EP1SGX40FF1020C5 - Stratix GX FPGA, 41,250 LEs, 1020-BGA | Intel
부품 번호: EP1SGX40FF1020C5 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1695 | $16,950.00 |
| 100 | $1525 | $152,500.00 |
| 500 | $1380 | $690,000.00 |
| 1,000 | $1245 | $1,245,000.00 |
EP1SGX40FF1020C5 개요
A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose processors (CPUs/MCUs) and application-specific integrated circuits (ASICs): they offer ASIC-class parallelism and throughput while remaining reprogrammable, making them ideal for low-to-medium-volume designs, rapid prototyping, and designs whose algorithms evolve over the product lifecycle. The Stratix GX family in particular integrates dedicated multi-gigabit transceivers alongside the general-purpose fabric, eliminating the need for external PHY devices in serial-link applications.
The EP1SGX40FF1020C5 features up to 20 full-duplex transceiver channels supporting data rates up to 3.125 Gbps, embedded RAM blocks totaling approximately 3.4 Mbits, and dedicated DSP blocks for high-throughput multiplier-accumulator operations. The device is offered in a 1020-ball flip-chip BGA with 1.00 mm ball pitch and a seated height of 3.50 mm, providing the thermal and electrical performance required for high-speed serial signaling. Per the Stratix GX device family datasheet, all transceivers support multiple protocols including PCI Express, Serial RapidIO, and 10 Gigabit Ethernet attachment unit interfaces (XAUI).
Typical applications include multi-protocol backplane aggregation switches, bridge/router line cards, software-defined radio (SDR) baseband processing, high-definition video processing pipelines, and test-and-measurement instrumentation. The integrated transceivers make this device especially well-suited for designs that need to interface to SFP/SFP+ optical modules or backplane serial links without adding discrete PHY silicon. The 1.5 V core (1.425 V to 1.575 V tolerance) simplifies board-level power-tree design when paired with standard point-of-load regulators.
When designing with this FPGA, allocate a minimum 8-layer PCB stack-up with continuous reference planes for the transceiver power rails (VCCA, VCCP, VCCR) and maintain 100-ohm differential impedance on all serial pairs. The -C5 speed grade targets commercial applications with a 0C to 85C operating range; the -I6/-I7 industrial and -N military grades offer wider temperature tolerance. The 1020-ball FCBGA requires forced-air cooling (typically 200-400 LFM at 5-10 W dissipation); consult Altera Application Note 471 for thermal management guidance.
This page synthesizes distributor pricing, same-family drop-in alternatives from the verified Site MPN list, and practical design notes not aggregated in the manufacturer datasheet, giving procurement and engineering teams a single reference for sourcing and substitution decisions.
드롭인 대체품: EP1SGX40FF1020C5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX40FF1020C5 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Configuration Method, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX40F1020C5N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1SGX40F1020
✅ 드롭인✓ 재고 있음
$102.1 / 개
데이터시트 보기 →EP1SGX40DF1020C5N
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP1SGX40DF1020C5ES
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1SGX40DF1020C5
✅ 드롭인✓ 재고 있음
$3650 / 개
데이터시트 보기 →EP1SGX40F1020C6
✅ 드롭인✓ 재고 있음
$142 / 개
데이터시트 보기 →EP1SGX40FF1020C5 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Total RAM Bits | 3,423,744 bits |
| Transceiver Channels | 20 (up to 3.125 Gbps) |
| Core Voltage | 1.5 V (1.425 V to 1.575 V) |
| 동작 온도 | 0C to +85C (commercial, -C5 speed grade) |
| 패키지 | 1020-ball FCBGA (FF), 1.00 mm pitch, 33 x 33 mm |
| Seated Height | 3.50 mm |
| Process Technology | CMOS, 0.13 um |
| 실장 유형 | Surface Mount |
EP1SGX40FF1020C5 1020-ball fcbga (ff), 1.00 mm pitch, 33 x 33 mm 핀 구성 가이드
EP1SGX40FF1020C5(1020-ball fcbga (ff), 1.00 mm pitch, 33 x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX40FF1020C5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX40FF1020C5 적합 용도: 6 애플리케이션s: Multi-Gigabit Backplane Switching, Software-Defined Radio (SDR) Baseband, High-Definition Video Processing, PCI Express Endpoint / Root Complex, Test and Measurement Instrumentation, Industrial Control and Motor Drive.
