EP20K200EBC652-3N - APEX 20KE 200K FPGA, 652-BGA | Altera
부품 번호: EP20K200EBC652-3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 250 | $232 | $58,000.00 |
| 500 | $220 | $110,000.00 |
EP20K200EBC652-3N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing via a programmable interconnect of configurable logic blocks (CLBs), embedded memory, and I/O cells. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below ASICs in performance-per-watt. APEX 20KE devices were Altera's first-generation 'system-on-a-programmable-chip' (SOPC) platform, blending LUT and product-term logic to support both datapath-intensive and glue-logic designs in one fabric.
Key features include 832 macrocells, 277 user I/Os in one source entry, 376 programmable I/Os in another source, 652-BGA package, MultiCore™ architecture with embedded memory, LVDS I/O support, and an extended commercial operating temperature grade of 0 °C to 85 °C (TJ). The device supports in-system programming via the Altera Quartus / MAX+plus II toolchain via the IEEE 1149.1 JTAG interface and the passive serial configuration scheme.
This part is engineered for high-density glue-logic integration, telecommunications backplane glue, custom DSP pre-processing, and bus-protocol bridging where ASIC NRE costs cannot be justified. The high I/O count (376 pins) suits memory interfaces and parallel bus architectures, while the 106 Kbit embedded RAM block enables on-chip FIFOs and small lookup tables without external SRAM.
Typical applications include telecom line cards, industrial control, custom DSP pre-processing, multi-protocol bus bridges, and prototyping of ASIC-class logic at moderate unit volumes. When migrating, verify timing closure against the Quartus TimeQuest slow-corner model because the -3 speed grade is the slowest in the APEX 20KE family.
드롭인 대체품: EP20K200EBC652-3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K200EBC652-3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Series, Operating Temperature, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K200EBC652-1X
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$142 / 개
데이터시트 보기 →EP20K200EBC652-2X
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →EP20K200EBC652-3
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP20K200CB652C7ES
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$275 / 개
데이터시트 보기 →EP20K1500EBC652-1X
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP20K200EBC652-3N 최대 정격 & 전기적 특성
| Series | APEX 20KE (APEX-20KE®) |
| Device Family | EP20K200 |
| System Gates | 200,000 |
| Logic Elements / Cells | 8,320 |
| Logic Array Blocks (LABs) | 832 |
| Macrocells | 832 |
| Embedded RAM | 106,496 bits |
| User I/Os (DigiKey listing) | 376 |
| User I/Os (digchip listing) | 277 |
| Propagation Delay | 2.33 ns |
| Internal Frequency (max) | 189 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.71 V to 1.89 V (nominal 1.8 V) |
| I/O Supply (LVDS-capable) | LVDS, 2.5 V referenced (per source variant) |
| 패키지 | 652-ball BGA |
| 실장 유형 | Surface Mount |
| Operating Temperature (TJ) | 0 °C to 85 °C (commercial) |
| Speed Grade | -3 (slowest in APEX 20KE family) |
| Configuration | JTAG (IEEE 1149.1), Passive Serial |
| RoHS 상태 | Compliant |
EP20K200EBC652-3N 652-ball bga 핀 구성 가이드
EP20K200EBC652-3N(652-ball bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K200EBC652-3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K200EBC652-3N 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Glue Logic, Custom DSP Pre-Processing Front-End, Industrial Control and Factory Automation, Multi-Protocol Bus Bridge, Legacy ASIC Prototype and Emulation, Test and Measurement Instrumentation.
Telecommunications Line-Card Glue Logic
The EP20K200EBC652-3N's 200,000 system gates and 376 user I/Os are well-suited to telecom line-card glue-logic consolidation, where parallel bus bridges, framing logic, and protocol converters must coexist in a single fabric. Its LVDS-capable I/O at 2.5 V references backplane SERDES links, while the 106 Kbit embedded RAM supports per-channel FIFOs without external SRAM. The 652-BGA package provides the routing density required for high-pin-count backplane designs, and Quartus Legacy support ensures compatibility with existing APEX 20KE design flows.
추천
Custom DSP Pre-Processing Front-End
In DSP front-end pre-processing, the EP20K200EBC652-3N's 8,320 logic elements and 189 MHz maximum frequency enable FIR filtering, sample-rate conversion, and fixed-point datapath functions ahead of a dedicated DSP or ASIC. The MultiCore™ architecture's product-term logic supports fast arithmetic carry chains, while the embedded RAM blocks implement coefficient storage. This combination gives 2.33 ns propagation delay suitable for sample-rate pipelines in audio and baseband processing subsystems.
