EP1S25F780I6 - Stratix 25K LE FPGA, 780-BGA, Industrial | Altera
부품 번호: EP1S25F780I6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198.5 | $19,850.00 |
| 250 | $175.2 | $43,800.00 |
| 500 | $162 | $81,000.00 |
EP1S25F780I6 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device whose configurable logic blocks, interconnect and I/O cells are defined by an SRAM configuration bitstream loaded at power-up. FPGAs sit at the top of the programmable logic hierarchy - above CPLDs in density and below ASICs in per-unit cost - and dominate applications requiring hardware-level parallelism such as DSP, baseband processing, high-speed serial protocol bridging, and ASIC prototyping. The Stratix family in particular introduced embedded memory blocks, DSP blocks and high-speed transceivers as hard IP inside the fabric, accelerating arithmetic-heavy designs that previously had to be built from soft multipliers.
Key features of the EP1S25F780I6 include 25,660 logic elements, 1,944,576 RAM bits, 597 user I/Os and 28 DSP blocks. The -I6 speed/temperature grade targets the industrial 0 °C to +85 °C window and operates at the core VCCINT of 1.5 V typical, with separate VCCIO banks supporting common single-ended I/O standards. Configuration is handled via the dedicated JTAG (IEEE 1149.1) interface plus the Altera Passive Serial or Fast Passive Parallel configuration schemes supported by the Stratix configuration controller.
Typical applications for the EP1S25F780I6 are telecom line-card datapaths, ASIC and SoC prototyping, custom DSP co-processors, high-speed serial protocol bridging, and industrial control / test-and-measurement backplanes. The combination of 28 DSP blocks and 597 I/Os makes the part particularly suited to designs that need both significant glue-logic capacity and arithmetic density on a single device.
When designing with this device, ensure the PCB has at least 6 controlled-impedance layers, decoupling on every VCC/VCCINT/VCCIO ball cluster, and thermal vias under the BGA thermal slug; full configuration and JTAG chains must be planned at board level before layout. The Stratix configuration controller requires a valid configuration bitstream at power-up - do not leave configuration pins floating.
This page synthesizes distributor availability, cross-reference alternatives and design notes that supplement the official Stratix device family datasheet, with values verified against live distributor data as of 2026-09-07.
드롭인 대체품: EP1S25F780I6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S25F780I6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, DSP Blocks, Family, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S25F780C7N
✅ 드롭인✓ 재고 있음
$588.2 / 개
데이터시트 보기 →EP1S25F780C7
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1S25F780C6N
✅ 드롭인✓ 재고 있음
$780 / 개
데이터시트 보기 →EP1S25F780C6
✅ 드롭인✓ 재고 있음
$791.02 / 개
데이터시트 보기 →EP1S25F780C5N
✅ 드롭인✓ 재고 있음
$595 / 개
데이터시트 보기 →EP1S25F780I6 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements (LE) | 25,660 |
| Logic Array Blocks (LAB) | 2,566 |
| Total RAM Bits | 1,944,576 |
| DSP Blocks | 28 |
| Embedded Multipliers | 9-bit x 9-bit, in DSP blocks |
| User I/O Count | 597 |
| 패키지 | 780-ball FBGA (FineLine BGA, 29 x 29 mm, 1 mm pitch) |
| Process Node | 0.13 µm all-layer copper SRAM |
| Core Voltage VCCINT | 1.5 V typical |
| 동작 온도 | 0 °C to +85 °C (Industrial, -I6 grade) |
| Configuration | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| 실장 유형 | Surface Mount (BGA) |
EP1S25F780I6 780-ball fbga (fineline bga, 29 x 29 mm, 1 mm pitch) 핀 구성 가이드
EP1S25F780I6(780-ball fbga (fineline bga, 29 x 29 mm, 1 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S25F780I6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S25F780I6 적합 용도: 6 애플리케이션s: Telecom Line-Card Datapath, ASIC / SoC Prototyping, Custom DSP Co-Processor, High-Speed Protocol Bridging, Industrial Control & Test Backplanes, High-Speed Data Acquisition Front-End.
