EP1S25F780I6 - Stratix 25K LE FPGA, 780-BGA, Industrial | Altera
MPN: EP1S25F780I6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198.5 | $19,850.00 |
| 250 | $175.2 | $43,800.00 |
| 500 | $162 | $81,000.00 |
Drop-in alternatives for EP1S25F780I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F780C7N
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View Datasheet →EP1S25F780C7
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View Datasheet →EP1S25F780C6N
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View Datasheet →EP1S25F780C6
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View Datasheet →EP1S25F780C5N
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View Datasheet →EP1S25F780I6 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements (LE) | 25,660 |
| Logic Array Blocks (LAB) | 2,566 |
| Total RAM Bits | 1,944,576 |
| DSP Blocks | 28 |
| Embedded Multipliers | 9-bit x 9-bit, in DSP blocks |
| User I/O Count | 597 |
| Package | 780-ball FBGA (FineLine BGA, 29 x 29 mm, 1 mm pitch) |
| Process Node | 0.13 µm all-layer copper SRAM |
| Core Voltage VCCINT | 1.5 V typical |
| Operating Temperature | 0 °C to +85 °C (Industrial, -I6 grade) |
| Configuration | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Mounting Type | Surface Mount (BGA) |
EP1S25F780I6 780-ball fbga (fineline bga, 29 x 29 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S25F780I6 (780-ball fbga (fineline bga, 29 x 29 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F780I6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F780I6 is suitable for 6 applications: Telecom Line-Card Datapath, ASIC / SoC Prototyping, Custom DSP Co-Processor, High-Speed Protocol Bridging, Industrial Control & Test Backplanes, High-Speed Data Acquisition Front-End.
Telecom Line-Card Datapath
The EP1S25F780I6 is a strong fit for telecom line-card datapaths because it combines 25,660 logic elements with 28 dedicated DSP blocks for packet-header processing, framing/de-framing and on-card statistics aggregation. Its 597 user I/Os allow direct connection to multiple external PHY devices, SGMII/SerDes bridges and backplane transceivers without intermediate buffers. The 1,944,576 bits of embedded SRAM provide FIFO depth for traffic shaping, and the Stratix fabric supports independent I/O-bank voltages so LVTTL control can coexist with HSTL/SSTL memory interfaces. Design tip: instantiate the Stratix Tri-Speed Ethernet MegaCore and connect to external PHYs through dedicated I/O banks; place decoupling on every VCCINT/VCCIO cluster.
Recommended
ASIC / SoC Prototyping
For ASIC and SoC prototyping the EP1S25F780I6 supplies enough logic capacity (25,660 LEs) and I/O bandwidth (597 user I/Os) to map multi-million-gate ASIC designs onto one or several FPGAs in a multi-FPGA partition. The Stratix configuration controller supports fast re-load via Passive Parallel, enabling rapid bring-up cycles. Embedded block RAM plus 28 DSP blocks give headroom for bus-functional models, transaction-level monitors and soft-core processors (Nios II). A common pattern is to place the EP1S25F780I6 on a daughter card with high-speed board-to-board connectors to neighboring FPGAs, using LVDS pairs for inter-FPGA signals.
Recommended
Custom DSP Co-Processor
The EP1S25F780I6 is well-suited as a custom DSP co-processor: each of its 28 DSP blocks contains 9-bit x 9-bit hardware multipliers with adders, supporting FIR/IIR filtering, FFT butterflies and matrix multiplication at sample rates unreachable in software. Combined with the 1,944,576 embedded RAM bits, designers can build large coefficient tables, sliding windows and overlap-save buffers entirely on-chip. The 597 I/Os enable streaming interfaces to high-speed ADCs/DACs and to a host CPU for data movement. Typical use cases include software-defined radio front-ends, audio/speech processing and vibration analysis.
Recommended
High-Speed Protocol Bridging
Protocol bridging applications - converting SPI to I2C, UART to USB, PCIe to local bus, or parallel RapidIO to Ethernet - map well onto the EP1S25F780I6 thanks to its 597 I/Os and abundant logic for finite-state machine glue. The Stratix fabric lets designers implement any custom framing protocol in soft logic while keeping hard IP for memory and arithmetic. Independent I/O-bank voltages on the FBGA package let LVTTL, LVCMOS, SSTL and LVDS signals coexist on the same silicon, eliminating external level-shifters. Use this device when a fixed-function bridge IC is unavailable or when firmware evolution is required in-field.
Recommended
Industrial Control & Test Backplanes
In industrial control and automated test equipment, the EP1S25F780I6 functions as a backplane controller that aggregates instrument data, drives custom test patterns and sequences relays/multiplexers. The -I6 industrial temperature grade (0 °C to +85 °C) suits factory-floor enclosures. Its 597 I/Os are enough to expose dozens of test points, while the 28 DSP blocks can compute real-time FFTs, RMS values and statistical histograms inline. Pair the FPGA with external SRAM for deep capture buffers and use Quartus II SOPC Builder to integrate a Nios II soft-core for housekeeping.