추천
Industrial Control and Factory Automation
For industrial control applications, the EP20K200EBC652-3N offers 376 I/Os to interface with parallel PLC backplanes, encoder channels, and discrete I/O modules. Its commercial 0 °C to 85 °C temperature range suits factory-floor enclosures with moderate thermal management. The CMOS 1.8 V core supply reduces power versus legacy 5 V FPGAs, while LVDS I/O ensures noise immunity in electrically noisy industrial environments. The 832 LABs support custom state machines for deterministic machine control.
추천
Multi-Protocol Bus Bridge
Bus-bridging designs (PCI-to-local bus, VME-to-PCI, proprietary protocol converters) benefit from the EP20K200EBC652-3N's combination of high I/O count and embedded memory. The 376 programmable I/Os map to multi-bus interfaces without external transceivers, while the 106 Kbit of RAM implements FIFOs, lookup tables, and protocol state buffers. JTAG configuration via IEEE 1149.1 enables in-field firmware updates for installed bridges, critical for industrial and defense applications.
추천
Legacy ASIC Prototype and Emulation
The EP20K200EBC652-3N is well-suited as a prototype vehicle for ASIC-class designs where NRE cannot yet be justified. Engineers can drop full pre-silicon RTL into the 8,320 logic elements and 106 Kbit RAM to validate architecture before committing to ASIC tape-out. The Quartus Legacy tool flow provides synthesis and timing closure. The -3 speed grade's relaxed timing is actually advantageous at the prototype stage, giving margin against unexpected RTL changes.
추천
Test and Measurement Instrumentation
Test and measurement platforms require custom timing generators, protocol analyzers, and stimulus engines, all of which fit the EP20K200EBC652-3N's fabric. Its 376 I/Os drive parallel stimulus buses, while the embedded RAM captures deep trace buffers. The 189 MHz internal frequency enables high-rate pattern generation. The 652-BGA package's thermal performance suits instruments with moderate cooling, and the 1.8 V core keeps power dissipation manageable in dense PXI/VXI-style modules.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K200EBC652-3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K200EBC652-1X | EP20K200EBC652-2X | EP20K200EBC652-3 | EP20K1500EBC652-1X |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 652-BGA | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 1,500,000 |
| Speed Grade | -3 (slowest) | -1 (fastest) | -2 (mid) | -3 | -1 |
| Core Voltage | 1.8 V (1.71-1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest density in the APEX 20KE family with 652-BGA option (vs EP20K100EBC652-2X)
- Commercial temperature grade with MultiCore™ architecture (vs EP20K200CF484I9N)
- Embedded RAM enables bus-bridge designs without external SRAM (vs EP20K200BC356-3)
설계 노트
Estimated: With 1.8 V core, 376 I/Os at 2.5 V LVDS, and 100% toggle utilization, total power draw can reach 2-3 W for the EP20K200EBC652-3N. Provide a low-noise LDO (e.g., TPS7A4701) for the 1.8 V rail with 10 µF X7R ceramic decoupling at each supply ball and 0.1 µF bypass caps within 5 mm of every power pin. The 652-BGA package's 25 mm × 25 mm footprint requires at least 4-layer PCB with a continuous ground plane beneath the device.
Estimated: The 652-BGA package's θJA is approximately 18 °C/W with a 4-layer JEDEC test board. At 2.5 W dissipation, junction temperature rises 45 °C above ambient, putting the -3 commercial part (rated to 85 °C TJ) at risk in enclosed industrial enclosures above 40 °C ambient. Either derate I/O toggle rate, add heatsinking via thermal via arrays under the exposed die pad, or migrate to the -1 speed grade in an industrial-temperature member.
BGA breakout requires via-in-pad or microvia technology on the 652-BGA's 1.27 mm pitch. Route all 376 user I/Os on inner signal layers with matched-length groups for LVDS pairs (≤ 0.5 mm intra-pair skew). Reference the APEX 20KE hardware design guide for the recommended decoupling capacitor placement and BGA land-pattern dimensions. X-ray inspection is mandatory for solder-joint verification on BGA.
Do not confuse the EP20K200EBC652-3N with the EP20K200EBC652-3 (no 'N' suffix) - both are functionally identical silicon, but the 'N' suffix typically denotes lead-free / RoHS-compliant terminal finish. Also note that two source listings report different user I/O counts (376 vs 277); the 376-Ball BGA silicon supports up to 376 user I/Os, but pinout files may show fewer active I/Os depending on configuration mode. Always trust the Quartus pinout file over generic distributor listings.
규정 준수 정보
Lead-free per 'N' suffix in MPN. RoHS compliance confirmed by DigiKey listing. REACH, halogen-free, and conflict-minerals status not stated by Altera on legacy APEX 20KE family documentation.