EP1SGX40FF1020C5 - Stratix GX FPGA, 41,250 LEs, 1020-BGA | Intel
MPN: EP1SGX40FF1020C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1695 | $16,950.00 |
| 100 | $1525 | $152,500.00 |
| 500 | $1380 | $690,000.00 |
| 1,000 | $1245 | $1,245,000.00 |
Drop-in alternatives for EP1SGX40FF1020C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX40FF1020C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Total RAM Bits | 3,423,744 bits |
| Transceiver Channels | 20 (up to 3.125 Gbps) |
| Core Voltage | 1.5 V (1.425 V to 1.575 V) |
| Operating Temperature | 0C to +85C (commercial, -C5 speed grade) |
| Package | 1020-ball FCBGA (FF), 1.00 mm pitch, 33 x 33 mm |
| Seated Height | 3.50 mm |
| Process Technology | CMOS, 0.13 um |
| Mounting Type | Surface Mount |
EP1SGX40FF1020C5 1020-ball fcbga (ff), 1.00 mm pitch, 33 x 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX40FF1020C5 (1020-ball fcbga (ff), 1.00 mm pitch, 33 x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40FF1020C5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40FF1020C5 is suitable for 6 applications: Multi-Gigabit Backplane Switching, Software-Defined Radio (SDR) Baseband, High-Definition Video Processing, PCI Express Endpoint / Root Complex, Test and Measurement Instrumentation, Industrial Control and Motor Drive.
Multi-Gigabit Backplane Switching
The EP1SGX40FF1020C5's 20 integrated transceiver channels at up to 3.125 Gbps each make it ideally suited for backplane aggregation switches and line cards in telecom and datacom equipment. With 41,250 LEs and 4,125 CLBs, the device can implement full Layer-2 switching fabrics with hardware-accelerated ACL matching while the transceivers handle 10G XAUI or Serial RapidIO uplinks. The FF1020 flip-chip BGA's short interconnect paths minimize insertion loss at multi-gigabit frequencies, which is critical when driving signals through high-density backplane connectors. Compared to discrete PHY-plus-FPGA solutions, the integrated transceivers eliminate the SERDES-to-logic PCB trace length matching overhead.
Recommended
Software-Defined Radio (SDR) Baseband
The EP1SGX40FF1020C5 is widely deployed in SDR baseband processing where the high LE count and embedded DSP blocks enable multi-channel up/down-conversion, channelization, and modulation/demodulation in a single device. The 3.4 Mbit embedded RAM supports large FFT windows for OFDM-based waveforms such as LTE and WiMAX, while the integrated transceivers interface directly to ADC/DAC front-ends (e.g., AD9230 or AD9779) without an intermediate PHY. The 1.5 V core draws approximately 5-12 W typical in SDR workloads, manageable with 200-400 LFM forced-air cooling on the FF1020 package's thermal via array.
Recommended
High-Definition Video Processing
For broadcast and medical-imaging video pipelines, the EP1SGX40FF1020C5's logic capacity supports real-time HD-SDI encoding/decoding, color-space conversion, and frame-rate conversion at 1080p60 with headroom for chroma resampling. The Stratix GX LVDS I/O can directly interface to DVI/HDMI transmitters and receivers (e.g., TFP410, TFP401) via serializer/deserializer soft IP cores. The 1020-ball BGA's high I/O count (over 700 user I/O) accommodates multi-stream HD-SDI plus ancillary data paths simultaneously, which a smaller FPGA cannot support without external muxing.
Recommended
PCI Express Endpoint / Root Complex
The EP1SGX40FF1020C5 implements PCI Express x1 and x4 endpoints and root complexes using its hard IP blocks, eliminating the soft-logic overhead that consumes 5-15% of LE budget on FPGAs without hard PCIe. For storage controllers, instrument add-in cards, and industrial PCs, this frees logic for application-specific accelerators while maintaining compliance with PCIe 1.1 electrical specs at 2.5 Gbps per lane. The FF1020's signal-integrity margin supports longer PCB traces to edge connectors, useful in add-in card form factors.
Recommended
Test and Measurement Instrumentation
The EP1SGX40FF1020C5 is a workhorse in high-end oscilloscopes, logic analyzers, and protocol analyzers where its combination of high-speed transceivers and parallel DSP fabric enables real-time pattern triggering and waveform capture. The 41,250 LEs can implement deep acquisition memory controllers with scatter-gather DMA, while the transceivers drive SATA, SAS, or proprietary serial probe interfaces at 3 Gbps. The commercial 0C to +85C operating range matches typical lab-environment thermal envelopes, and the FF1020 package's known-good second-source pool (EP1SGX40F1020 variants) eases long-term support planning for instrumentation vendors.
