EP1SGX25CF780I6 - Stratix GX FPGA 25K LE 780-BGA Industrial | Altera
부품 번호: EP1SGX25CF780I6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $205 | $102,500.00 |
| 1,000 | $185 | $185,000.00 |
EP1SGX25CF780I6 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, programmable interconnect, and I/O cells. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit between fixed-function Application-Specific Integrated Circuits (ASICs) and software-programmable processors. The Stratix GX family extends the generic Stratix architecture by integrating multi-gigabit transceivers (MGTs) on-chip, allowing designers to implement protocol bridges, backplane SERDES, and chip-to-chip links without external PHY chips. Designers configure the device via SRAM-based LUTs, so on-board configuration memory is required at every power-up.
Key features of the EP1SGX25CF780I6 include 25,660 logic elements, 1,944,576 embedded RAM bits distributed across TriMatrix memory blocks, dedicated DSP blocks for fixed- and floating-point math, and 20 high-speed transceiver channels with embedded Clock Data Recovery (CDR). The 780-pin FineLine BGA (also catalogued as 780-BBGA) gives designers 597 usable user I/Os and is the largest package offered in the EP1SGX25C speed/power bin, supporting pin-compatible migration to denser Stratix GX family members in the same package. The I6 industrial speed bin balances timing margin against power dissipation.
The architectural backbone pairs a 1.5 V core with eight global clock networks, embedded PLLs for transceiver and logic clock synthesis, and hard IP for PCI Express, RapidIO, and Serial RapidIO when used with the appropriate soft IP core. Triple-speed Ethernet MACs, DDR SDRAM controllers, and QDR II SRAM interfaces can be instantiated in the logic fabric.
Typical applications include multi-gigabit backplane SERDES for line cards and switches, PCIe endpoint and root-complex designs, RAID controller pre-processing pipelines, and high-end ASIC prototyping. The on-chip CDR also suits the part to proprietary chip-to-chip links in storage area networks and broadcast video routing.
When designing with this device, allocate sufficient PCB area for the 780-ball BGA fan-out, plan multi-rail decoupling carefully (1.5 V core plus PLL/transceiver analog supplies), and load the configuration bitstream from a supported EPC configuration device at every power-up. The I6 industrial speed grade is appropriate for production hardware but is not AEC-Q100 qualified, so automotive programs should evaluate newer Cyclone or Arria families.
This page synthesizes distributor pricing, Stratix GX drop-in alternatives from the same Altera/Intel family, and PCB thermal/layout guidance not collected in any single manufacturer document.
드롭인 대체품: EP1SGX25CF780I6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25CF780I6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, Logic Elements, Logic Array Blocks (LABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25CF780I6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S25F780I6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$162 / 개
데이터시트 보기 →EP1S25F780I6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1250 / 개
데이터시트 보기 →EP1SGX10CF672C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$185 / 개
데이터시트 보기 →EP1SGX10CF672C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$152 / 개
데이터시트 보기 →EP1S40F780I6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$305 / 개
데이터시트 보기 →EP1SGX25CF780I6 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Embedded RAM Bits | 1,944,576 |
| Number of LABs/CLBs | 2566 |
| User I/Os | 597 |
| Operating Voltage (Core) | 1.5 V |
| Speed Grade | I6 (industrial) |
| 동작 접합 온도 | -40C to +100C |
| 패키지 | 780-ball BGA (FineLine BGA) |
| 실장 유형 | Surface Mount |
| Number of High-Speed Transceivers | Up to 20 channels |
| Transceiver Data Rate | Up to 3.1875 Gbps per channel |
| Configuration | SRAM-based (requires configuration device at every power-up) |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
EP1SGX25CF780I6 780-ball bga (fineline bga) 핀 구성 가이드
EP1SGX25CF780I6(780-ball bga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25CF780I6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25CF780I6 적합 용도: 6 애플리케이션s: Multi-Gigabit Backplane SERDES, PCI Express Endpoint and Root Complex, RAID Controller Pre-Processing Pipeline, ASIC Prototyping Platform, Broadcast Video Routing and Processing, Industrial Control and High-Speed Data Acquisition.
Multi-Gigabit Backplane SERDES
The EP1SGX25CF780I6's 20 high-speed transceiver channels at up to 3.1875 Gbps per channel make it a direct fit for backplane SERDES applications on line cards, switches, and routers. Each channel integrates Clock Data Recovery (CDR), eliminating the need for an external PHY chip, while the 25,660 logic elements implement protocol framing, CRC, and link-layer state machines. Compared with a non-GX Stratix part, the on-chip SERDES saves board area and reduces BOM cost. The 1.5 V core plus dedicated PLL/transceiver analog supplies must be decoupled with low-ESR ceramic capacitors adjacent to each supply pin per Altera reference designs.
추천
PCI Express Endpoint and Root Complex
Combined with Altera's soft IP cores, the EP1SGX25CF780I6 implements PCI Express x1/x4/x8 endpoints and root complexes at 2.5 Gbps per lane. The transceiver channels drive the PCIe physical layer directly, and the 1,944,576 embedded bits of TriMatrix memory buffer TX/RX packets and completion TLP headers. Per the Stratix GX datasheet, the I6 industrial speed grade provides adequate timing margin across -40°C to +100°C, and the 597 user I/Os are sufficient for downstream fabric expansion. PCB layout must route the transceiver differential pairs with 100-ohm differential impedance and length-matching within 150 mils per PCIe spec.
추천
RAID Controller Pre-Processing Pipeline
In storage controller cards, the EP1SGX25CF780I6 implements XOR parity calculation, RAID-6 Reed-Solomon encoding, and SAS/SATA link initialization in the DSP and TriMatrix memory. Per the Stratix GX datasheet, the dedicated DSP blocks accelerate XOR operations, and the 1.5 V core plus on-chip SERDES (when SAS/SATA is required) consolidates the entire pre-processing pipeline into one device. The 780-ball BGA also enables additional SATA/SAS ports via the high user I/O count, reducing companion bridge chip cost.