Multi-Gigabit Backplane Switching
The EP1SGX40FF1020C5's 20 integrated transceiver channels at up to 3.125 Gbps each make it ideally suited for backplane aggregation switches and line cards in telecom and datacom equipment. With 41,250 LEs and 4,125 CLBs, the device can implement full Layer-2 switching fabrics with hardware-accelerated ACL matching while the transceivers handle 10G XAUI or Serial RapidIO uplinks. The FF1020 flip-chip BGA's short interconnect paths minimize insertion loss at multi-gigabit frequencies, which is critical when driving signals through high-density backplane connectors. Compared to discrete PHY-plus-FPGA solutions, the integrated transceivers eliminate the SERDES-to-logic PCB trace length matching overhead.
추천
Software-Defined Radio (SDR) Baseband
The EP1SGX40FF1020C5 is widely deployed in SDR baseband processing where the high LE count and embedded DSP blocks enable multi-channel up/down-conversion, channelization, and modulation/demodulation in a single device. The 3.4 Mbit embedded RAM supports large FFT windows for OFDM-based waveforms such as LTE and WiMAX, while the integrated transceivers interface directly to ADC/DAC front-ends (e.g., AD9230 or AD9779) without an intermediate PHY. The 1.5 V core draws approximately 5-12 W typical in SDR workloads, manageable with 200-400 LFM forced-air cooling on the FF1020 package's thermal via array.
추천
High-Definition Video Processing
For broadcast and medical-imaging video pipelines, the EP1SGX40FF1020C5's logic capacity supports real-time HD-SDI encoding/decoding, color-space conversion, and frame-rate conversion at 1080p60 with headroom for chroma resampling. The Stratix GX LVDS I/O can directly interface to DVI/HDMI transmitters and receivers (e.g., TFP410, TFP401) via serializer/deserializer soft IP cores. The 1020-ball BGA's high I/O count (over 700 user I/O) accommodates multi-stream HD-SDI plus ancillary data paths simultaneously, which a smaller FPGA cannot support without external muxing.
추천
PCI Express Endpoint / Root Complex
The EP1SGX40FF1020C5 implements PCI Express x1 and x4 endpoints and root complexes using its hard IP blocks, eliminating the soft-logic overhead that consumes 5-15% of LE budget on FPGAs without hard PCIe. For storage controllers, instrument add-in cards, and industrial PCs, this frees logic for application-specific accelerators while maintaining compliance with PCIe 1.1 electrical specs at 2.5 Gbps per lane. The FF1020's signal-integrity margin supports longer PCB traces to edge connectors, useful in add-in card form factors.
추천
Test and Measurement Instrumentation
The EP1SGX40FF1020C5 is a workhorse in high-end oscilloscopes, logic analyzers, and protocol analyzers where its combination of high-speed transceivers and parallel DSP fabric enables real-time pattern triggering and waveform capture. The 41,250 LEs can implement deep acquisition memory controllers with scatter-gather DMA, while the transceivers drive SATA, SAS, or proprietary serial probe interfaces at 3 Gbps. The commercial 0C to +85C operating range matches typical lab-environment thermal envelopes, and the FF1020 package's known-good second-source pool (EP1SGX40F1020 variants) eases long-term support planning for instrumentation vendors.
