EP1SGX25-CF672-I6 - Stratix GX FPGA, 25K LEs, 672-FBGA | Altera
MPN: EP1SGX25-CF672-I6 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $248 | $2,480.00 |
| 100 | $215 | $21,500.00 |
| 500 | $189 | $94,500.00 |
| 1,000 | $168 | $168,000.00 |
Drop-in alternatives for EP1SGX25-CF672-I6 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1SGX25-CF672-I6N
β Drop-Inπ Reference alternative (not in catalog)
EP1SGX25-CF672-C7
β Drop-Inπ Reference alternative (not in catalog)
EP1SGX25-CF672-C7N
β Drop-Inπ Reference alternative (not in catalog)
EP1SGX25-CF672C6N
β Drop-Inπ Reference alternative (not in catalog)
EP1SGX25-D2
β Drop-Inπ Reference alternative (not in catalog)
EP1SGX25-CF672-I6 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory (Bits) | 1,944,576 |
| DSP Blocks | 14 |
| Maximum User I/O | 455 |
| Embedded Transceivers | Up to 20 channels, 3.125 Gbps per channel |
| PLLs | 8 |
| Package | 672-ball FBGA (FC-FBGA), 1.0 mm pitch |
| Process Technology | CMOS, 130 nm |
| Core Supply Voltage | 1.5 V |
| Operating Junction Temperature | -40 Β°C to 100 Β°C (TJ) |
| Logic Family | CMOS |
| Mounting Type | Surface Mount |
| Lead Status | Lead-free |
| Lifecycle Status | Obsolete (per distributor records) |
EP1SGX25-CF672-I6 672-ball fbga (fc-fbga), 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX25-CF672-I6 (672-ball fbga (fc-fbga), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25-CF672-I6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25-CF672-I6 is suitable for 6 applications: PCI Express Endpoint / Bridge, Serial RapidIO Backplane Switching, Telecom Line-Card Aggregation, Military Radar / Signal Processing, ASIC Prototyping Platform, Network Packet Inspection / Deep Buffering.
PCI Express Endpoint / Bridge
The EP1SGX25-CF672-I6 is well suited to PCI Express endpoint and bridge designs because of its 20 integrated multi-gigabit transceivers rated up to 3.125 Gbps and 1,944,576 bits of on-chip RAM for packet buffering. The transceivers natively support x1 and x4 PCIe 1.0 with hard IP cores that consume minimal logic fabric, freeing 25,660 LEs for application-layer packet processing. A typical placement routes the EP1SGX25 between a host CPU / root complex and a downstream endpoint, retiming and translating transactions across the link. The trade-off vs newer Cyclone V or Arria 10 devices is process maturity versus per-unit cost and availability; this part is now obsolete so redesign is preferred for new programs.
Recommended
Serial RapidIO Backplane Switching
Backplane designers favor the EP1SGX25-CF672-I6 for Serial RapidIO aggregation because the integrated 3.125 Gbps transceivers map directly to SRIO physical-layer baud rates. With 2,566 LABs and 14 DSP blocks the device can run link-level CRC, ack/nack sequencing, and small packet-switching fabrics in parallel, while the 455 user I/O expose parallel LVDS / single-ended buses for chassis management. The industrial -40 to +100 Β°C temperature window suits outdoor base-station shelves and military backplane enclosures. For new designs, evaluate Intel Stratix V GX as a process-refresh successor, but the EP1SGX25 remains drop-in compatible for existing SRIO backplanes.
Recommended
Telecom Line-Card Aggregation
Telecom line cards historically chose the Stratix GX family for combining multiple E1/T1, SONET, or Ethernet framer interfaces with deep on-chip buffering. The EP1SGX25-CF672-I6 supplies 1,944,576 bits of RAM arranged in TriMatrix blocks that can be configured as FIFOs or packet memories alongside the 20 SERDES channels, eliminating external SRAM on cost-sensitive line cards. The 455 user I/O expose parallel PCM / HDLC buses, and the 8 PLLs synthesize the multiple clock domains required by ingress and egress paths. New deployments should compare Intel Cyclone V GX for power savings, but existing line cards can refresh inventory through EP1SGX25-CF672-I6N.