Recommended
High-Speed Data Acquisition Front-End
For high-speed data acquisition the EP1S25F780I6 acts as the front-end FPGA that interfaces to parallel ADCs at hundreds of MSPS, performs decimation/channelization and forwards packets over a high-speed serial link. The 597 I/Os support wide parallel LVDS buses from the ADC, while the 1,944,576 RAM bits allow deep sample buffers and overlap-save channelizers. Its 28 DSP blocks accelerate per-channel filtering and demodulation in firmware-reconfigurable fashion. The 780-ball FBGA package supports thermal vias under the BGA slug to keep the die within the industrial 0 °C to +85 °C range at high toggle rates.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F780I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F780C7N | EP1S25F780C7 | EP1S25F780C6N | EP1S25F780C6 | EP1S25F780C5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-ball FBGA (FineLine BGA, 29 x 29 mm, 1 mm pitch) | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O Pins | 597 | 597 | 597 | 597 | 597 | 597 |
| Speed/Temperature Grade | I6 (Industrial 0 to +85 C, speed grade 6) | C7 (Commercial 0 to +85 C, speed grade 7) | C7 (Commercial, lead-bearing) | C6 (Commercial 0 to +85 C, speed grade 6) | C6 (Commercial, lead-bearing) | C5 (Commercial 0 to +85 C, speed grade 5) |
| Embedded RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| DSP Blocks | 28 | 28 | 28 | 28 | 28 | 28 |
| Process / Core Voltage | 0.13 µm / 1.5 V VCCINT | 0.13 µm / 1.5 V | 0.13 µm / 1.5 V | 0.13 µm / 1.5 V | 0.13 µm / 1.5 V | 0.13 µm / 1.5 V |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Drop-in compatible with five Stratix speed-grade siblings (vs EP1S25F780C7N / C6N / C5N)
- Same die across the EP1S25 family (vs EP1S25F1020I6N (40 K-LE sibling))
- 597 user I/Os - high I/O density for the Stratix generation (vs Xilinx Virtex-II Pro XC2VP30 (644 I/Os in 1156-ball package))
Design Notes
The 780-ball FineLine BGA (1 mm pitch) demands a 6+ layer PCB stack-up with dedicated ground and power planes adjacent to the BGA footprint. Use a 1.0 mm pitch BGA escape pattern of dog-bone fan-out on the top layer and 4 mil traces between balls; place micro-via-in-pad or staggered micro-vias to reach inner planes. Add a continuous ground ring around the BGA thermal slug and stitch vias every 1-2 mm to maintain a low-impedance ground return for the high-frequency I/O.
The EP1S25F780I6 requires multiple separate supplies: VCCINT (1.5 V core), VCCIO (per bank), VCCPD (pre-drivers), VCCA_PLL (analog PLL) and VCC_CONFIG. Use a power-supply sequencing controller to enforce the VCCINT-before-VCCIO-before-VCCPD order specified in the Stratix Hardware Reference Manual, and provide at least 4 bulk 22 µF tantalum + 100 µF ceramic capacitors plus a 0.1 µF / 0.01 µF decoupling pair per VCC pin cluster. Estimated: at high toggle rates the VCCINT current can exceed 2 A; verify with the Quartus II PowerPlay early-estimate tool before layout.
Three pitfalls repeatedly appear in EP1S25F780I6 designs: (1) leaving configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) floating - tie them per the configuration scheme chosen; (2) forgetting that unused I/O pins must be left unconnected or driven to a known state to avoid leakage on the I/O bank; (3) relying on a single JTAG chain for multi-FPGA boards - plan a star or daisy-chain JTAG topology and provide test access to all devices. Also note that older Quartus II versions do not support the latest service packs; install the matching Quartus II Service Pack on every design workstation.
The 780-ball FBGA uses a thermal slug; place a 5 x 5 array of 12 mil thermal vias under the slug to spread heat into inner ground/power planes. Estimated: at 100 % toggle rate the device can dissipate 3-5 W depending on utilization; in an enclosed industrial enclosure add forced-air cooling or a small heatsink to keep junction temperature below 100 °C. Use the Quartus II PowerPlay thermal model output to size the cooling solution; do not skip this step on production hardware.
Compliance Information
RoHS, lead-free and REACH compliance are lot-dependent for the obsolete EP1S25F780I6 and were not confirmed in the verified web data. AEC-Q100 is not applicable (this is a commercial/industrial FPGA). Request a RoHS / lead-free certificate by date code from the distributor before purchase if compliance is required for the end system.