Telecom Line-Card Datapath
The EP1S25F780I6 is a strong fit for telecom line-card datapaths because it combines 25,660 logic elements with 28 dedicated DSP blocks for packet-header processing, framing/de-framing and on-card statistics aggregation. Its 597 user I/Os allow direct connection to multiple external PHY devices, SGMII/SerDes bridges and backplane transceivers without intermediate buffers. The 1,944,576 bits of embedded SRAM provide FIFO depth for traffic shaping, and the Stratix fabric supports independent I/O-bank voltages so LVTTL control can coexist with HSTL/SSTL memory interfaces. Design tip: instantiate the Stratix Tri-Speed Ethernet MegaCore and connect to external PHYs through dedicated I/O banks; place decoupling on every VCCINT/VCCIO cluster.
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ASIC / SoC Prototyping
For ASIC and SoC prototyping the EP1S25F780I6 supplies enough logic capacity (25,660 LEs) and I/O bandwidth (597 user I/Os) to map multi-million-gate ASIC designs onto one or several FPGAs in a multi-FPGA partition. The Stratix configuration controller supports fast re-load via Passive Parallel, enabling rapid bring-up cycles. Embedded block RAM plus 28 DSP blocks give headroom for bus-functional models, transaction-level monitors and soft-core processors (Nios II). A common pattern is to place the EP1S25F780I6 on a daughter card with high-speed board-to-board connectors to neighboring FPGAs, using LVDS pairs for inter-FPGA signals.
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Custom DSP Co-Processor
The EP1S25F780I6 is well-suited as a custom DSP co-processor: each of its 28 DSP blocks contains 9-bit x 9-bit hardware multipliers with adders, supporting FIR/IIR filtering, FFT butterflies and matrix multiplication at sample rates unreachable in software. Combined with the 1,944,576 embedded RAM bits, designers can build large coefficient tables, sliding windows and overlap-save buffers entirely on-chip. The 597 I/Os enable streaming interfaces to high-speed ADCs/DACs and to a host CPU for data movement. Typical use cases include software-defined radio front-ends, audio/speech processing and vibration analysis.
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High-Speed Protocol Bridging
Protocol bridging applications - converting SPI to I2C, UART to USB, PCIe to local bus, or parallel RapidIO to Ethernet - map well onto the EP1S25F780I6 thanks to its 597 I/Os and abundant logic for finite-state machine glue. The Stratix fabric lets designers implement any custom framing protocol in soft logic while keeping hard IP for memory and arithmetic. Independent I/O-bank voltages on the FBGA package let LVTTL, LVCMOS, SSTL and LVDS signals coexist on the same silicon, eliminating external level-shifters. Use this device when a fixed-function bridge IC is unavailable or when firmware evolution is required in-field.
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Industrial Control & Test Backplanes
In industrial control and automated test equipment, the EP1S25F780I6 functions as a backplane controller that aggregates instrument data, drives custom test patterns and sequences relays/multiplexers. The -I6 industrial temperature grade (0 °C to +85 °C) suits factory-floor enclosures. Its 597 I/Os are enough to expose dozens of test points, while the 28 DSP blocks can compute real-time FFTs, RMS values and statistical histograms inline. Pair the FPGA with external SRAM for deep capture buffers and use Quartus II SOPC Builder to integrate a Nios II soft-core for housekeeping.
