EP20K1500EBC652-1X - APEX 20KE 1.5M Gates FPGA | Altera | BGA-652
부품 번호: EP20K1500EBC652-1X ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $175 | $175,000.00 |
EP20K1500EBC652-1X 개요
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O blocks into a semiconductor device. APEX 20KE sits within Altera's MultiCore architecture, which integrates look-up table (LUT) logic, embedded system blocks (ESBs) for memory, and product-term blocks in one fabric - this is the first device family marketed as a System-on-a-Programmable-Chip (SOPC) solution, sitting within the broader taxonomy of FPGA -> programmable logic -> digital IC -> semiconductor.
Key features include 3,456 Macros (logic cells), 488 user I/Os, on-chip RAM via embedded system blocks, MultiCore architecture combining LUT and product-term logic, JTAG-based configuration, and 0.22 µm CMOS process technology. The 1.8 V core supply minimizes power consumption while supporting high-speed signal processing in compute-intensive designs. The 652-ball BGA package supports industrial-grade thermal performance and high pin density.
The APEX 20KE architecture integrates PLLs, memory, and logic in a single die, enabling designers to implement complex glue logic, bus interfaces, and DSP functions on one chip. The MultiCore structure allows portions of the fabric to behave as either fine-grained LUT logic or coarse-grained product-term logic, optimizing silicon for mixed control-and-datapath designs.
Typical applications include telecommunications infrastructure, ASIC prototyping, high-speed data acquisition, industrial control systems, and network switching equipment. The 488 I/O count also makes it suitable for legacy interface bridging and high-bandwidth parallel processing.
When designing with this device, ensure proper power-plane decoupling and thermal management for the large BGA - allocate at least 4-layer PCB with dedicated VCCINT and VCCIO planes. Quartus II software is required for synthesis, place-and-route, and timing analysis; design compilations can take significant runtime for full-fabric utilization.
This page synthesizes distributor stock levels, drop-in alternatives within the APEX 20K family, and PCB-layout guidance not consolidated in the manufacturer datasheet.
드롭인 대체품: EP20K1500EBC652-1X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K1500EBC652-1X (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Operating Temperature, Total RAM Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K1500EBC652-2X
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K1500EBC652-2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K1500EBC652-1N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K1500CB652C8ES
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →EP20K1000EBC652-2X
✅ 드롭인✓ 재고 있음
$99 / 개
데이터시트 보기 →EP20K1000EBI652-2
✅ 드롭인✓ 재고 있음
$105 / 개
데이터시트 보기 →EP20K1500EBC652-1X 최대 정격 & 전기적 특성
| Family | APEX 20KE |
| Logic Elements / Cells | 51840 |
| System Gates | 1.5 M |
| Macros | 3456 |
| Total RAM Bits | 442368 |
| User I/O | 488 |
| Propagation Delay | 1.84 ns |
| Internal Frequency | 160 MHz (per digchip) / 400 MHz (per fpgakey) |
| Core Voltage | 1.8 V |
| Process Technology | 0.22 µm CMOS |
| 동작 온도 | 0 °C to +85 °C (commercial) |
| 패키지 | 652-ball BGA (FCBGA / PBGA652) |
| 실장 유형 | Surface Mount |
| Configuration Method | JTAG / SRAM |
| Architecture | MultiCore (LUT + product-term) |
EP20K1500EBC652-1X 652-ball bga (fcbga / pbga652) 핀 구성 가이드
EP20K1500EBC652-1X(652-ball bga (fcbga / pbga652) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K1500EBC652-1X.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K1500EBC652-1X 적합 용도: 6 애플리케이션s: Telecommunications Infrastructure, ASIC Prototyping and Emulation, Industrial Control Systems, High-Speed Data Acquisition, Network Switching Equipment, Legacy Interface Bridging.
Telecommunications Infrastructure
The EP20K1500EBC652-1X's 1.5 M system gates and 488 user I/Os make it well suited for legacy telecommunications infrastructure such as TDM cross-connects, ATM switching fabrics, and protocol-conversion line cards. Its 1.84 ns propagation delay supports high-speed serializer/deserializer bridging and bus-width adaptation. The MultiCore architecture allows LUT logic for datapath and product-term logic for control-plane state machines in one fabric. Placed on the line-card PCB with 1.8 V core and 3.3 V I/O rails, the part replaces multiple discrete CPLDs and ASICs. Designers should note the part is obsolete; existing telecom platforms with 10-20 year lifecycles continue to source it from broker distributors.
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ASIC Prototyping and Emulation
The 51,840 logic elements and 442 Kbits of embedded memory make the EP20K1500EBC652-1X a strong candidate for ASIC and ASSP prototyping and emulation. Engineers map RTL designs onto the MultiCore fabric to validate functionality before committing to mask costs. The 488 I/Os support wide parallel buses for connecting to real-world peripherals and DUT boards. The Quartus II toolchain provides synthesis, place-and-route, and timing analysis. Power consumption scales with utilization; full-fabric designs require multi-layer PCB power planes. As an obsolete part, it remains in service labs maintaining long-running emulation setups for legacy silicon.
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Industrial Control Systems
With 488 user I/Os and on-chip RAM, the EP20K1500EBC652-1X integrates multi-axis motor control, PLC backplane logic, and sensor-fusion glue logic in industrial automation equipment. The product-term blocks efficiently encode Boolean control logic, while LUT blocks implement DSP and PID loops. The 0-85 °C commercial temperature grade suits factory-floor enclosures with controlled climate. PLC and DCS vendors continue to deploy APEX 20KE parts in long-lifecycle machinery, often preferring drop-in replacement over redesign. Broker distributors supply replacement units when field failures occur.
