implementations at 2.5 Gbps per lane through the embedded SERDES, eliminating external PHY silicon. The 25,660 logic elements and 1.94 Mbit block RAM implement protocol stack, DMA engines, and application logic for add-in cards. The 672-FBGA package supports differential SERDES pairs plus 455 user I/O for external memory and connector interfaces, suitable for server and workstation add-in cards.
추천
Telecom Line Card Aggregation
Telecom line cards use the EP1SGX25CF672I6 to bond SERDES channels for SPI-3/SPI-4.2, RapidIO, and proprietary backplane links at gigabit rates per the Stratix GX handbook. The fabric implements TDM framer/deframer, packet classification, and traffic management with the on-chip DSP and block RAM. The 1.5V core, multi-rail I/O banks (LVTTL, LVCMOS, SSTL, HSTL, LVDS), and industrial temperature rating suit central-office deployments.
추천
High-Speed Test and Measurement Instrumentation
The EP1SGX25CF672I6 provides 455 I/O pins for parallel ADC/DAC interfacing and SERDES channels up to 3.125 Gbps for captured-data streaming to host processors, making it well suited for high-end oscilloscopes, logic analyzers, and protocol testers. The 25K logic elements implement real-time triggering, pattern generation, and on-device statistics, while the 1.94 Mbit block RAM serves as deep sample buffer memory. Industrial temperature rating supports lab and field-test environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25CF672I6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25CF672I6N | EP1SGX25CF672C7N | EP1SGX25CF672C7 | EP1SGX25CF672C6N | EP1SGX25CF672C6 | EP1SGX25CF672C5 | EP1SGX25-CF672-I6 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-FBGA (CF672) | 672-FBGA (CF672) - same | 672-FBGA (CF672) - same | 672-FBGA (CF672) - same | 672-FBGA (CF672) - same | 672-FBGA (CF672) - same | 672-FBGA (CF672) - same | 672-FBGA (CF672) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| User I/O | 455 | 455 | 455 | 455 | 455 | 455 | 455 | 455 |
| Temperature Grade | Industrial (-40C to 100C) | Industrial (-40C to 100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Industrial (-40C to 100C) |
| Speed Grade | I6 (-6 speed, industrial) | I6 (-6) | C7 (-7) | C7 (-7) | C6 (-6) | C6 (-6) | C5 (-5, slowest) | I6 (-6) |
| Lead-Free (Pb-Free) | Yes (Pb-free FBGA) | Yes | Yes | No (leaded) | Yes | No (leaded) | No (leaded) | Yes |
주요 차별점
- Lead-free / Pb-free ball finish required for RoHS-compliant designs (vs EP1SGX25CF672C7 (leaded ball finish))
- Industrial temperature grade for -40C to 100C operation (vs EP1SGX25CF672C7N (commercial 0C to 85C))
- I6 speed grade with -6 timing for high-performance designs (vs EP1SGX25CF672C5 (-5 speed, slowest))
- Full 25K LE density in the Stratix GX family (vs EP1SGX10CF672C7 (10K LE Stratix GX, same package))
설계 노트
The EP1SGX25CF672I6 requires multi-rail decoupling per the Stratix GX handbook. Place 0.1 uF and 0.01 uF X7R capacitors as close as possible to every VCC, VCCIO, VCCA_PLL, and VCCH pin. The PLL analog supply (VCCA_PLL) must be isolated from digital VCC by a ferrite bead and decoupled with a 10 uF tantalum in parallel with 0.1 uF ceramic. SERDES transceiver supplies (VCCH, VCCL) require their own low-noise LDOs (e.g., LT3027) to meet jitter specifications above 3 Gbps.
Estimated: at maximum toggle rate across all 25,660 LEs and active SERDES, the EP1SGX25CF672I6 dissipates approximately 5-8 W depending on logic utilization and transceiver channel count. With theta_JA of approximately 12-15 C/W on a 4-layer JEDEC test board, the junction temperature could rise 60-120 C above ambient. For industrial-grade deployments (junction 100 C max), forced-air airflow or a heatsink with thermal interface material is recommended when sustained logic utilization exceeds 60%.
Differential SERDES pair routing on the EP1SGX25CF672I6 must use 100 ohm differential impedance with matched length within 150 mils per the Stratix GX layout guidelines. Reference-clock routing to dedicated REFCLK pins must be isolated from digital switching signals and routed on inner stripline layers. Place the device on layer 2 with high-speed SERDES breaks to outer layers via stitched ground vias, and avoid routing digital signals directly under the BGA field to minimize crosstalk into the clock network.
Do not assume the EP1SGX25CF672I6 is pin-compatible with newer Stratix II/III/IV/V GX families - those use different die architectures and different BGA ballouts even when package code (F672) is similar. Always re-validate PCB footprint against the target device's package specifications before substitution. Also confirm JTAG chain and configuration scheme (PS, FPP, AS, JTAG) match the target board design, as configuration pin usage may differ between legacy Altera FPGA families.
규정 준수 정보
RoHS-compliant per Altera material declaration; lead-free FBGA ball finish (Pb-free). Industrial temperature grade is not AEC-Q100 qualified (automotive). For automotive applications, evaluate Cyclone IV/V automotive-grade devices instead.