추천
ASIC Prototyping Platform
With 25,660 logic elements, 1,944,576 embedded RAM bits, and 597 user I/Os, the EP1SGX25CF780I6 maps mid-density ASIC RTL blocks for verification before tape-out. Per Altera's ASIC prototype guidance, designers partition logic and memory between the FPGA fabric and the prototype's external SRAM/DDR, while the transceiver channels model high-speed ASIC SERDES behavior accurately at up to 3.1875 Gbps. The I6 industrial speed grade and 780-ball FineLine BGA also suit the part to lab-to-test-bench emulation platforms, where the FPGA must emulate the final ASIC under realistic timing constraints.
추천
Broadcast Video Routing and Processing
Broadcast video routers, format converters, and SDI/HD-SDI processing engines use the EP1SGX25CF780I6's transceiver channels to receive uncompressed video at 1.485/2.97 Gbps, while the logic fabric performs scaling, de-interlacing, and frame-buffer management. The TriMatrix memory blocks (1,944,576 bits total) hold several video lines of pixel data at HD resolutions per the Stratix GX datasheet. The I6 industrial temperature range and 597 user I/Os also suit broadcast routers to multiple downstream video outputs without external mux chips, and the 1.5 V core supply simplifies power-tree design.
추천
Industrial Control and High-Speed Data Acquisition
The EP1SGX25CF780I6 is suited to high-channel-count industrial data acquisition, motor control timing, and deterministic networking on the factory floor. Per the Stratix GX datasheet, the 597 user I/Os connect to parallel ADC/DAC arrays, encoder interfaces, and isolated communication ports, while the 1.5 V core and industrial -40°C to +100°C junction range handle harsh thermal environments. The on-chip SERDES channels optionally support proprietary backplane or fiber links to centralized PLCs. The I6 industrial speed grade provides adequate timing margin for deterministic control loops at kilohertz to megahertz sample rates.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25CF780I6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25CF780I6N | EP1S25F780I6 | EP1S25F780I6N | EP1S40F780I6 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Family | Stratix GX | Stratix GX | Stratix (non-GX) | Stratix (non-GX) | Stratix (non-GX) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 41,250 |
| Embedded RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 3,423,744 |
| User I/Os | 597 | 597 | 597 | 597 | 773 |
| Integrated Transceivers | 20 channels up to 3.1875 Gbps | 20 channels up to 3.1875 Gbps | None (external PHY required) | None (external PHY required) | None (external PHY required) |
| Operating Voltage (Core) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial (-40C to +100C junction) | Industrial (-40C to +100C junction) | Industrial (-40C to +100C junction) | Industrial (-40C to +100C junction) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Integrated 20-channel SERDES up to 3.1875 Gbps (vs EP1S25F780I6)
- Same 780-ball BGA footprint across multiple Stratix GX variants (vs EP1SGX10CF672C7)
- Higher logic density than EP1SGX10 in the same family (vs EP1SGX10CF672C7)
설계 노트
Estimated: The EP1SGX25CF780I6 is a high-density FPGA in a 780-ball FineLine BGA. Although the I6 industrial speed grade typically reduces static leakage, total power dissipation in the Stratix GX family can reach 5-10 W at full utilization with active transceivers. A multi-layer PCB with at least 4 signal layers over a continuous ground/power plane is required; thermal vias under the BGA thermal balls and a heatsink or forced-air cooling are recommended for >3 W continuous operation. Without a heatsink, junction temperature can exceed the +100C industrial limit. Refer to Altera application note AN-358 (Stratix GX Power Optimization) for further guidance.
The 780-ball FineLine BGA uses 1.0 mm ball pitch and requires microvia or via-in-pad PCB technology for signal and power escape routing. Per the Stratix GX hardware reference design, dedicated transceiver differential pairs must be routed with 100-ohm differential impedance and length-matched within 150 mils for protocols such as PCIe, XAUI, and Serial RapidIO. Each transceiver channel requires its own AC-coupling capacitor on both TX and RX paths. The configuration JTAG/PS pins must be accessible for boundary-scan testing during board bring-up.
The EP1SGX25CF780I6 requires multiple power rails: VCCINT (1.5 V core), VCCIO (per-bank I/O supply, typically 3.3 V, 2.5 V, or 1.8 V depending on the bank), VCCA_PLL (analog PLL supply, typically 2.5 V), and VCCAUX/VCCPD (auxiliary and pre-driver supplies). Per the Stratix GX datasheet, each rail must be decoupled with a bulk 100 uF tantalum or polymer capacitor plus 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of the supply pin. Sequence VCCINT before VCCIO per Altera's power sequencing requirements to avoid latch-up during power-up.
The SRAM-based FPGA fabric means the EP1SGX25CF780I6 must load its configuration bitstream from an external configuration device (such as EPC16 or EPCS) at every power-up. Without a valid configuration, all I/O and logic is tri-stated and the device draws only minimal supply current. Do not assume the device is faulty if all I/Os appear inactive after power-up; verify the configuration sequence via the nSTATUS, nCONFIG, and CONF_DONE pins. Loss of configuration also means loss of all internal state, including any on-chip memory contents - design the system to tolerate full re-initialization at every power-up.
규정 준수 정보
RoHS compliant per Altera/Intel legacy datasheet. Not AEC-Q100 qualified; do not use in automotive programs without additional qualification. Halogen-free status not stated in legacy datasheet - marked unknown. Conflict minerals compliance per Altera/Intel standard declaration.