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High-Speed Data Acquisition Front-End
For high-speed data acquisition the EP1S25F780I6 acts as the front-end FPGA that interfaces to parallel ADCs at hundreds of MSPS, performs decimation/channelization and forwards packets over a high-speed serial link. The 597 I/Os support wide parallel LVDS buses from the ADC, while the 1,944,576 RAM bits allow deep sample buffers and overlap-save channelizers. Its 28 DSP blocks accelerate per-channel filtering and demodulation in firmware-reconfigurable fashion. The 780-ball FBGA package supports thermal vias under the BGA slug to keep the die within the industrial 0 °C to +85 °C range at high toggle rates.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S25F780I6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S25F780C7N | EP1S25F780C7 | EP1S25F780C6N | EP1S25F780C6 | EP1S25F780C5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-ball FBGA (FineLine BGA, 29 x 29 mm, 1 mm pitch) | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O Pins | 597 | 597 | 597 | 597 | 597 | 597 |
| Speed/Temperature Grade | I6 (Industrial 0 to +85 C, speed grade 6) | C7 (Commercial 0 to +85 C, speed grade 7) | C7 (Commercial, lead-bearing) | C6 (Commercial 0 to +85 C, speed grade 6) | C6 (Commercial, lead-bearing) | C5 (Commercial 0 to +85 C, speed grade 5) |
| Embedded RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| DSP Blocks | 28 | 28 | 28 | 28 | 28 | 28 |
| Process / Core Voltage | 0.13 µm / 1.5 V VCCINT | 0.13 µm / 1.5 V | 0.13 µm / 1.5 V | 0.13 µm / 1.5 V | 0.13 µm / 1.5 V | 0.13 µm / 1.5 V |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Drop-in compatible with five Stratix speed-grade siblings (vs EP1S25F780C7N / C6N / C5N)
- Same die across the EP1S25 family (vs EP1S25F1020I6N (40 K-LE sibling))
- 597 user I/Os - high I/O density for the Stratix generation (vs Xilinx Virtex-II Pro XC2VP30 (644 I/Os in 1156-ball package))
설계 노트
The 780-ball FineLine BGA (1 mm pitch) demands a 6+ layer PCB stack-up with dedicated ground and power planes adjacent to the BGA footprint. Use a 1.0 mm pitch BGA escape pattern of dog-bone fan-out on the top layer and 4 mil traces between balls; place micro-via-in-pad or staggered micro-vias to reach inner planes. Add a continuous ground ring around the BGA thermal slug and stitch vias every 1-2 mm to maintain a low-impedance ground return for the high-frequency I/O.
The EP1S25F780I6 requires multiple separate supplies: VCCINT (1.5 V core), VCCIO (per bank), VCCPD (pre-drivers), VCCA_PLL (analog PLL) and VCC_CONFIG. Use a power-supply sequencing controller to enforce the VCCINT-before-VCCIO-before-VCCPD order specified in the Stratix Hardware Reference Manual, and provide at least 4 bulk 22 µF tantalum + 100 µF ceramic capacitors plus a 0.1 µF / 0.01 µF decoupling pair per VCC pin cluster. Estimated: at high toggle rates the VCCINT current can exceed 2 A; verify with the Quartus II PowerPlay early-estimate tool before layout.
Three pitfalls repeatedly appear in EP1S25F780I6 designs: (1) leaving configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) floating - tie them per the configuration scheme chosen; (2) forgetting that unused I/O pins must be left unconnected or driven to a known state to avoid leakage on the I/O bank; (3) relying on a single JTAG chain for multi-FPGA boards - plan a star or daisy-chain JTAG topology and provide test access to all devices. Also note that older Quartus II versions do not support the latest service packs; install the matching Quartus II Service Pack on every design workstation.
The 780-ball FBGA uses a thermal slug; place a 5 x 5 array of 12 mil thermal vias under the slug to spread heat into inner ground/power planes. Estimated: at 100 % toggle rate the device can dissipate 3-5 W depending on utilization; in an enclosed industrial enclosure add forced-air cooling or a small heatsink to keep junction temperature below 100 °C. Use the Quartus II PowerPlay thermal model output to size the cooling solution; do not skip this step on production hardware.
규정 준수 정보
RoHS, lead-free and REACH compliance are lot-dependent for the obsolete EP1S25F780I6 and were not confirmed in the verified web data. AEC-Q100 is not applicable (this is a commercial/industrial FPGA). Request a RoHS / lead-free certificate by date code from the distributor before purchase if compliance is required for the end system.
