EP1SGX40F1020C5N - Stratix GX FPGA 40K LE 3.4Mbit 624 I/O | Intel
MPN: EP1SGX40F1020C5N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $270 | $2,700.00 |
| 100 | $245 | $24,500.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for EP1SGX40F1020C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX40FF1020C5N
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EP1SGX40GF1020C5N
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View Datasheet βEP1SGX40CF1020C5N
β Drop-Inπ Reference alternative (not in catalog)
EP1SGX40DF1020C5N
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View Datasheet βEP1S40F1020C5N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
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β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP1SGX40F1020C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Total Memory Bits | 3,423,744 |
| User I/O Count | 624 |
| Package | 1020-BBGA (FCBGA) |
| Mounting Type | Surface Mount |
| Speed Grade | C5 (commercial) |
| Operating Temperature | 0C to +85C (commercial) |
| Core Voltage | 1.5 V |
| Lead-Free | Yes (N suffix) |
| Configuration Method | JTAG / Passive Serial |
EP1SGX40F1020C5N 1020-bbga (fcbga) Pin Configuration Guide
Complete pinout information for EP1SGX40F1020C5N (1020-bbga (fcbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40F1020C5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40F1020C5N is suitable for 6 applications: Telecom Line Card Aggregation, Multi-Protocol Bridge (PCI Express / RapidIO / GbE / XAUI), ASIC Prototyping and Emulation, SONET/SDH Framer and Mapper, Industrial Imaging and Video Processing, Test and Measurement Instrumentation.
Telecom Line Card Aggregation
The EP1SGX40F1020C5N fits telecom line-card aggregation because its 20 multi-gigabit transceivers (operating 600 Mbps to 3.1875 Gbps per channel) deliver the backplane bandwidth required to terminate multiple SFP/SFP+ optical links simultaneously. With 41,250 logic elements and 3.4 Mbit of embedded RAM, the fabric can implement per-port packet buffers, traffic managers, and SERDES-side PCS logic alongside the aggregation fabric. Placed on a line card, it typically bridges between multiple front-panel SFP cages and a switch-fabric ASIC over standard protocols such as SPI-4.2 or Interlaken. The 1020-BBGA package supports the high pin density of 624 user I/Os and 24 dedicated clock pins required for this role. The C5 commercial speed grade is well-matched to indoor telecom chassis operating at 0C to +85C. Unlike newer Stratix V devices, the EP1SGX40F1020C5N offers a mature tool flow with Quartus II, easing reuse of existing RTL across legacy and new builds.
Recommended
Multi-Protocol Bridge (PCI Express / RapidIO / GbE / XAUI)
The EP1SGX40F1020C5N fits multi-protocol bridging because its integrated transceivers natively support PCI Express (x1, x4), Serial RapidIO, Gigabit Ethernet, and XAUI without external PHYs. The 41,250 logic elements plus embedded memory enable protocol-state machines, DMA engines, and packet processing on a single die, eliminating the need for a companion bridge ASIC. With 624 user I/Os, the device can simultaneously expose host-side parallel interfaces (e.g., local bus or DDR memory) and multiple serial links. The C5 commercial speed grade satisfies throughput targets for these protocols at line rate. Unlike a discrete ASSP bridge, the FPGA implementation can be reconfigured for protocol updates and customer-specific extensions. Pin-compatible EP1SGX40 family variants with higher speed grades (C6, C7) allow headroom for latency-sensitive bridges when the C5 design proves borderline.
Recommended
ASIC Prototyping and Emulation
The EP1SGX40F1020C5N fits ASIC prototyping because 41,250 logic elements map a substantial portion of mid-complexity ASIC RTL, and the 3.4 Mbit of embedded RAM supports register-file and buffer-array emulation. The high I/O count of 624 supports emulating wide on-chip buses by bringing them out to physical pins for visibility. Hardware teams typically partition the ASIC across multiple Stratix GX devices when the design exceeds one FPGA's capacity, using the multi-gigabit transceivers for chip-to-chip emulation links at 3.1875 Gbps. The C5 commercial speed grade provides deterministic timing closure with Quartus II TimeQuest. Unlike modern ASIC prototyping platforms using Stratix 10 or Virtex UltraScale, the EP1SGX40F1020C5N offers a cost-effective entry point for academic and small-team emulation where legacy tool flows are familiar.
Recommended
SONET/SDH Framer and Mapper
The EP1SGX40F1020C5N fits SONET/SDH framer applications because its multi-gigabit transceivers directly interface to OC-48 (2.488 Gbps) and below without external SERDES, and the 41,250 logic elements implement framer, mapper, and pointer-processing state machines in a single device. The 3.4 Mbit of embedded RAM stores payload data and overhead bytes, supporting per-VT/VC buffering at line rate. Placed in the line-interface path, the device receives STS/STM frames from the transceiver, processes section/line/path overhead, and hands off payload to the switch fabric. The C5 speed grade meets STS-48 timing closure. Unlike an off-the-shelf SONET/SDH ASSP, the FPGA implementation can be customized for proprietary mapping schemes or vendor-specific OAM extensions.