Recommended
Military Radar / Signal Processing
Radar and electronic-warfare subsystems use the EP1SGX25-CF672-I6 as a pre-processor for high-bandwidth ADC data and as a digital beam-former for phased-array antennas. The 20 transceivers accept 3.125 Gbps ADC serial lanes, the 14 DSP blocks run FFT and pulse-compression kernels at high sample rates, and the 25,660 LEs handle control and beam-steering logic. The industrial -40 to +100 Β°C junction temperature window and lead-free FBGA package meet MIL-PRF-38535 Class B environmental flows for many ground and naval platforms. For new radar programs, consider Stratix V GX as a process-refresh path, but EP1SGX25 remains supported via aftermarket inventory.
Recommended
ASIC Prototyping Platform
ASIC design teams frequently prototype on Stratix GX because of its high logic density, abundant memory, and integrated SERDES that can emulate most ASIC IO. The EP1SGX25-CF672-I6 offers 25,660 LEs and 1,944,576 RAM bits, suitable for mid-complexity ASIC prototypes with embedded SERDES testbenches. Quartus II software supports gate-level mapping and time-domain multiplexing for multi-FPGA partitioning. Validate timing closure across the I6 speed grade corner; commercial-temp EP1SGX25-CF672-C7 may be preferred for prototype bring-up since the C7 grade offers higher fMAX.
Recommended
Network Packet Inspection / Deep Buffering
Deep packet inspection appliances require multi-gigabit wire-speed parsing with deep on-chip buffers. The EP1SGX25-CF672-I6 satisfies this with 20 transceivers for 10 Gigabit Ethernet uplinks, 1,944,576 bits of TriMatrix memory for packet queues, and 25,660 LEs for regex / pattern matching engines. The 8 PLLs synthesize the multiple clock domains required for ingress, egress, and memory interfaces. Industrial temperature grade suits outdoor network appliances. For green-field designs consider Intel Arria 10 GX for higher transceiver rates (up to 17.4 Gbps) but use EP1SGX25-CF672-I6N for drop-in compatibility with current PCI / SRIO backplanes.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25-CF672-I6 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25-CF672-I6N | EP1SGX25-CF672-C7 | EP1SGX25-CF672-C7N | EP1SGX25-CF672C6N |
|---|---|---|---|---|---|
| Package | 672-FBGA | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed / Temperature Grade | I6 (industrial, -40 to 100 C TJ) | I6 (industrial) | C7 (commercial, 0-85 C) | C7 (commercial) | C6 (commercial) |
| Lead-Free / RoHS | Unknown (verify at order) | Yes (N suffix) | Unknown | Yes (N suffix) | Yes (N suffix) |
| Embedded Memory | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits |
| Transceivers | 20 channels @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature window -40 C to 100 C TJ (vs EP1SGX25-CF672-C7)
- RoHS-compliant lead-free option in same package (vs EP1SGX25-CF672-C7)
- Mid-range Stratix GX density in mature 672-BGA footprint (vs EP1SGX25-CF672C6N)
Design Notes
Estimated: at 20 active transceivers @ 3.125 Gbps, core power can exceed 6 W. With a typical 1.0 mm pitch 672-FBGA thermal resistance theta_JA around 12 C/W (JEDEC still-air, no airflow), the junction could rise 72 C above ambient - meaning industrial 100 C junction is reachable in a 28 C ambient enclosure without airflow. Apply at least 200 LFM and a heat spreader for production hardware.
Decoupling on the EP1SGX25 requires a high-density low-impedance network: place 1 Β΅F and 0.1 Β΅F X7R ceramics on every VCCINT, VCCPD, VCCA_PLL, and VCCIO bank within 100 mils of each ball. Use a continuous ground plane under the BGA with stitched vias on a 1 mm grid for both thermal dissipation and supply return.
Verify the I/O bank VCCIO voltages before signal assignment - the EP1SGX25 banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V but not all standards on every bank. Quartus II pin-planner warnings on VCCIO mismatch are common after a Quartus upgrade. Also confirm configuration mode (AS / PS / JTAG) and dual-purpose pins are correctly assigned before compilation.
Compliance Information
RoHS / lead-free status depends on suffix. EP1SGX25-CF672-I6N variants are lead-free / RoHS; the bare -I6 variant was historically SnPb. AEC-Q100 not applicable for FPGA. Verify with distributor at order.