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High-Speed Data Acquisition
The EP20K1500EBC652-1X's 488 I/Os and 442 Kbit embedded memory support multi-channel data-acquisition front-ends, including parallel ADC aggregation, digital downconversion, and FIFO buffering between converters and a host processor. Its 1.84 ns propagation delay allows tight timing closure on parallel LVDS buses. The on-chip ESBs (Embedded System Blocks) configure as dual-port RAM or FIFO without external SRAM. Industrial and scientific data-acquisition vendors use the 652-BGA on PCI/PMC carrier cards. Engineers targeting new boards should consider newer Cyclone IV/V parts; the 1500E remains valid for legacy DAQ modules.
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Network Switching Equipment
The 488 I/O count of the EP20K1500EBC652-1X accommodates high-port-count Ethernet switch backplanes, where the FPGA bridges PHY devices, lookup TCAMs, and management CPUs. The MultiCore fabric processes Layer-2/3 forwarding tables at wire speed using combinational logic and on-chip RAM for queue management. OEMs of legacy enterprise switches retain APEX 20KE parts for service-board replacements. Pin-compatible variants like the EP20K1500EBC652-2X extend product lifecycles when faster timing closure is required. New designs should target Cyclone V SoC or Stratix families for active Intel support.
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Legacy Interface Bridging
The EP20K1500EBC652-1X is widely deployed in legacy interface bridges that translate between ECL/TTL, parallel LVDS, PCI, and VME protocols in test equipment and military systems. Its 488 I/Os accept wide parallel buses without external bus multiplexers, while embedded RAM absorbs protocol skew and rate-matching FIFOs. The 1.8 V core and 3.3 V I/O bank support mixed-voltage legacy interfaces. Test-and-measurement OEMs continue to maintain APEX 20KE designs because PCBs and software are validated for that footprint. Broker channels remain the primary supply source as of 2026-09-07.
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추천 제품 요약
엔지니어링 참조 데이터: EP20K1500EBC652-1X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K1500EBC652-2X | EP20K1500EBC652-2 | EP20K1500EBC652-1N | EP20K1500CB652C8ES | EP20K1000EBC652-2X | EP20K1000EBI652-2 |
|---|---|---|---|---|---|---|---|
| Package | 652-ball BGA (FCBGA) | 652-ball BGA (FCBGA) - same | 652-ball BGA (FCBGA) - same | 652-ball BGA (FCBGA) - same | 652-ball BGA - same | 652-ball BGA (FCBGA) - same | 652-ball BGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20K | APEX 20KE | APEX 20KE |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.0 M | 1.0 M |
| Logic Cells | 51840 | 51840 | 51840 | 51840 | 51840 | ~38400 | ~38400 |
| Speed Grade | -1X | -2X (faster) | -2 (faster) | -1N (same speed, lead-free) | -8 (slower) | -2X (faster) | -2 (faster) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest-density pin-compatible drop-in within APEX 20KE 652-BGA family (vs EP20K1000EBC652-2X)
- Faster speed grade available as drop-in upgrade (vs EP20K1500EBC652-1N)
- First SOPC-integrated FPGA family with MultiCore LUT + product-term fabric (vs EP20K1500CB652C8ES)
설계 노트
The 652-ball BGA package requires at least a 4-layer PCB with dedicated VCCINT (1.8 V) and VCCIO planes to deliver clean power across all balls. Use 0.8 mm or 1.0 mm pitch BGA fanout with via-in-pad or dog-bone fanout; signal layers should be kept clear directly under the BGA for via breakout. Match trace lengths within each I/O bank to within 50 mil for LVDS pairs. Add 0.1 µF and 10 µF decoupling capacitors adjacent to every power ball group, plus bulk capacitors at the voltage-supply entry points. Estimated: thermal dissipation for full-fabric utilization at 1.8 V core can reach 3-5 W; copper pours on top and inner layers help spread heat.
The EP20K1500EBC652-1X at full utilization (51840 cells, ~80% logic, 50% memory) dissipates an estimated 4-5 W on a 4-layer JEDEC board. Junction-to-ambient thermal resistance for the 652-ball FCBGA is approximately 18-22 C/W per Altera APEX 20KE package thermal data, yielding a junction rise of 70-110 C above ambient. Derate clock frequency or gate utilization if ambient exceeds 60 °C. Use thermal vias under the center power balls to a copper heatsink pad on the bottom layer for improved theta_JA. Forced airflow is recommended in enclosed chassis.
Three pitfalls to avoid when designing with EP20K1500EBC652-1X: (1) Do not confuse the APEX 20KE (E-suffix) with the original APEX 20K - the 20KE adds MultiCore architecture and ESBs, but pinouts are largely compatible. (2) Verify the exact MPN suffix (1X vs 1N vs 2 vs 2X) matches your datasheet revision - speed grades and RoHS finishes vary. (3) The legacy Quartus II toolchain (not Quartus Prime) is required; newer tool versions do not support APEX 20KE compilation. Plan firmware validation cycles accordingly.
Place configuration and JTAG pins (TDI, TDO, TMS, TCK, nCONFIG, nSTATUS, CONF_DONE) within easy reach of the configuration EEPROM and JTAG header. Keep JTAG trace lengths under 6 inches and add 10 kΩ pull-ups on nCONFIG and 10 kΩ pull-down on nSTATUS per Altera reference designs. Route global clock inputs to dedicated CLK pins with matched-length traces; skew on global clocks propagates into all logic and memory. Reserve the top-layer copper under the BGA for thermal dissipation.
규정 준수 정보
RoHS status not explicitly stated in verified web data; the -1X suffix may indicate a specific finish variant. All alternatives are obsolete Altera/Intel parts. Compliance data not available from any of the verified distributor pages.