Recommended
Industrial Control and Motor Drive
In factory automation and high-power motor drive controllers, the EP1SGX40FF1020C5 implements multi-axis field-oriented control (FOC) loops with sub-microsecond PWM update rates. The dedicated DSP blocks accelerate Park/Clarke transforms and SVPWM generation for 4-6 axis drives, while the 1020-ball BGA's high I/O count supports simultaneous encoder, resolver, and isolated gate-driver interfaces. When industrial temperature range is required, the same die is offered in -I5, -I6, and -I7 grades, providing 40C to +100C operation in the same FF1020 package footprint for direct board-level substitution.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40FF1020C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40F1020C5N | EP1SGX40F1020 | EP1SGX40DF1020C5N | EP1SGX40DF1020C5ES | EP1SGX40DF1020C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FCBGA (FF), 1.00 mm pitch | 1020-ball BGA (F), 1.00 mm pitch - same | 1020-ball BGA (F), 1.00 mm pitch - same | 1020-ball BGA (DF) - different ball-out | 1020-ball BGA (DF) - different ball-out | 1020-ball BGA (DF) - different ball-out |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| CLBs | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 |
| Speed Grade | C5 | C5N (lead-free) | [DATA_NEEDED] | C5N (lead-free) | C5ES (engineering sample) | C5 |
| Transceivers | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
Key Differentiators
- Integrated 20-channel 3.125 Gbps transceiver block (vs Discrete PHY + FPGA approach)
- 1020-ball FCBGA with flip-chip interconnect (vs EP1SGX40DF1020C5 (wire-bond DF1020 BGA))
- Commercial temperature grade with NRND lifecycle support (vs EP1SGX40CF672C5 (older 672-ball variant))
- Drop-in lead-free variant available (vs EP1SGX40FF1020C5ES (engineering sample))
Design Notes
The 1020-ball FCBGA requires a minimum 8-layer PCB stack-up with dedicated ground and power planes directly beneath the device. Use a 1.00 mm ball-pitch land pattern with non-solder-mask-defined (NSMD) pads of 0.45 mm diameter for reliable BGA reflow. Per Altera Application Note 471, drill microvias (0.1 mm finished) on a 0.4 mm grid from each BGA ball to inner power/ground planes for low-inductance decoupling. Estimated: thermal via array of 4 vias per ball with 0.2 mm drill reduces theta_JB by approximately 30%.
The EP1SGX40FF1020C5 dissipates 5-12 W typical depending on transceiver utilization and clock tree configuration. Forced-air cooling at 200-400 LFM is required for the FF1020 package; natural convection is inadequate. Estimated: at 10 W dissipation and 250 LFM airflow, junction-to-ambient thermal resistance is approximately 1.8 C/W with a 6x6 thermal via array, yielding a junction temperature rise of 18C above 45C inlet air. For enclosed chassis, derate ambient by 10C and validate with thermocouples on a worst-case workload.
Use a dedicated LDO per transceiver analog rail (VCCA, VCCP, VCCR) with pi-filter output (ferrite bead + 10 uF + 0.1 uF) to isolate the noisy digital 1.5 V core from the noise-sensitive transceiver PLL supplies. Per the Stratix GX datasheet, VCCR ripple must be held below 10 mVpp; a TPS7A4701 or similar ultra-low-noise LDO is recommended. Power-on sequencing requires VCCINT to ramp before VCCA, with monotonic rise times between 0.5 ms and 100 ms; failure to sequence correctly can latch the device into an unrecoverable state.
Maintain 100-ohm differential impedance (90 ohm is acceptable with margin loss) on all multi-gigabit transceiver pairs using a 4-layer stack-up with 0.2 mm dielectric between top microstrip and the next ground plane. Keep intra-pair skew below 1 ps per cm and inter-pair length matching within 50 mil for x4 lane groups. Series AC-coupling capacitors (0.1 uF X7R 0402) must be placed within 1 cm of the transmitter BGA balls; use the same manufacturer and dielectric for matched temperature coefficients.
Do not assume the FF1020 and DF1020 packages are pin-compatible: the ball-out for transceiver channels differs between FF and DF variants, even though both share 1020 balls and 1.00 mm pitch. Substituting one for the other without re-running pin assignments will fail configuration. Also, the -C5ES engineering sample grade is NOT recommended for production - it has relaxed timing margins and may exhibit parameter drift over temperature. For production, use -C5 or -C5N with full Altera/Intel warranty.
Compliance Information
RoHS, REACH, and conflict-mineral compliance status for the EP1SGX40FF1020C5 -C5 speed grade is not explicitly stated in the Verified Web Data provided. The lead-free -C5N variant in the same family is RoHS-compliant by suffix convention; the standard -C5 grade uses SnPb solder balls and is NOT lead-free. AEC-Q100 is not applicable because this is a commercial-grade FPGA, not an automotive-qualified part.