Recommended
Industrial Imaging and Video Processing
The EP1SGX40F1020C5N fits industrial imaging and video processing because 41,250 logic elements implement multi-channel image-processing pipelines (filtering, thresholding, edge detection), while 3.4 Mbit of embedded RAM provides line and frame buffers. The 624 user I/Os support parallel Camera Link or LVDS-based image-sensor interfaces, and the transceivers enable high-bandwidth output over CoaXPress or proprietary serial links to downstream processors. With the C5 commercial speed grade and 0C to +85C industrial temperature range, the device suits factory-floor vision systems and machine-inspection cameras. Unlike ASIC image processors, the FPGA implementation supports evolving image-processing algorithms via in-field reconfiguration, valuable during product iteration.
Recommended
Test and Measurement Instrumentation
The EP1SGX40F1020C5N fits test-and-measurement instrumentation because its high-speed transceivers enable protocol-aware pattern generators and BERT (bit-error-rate tester) designs at rates up to 3.1875 Gbps, while 41,250 logic elements implement deep PRBS pattern generators and error counters. The 624 user I/Os support wide parallel capture paths for logic-analyzer-style instruments. The 3.4 Mbit embedded RAM stores captured traces and statistical counters in real time. Placed on a PXI or LXI instrument, the device functions as the pattern-generation and acquisition engine. The C5 commercial speed grade provides deterministic waveform generation. Unlike dedicated BERT ASICs, the FPGA implementation can be reconfigured for new standards or proprietary test patterns, giving test-equipment vendors a flexible platform.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40F1020C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40FF1020C5N | EP1SGX40GF1020C5N | EP1SGX40CF1020C5N | EP1SGX40DF1020C5N | EP1S40F1020C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-BBGA (FCBGA) | 1020-BBGA (FCBGA) - same | 1020-BBGA (FCBGA) - same | 1020-BBGA (FCBGA) - same | 1020-BBGA (FCBGA) - same | 1020-BBGA (FCBGA) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Total Memory Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| User I/O Count | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | C5 | C5 | C5 | C5 | C5 | C5 |
| Integrated Transceivers | Yes (multi-Gbps) | Yes | Yes | Yes | Yes | No (non-GX) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Unit Price (qty 100) | $245 | $245-$260 | $245-$260 | $245-$260 | $245-$260 | $180-$220 (lower due to non-GX) |
Key Differentiators
- Integrated multi-gigabit transceivers in a mid-density FPGA fabric (vs EP1S40F1020C5N (non-GX Stratix))
- Mature Quartus II tool flow with extensive legacy IP library (vs Newer Stratix V/10 devices)
- 624 user I/Os in 1020-BBGA package enables wide parallel + serial interface mix (vs Lower-density EP1SGX25FF1020C5N)
- Cost-effective legacy upgrade path for installed base (vs Newer Cyclone 10 GX or Stratix 10)
Design Notes
The 1020-BBGA FCBGA package requires a multi-layer PCB (8+ layers recommended) with continuous power and ground planes directly under the device to provide high-frequency decoupling and a low-impedance return path for the multi-gigabit transceivers. Use a 1.0 mm or 0.8 mm BGA pitch land pattern per JEDEC MO-192 / MO-260 standards. Via-in-pad (VIP) with epoxy-fill-and-copper-cap is strongly recommended for the inner ball array to improve breakout routing density.
The transceiver channels require strict 100 Ξ© differential (or 50 Ξ© single-ended) controlled-impedance routing with intra-pair length matching under 150 mil and inter-pair matching appropriate to the protocol (typically 4-8 inches for SPI-4.2, tighter for XAUI). Use loss-managed stripline or microstrip with reference planes intact across splits. Reference the Stratix GX Handbook chapter on transceiver PCB design for channel loss budgets (typically <6 dB at 1.25 GHz for SATA-class links).
Estimated: the EP1SGX40F1020C5N draws approximately 1.5-2.5 W quiescent plus dynamic power depending on toggle rate. Core voltage is 1.5 V; PLL analog supply is typically 1.5 V or 2.5 V depending on configuration; I/O banks require 1.5 V, 1.8 V, 2.5 V, or 3.3 V per bank. Use a sequenced power scheme (core first, then I/O) to avoid latch-up. Decoupling per bank: 0.1 Β΅F and 0.01 Β΅F ceramics plus bulk 22 Β΅F or larger tantalum/ceramic. Reference the Stratix GX family pin connection guidelines for the exact power-pin map.
Differential I/O standards (LVDS, LVPECL) on the Stratix GX require per-pin 100 Ξ© termination across the differential pair at the receiver end, or on-die termination enabled in the Quartus II assignment. For SDR or DDR memory interfaces using SSTL/HSTL, use external VTT termination at the memory side and maintain a short stub length. Series-damping resistors (22-33 Ξ©) may be required on heavily loaded clocks.
Common Stratix GX design pitfalls: (1) mixing LVTTL 3.3 V inputs with 2.5 V VCCIO bank without proper level-shifting; (2) failing to instantiate the ALTPLL megafunction correctly, causing jitter excursions; (3) leaving JTAG TCK floating - tie to ground via 1 kΞ© to avoid inadvertent configuration; (4) confusing F1020 (1020-ball FBGA) with C1020 (1020-ball column-grid) package variants which are NOT pin-compatible; (5) using EPCS configuration devices in unsupported voltage modes. Reference AN 347: Stratix GX Design Guidelines for the full checklist.
Compliance Information
Lead-free / Pb-free termination confirmed by 'N' suffix in MPN per Altera/Intel nomenclature. Full RoHS/REACH certificates should be requested from distributor; the original Stratix GX family predates widespread RoHS transition. AEC-Q100 not applicable (commercial/industrial FPGA, not automotive-qualified).