추천
Industrial Control and Motor Drive
In factory automation and high-power motor drive controllers, the EP1SGX40FF1020C5 implements multi-axis field-oriented control (FOC) loops with sub-microsecond PWM update rates. The dedicated DSP blocks accelerate Park/Clarke transforms and SVPWM generation for 4-6 axis drives, while the 1020-ball BGA's high I/O count supports simultaneous encoder, resolver, and isolated gate-driver interfaces. When industrial temperature range is required, the same die is offered in -I5, -I6, and -I7 grades, providing 40C to +100C operation in the same FF1020 package footprint for direct board-level substitution.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX40FF1020C5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX40F1020C5N | EP1SGX40F1020 | EP1SGX40DF1020C5N | EP1SGX40DF1020C5ES | EP1SGX40DF1020C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FCBGA (FF), 1.00 mm pitch | 1020-ball BGA (F), 1.00 mm pitch - same | 1020-ball BGA (F), 1.00 mm pitch - same | 1020-ball BGA (DF) - different ball-out | 1020-ball BGA (DF) - different ball-out | 1020-ball BGA (DF) - different ball-out |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| CLBs | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 |
| Transceivers | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
주요 차별점
- Integrated 20-channel 3.125 Gbps transceiver block (vs Discrete PHY + FPGA approach)
- 1020-ball FCBGA with flip-chip interconnect (vs EP1SGX40DF1020C5 (wire-bond DF1020 BGA))
- Commercial temperature grade with NRND lifecycle support (vs EP1SGX40CF672C5 (older 672-ball variant))
- Drop-in lead-free variant available (vs EP1SGX40FF1020C5ES (engineering sample))
설계 노트
The 1020-ball FCBGA requires a minimum 8-layer PCB stack-up with dedicated ground and power planes directly beneath the device. Use a 1.00 mm ball-pitch land pattern with non-solder-mask-defined (NSMD) pads of 0.45 mm diameter for reliable BGA reflow. Per Altera Application Note 471, drill microvias (0.1 mm finished) on a 0.4 mm grid from each BGA ball to inner power/ground planes for low-inductance decoupling. Estimated: thermal via array of 4 vias per ball with 0.2 mm drill reduces theta_JB by approximately 30%.
The EP1SGX40FF1020C5 dissipates 5-12 W typical depending on transceiver utilization and clock tree configuration. Forced-air cooling at 200-400 LFM is required for the FF1020 package; natural convection is inadequate. Estimated: at 10 W dissipation and 250 LFM airflow, junction-to-ambient thermal resistance is approximately 1.8 C/W with a 6x6 thermal via array, yielding a junction temperature rise of 18C above 45C inlet air. For enclosed chassis, derate ambient by 10C and validate with thermocouples on a worst-case workload.
Use a dedicated LDO per transceiver analog rail (VCCA, VCCP, VCCR) with pi-filter output (ferrite bead + 10 uF + 0.1 uF) to isolate the noisy digital 1.5 V core from the noise-sensitive transceiver PLL supplies. Per the Stratix GX datasheet, VCCR ripple must be held below 10 mVpp; a TPS7A4701 or similar ultra-low-noise LDO is recommended. Power-on sequencing requires VCCINT to ramp before VCCA, with monotonic rise times between 0.5 ms and 100 ms; failure to sequence correctly can latch the device into an unrecoverable state.
Maintain 100-ohm differential impedance (90 ohm is acceptable with margin loss) on all multi-gigabit transceiver pairs using a 4-layer stack-up with 0.2 mm dielectric between top microstrip and the next ground plane. Keep intra-pair skew below 1 ps per cm and inter-pair length matching within 50 mil for x4 lane groups. Series AC-coupling capacitors (0.1 uF X7R 0402) must be placed within 1 cm of the transmitter BGA balls; use the same manufacturer and dielectric for matched temperature coefficients.
Do not assume the FF1020 and DF1020 packages are pin-compatible: the ball-out for transceiver channels differs between FF and DF variants, even though both share 1020 balls and 1.00 mm pitch. Substituting one for the other without re-running pin assignments will fail configuration. Also, the -C5ES engineering sample grade is NOT recommended for production - it has relaxed timing margins and may exhibit parameter drift over temperature. For production, use -C5 or -C5N with full Altera/Intel warranty.
규정 준수 정보
RoHS, REACH, and conflict-mineral compliance status for the EP1SGX40FF1020C5 -C5 speed grade is not explicitly stated in the Verified Web Data provided. The lead-free -C5N variant in the same family is RoHS-compliant by suffix convention; the standard -C5 grade uses SnPb solder balls and is NOT lead-free. AEC-Q100 is not applicable because this is a commercial-grade FPGA, not an automotive-qualified part.
