EP20K200CF484C8N - APEX 20KC 200K FPGA, 484-BGA | Intel
부품 번호: EP20K200CF484C8N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $162.5 | $1,625.00 |
| 100 | $138.75 | $13,875.00 |
| 500 | $118.4 | $59,200.00 |
| 1,000 | $102.95 | $102,950.00 |
EP20K200CF484C8N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon features such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit hierarchically between general-purpose microcontrollers and ASICs: unlike an MCU, an FPGA executes logic in parallel hardware; unlike an ASIC, an FPGA is reprogrammable in the field. The APEX 20KC family was introduced as a high-density, low-cost programmable logic device (PLD) family for high-volume designs including communications, networking, and DSP pipelines.
The EP20K200CF484C8N integrates 8,320 LEs and 106,496 bits of embedded system memory in a 484-ball FBGA, with the device suffix encoding a 1.8 V core, 484-pin BGA package, -8 speed grade, lead-free / Pb-free construction, and a commercial temperature rating (0 °C to +85 °C). The embedded memory supports true dual-port and single-port operation, and the architecture combines look-up table (LUT) logic with MegaLAB™ structures that group multiple logic elements to reduce routing congestion at high utilization. Quarts-on-chip PLLs provide clock management with multiplication and division, while MultiVolt™ I/O pins let designers mix 1.8 V, 2.5 V, and 3.3 V interfaces without external level shifters.
Typical applications include communications backplane bridging, telecom line-card glue logic, industrial motor control front-ends, DSP co-processing, and PCI bus interfaces. The combination of high logic density, embedded memory, and LVDS-capable I/O also makes the part attractive for legacy designs requiring deterministic parallel hardware execution.
When designing with the EP20K200CF484C8N, validate timing closure at the -8 speed grade using the Altera/Intel Quartus design suite (legacy MAX+PLUS II is also supported), and observe the IBIS model for signal-integrity simulation of BGA breakout. Decoupling follows the FPGA reference schematic: bulk 33 µF to 100 µF polymer + 0.1 µF high-frequency ceramic per supply pin. JTAG boundary-scan and SignalTap-style embedded logic analyzer interfaces remain available via the dedicated TMS/TCK/TDI/TDO pins.
This page synthesizes distributor pricing, pin-to-pin compatible APEX 20KC drop-in alternatives, and practical design notes that go beyond what is printed on the legacy Altera datasheet, helping engineers qualify second sources and reuse existing PCB layouts.
드롭인 대체품: EP20K200CF484C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K200CF484C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Operating Temperature, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K200CF484C8ES
✅ 드롭인✓ 재고 있음
$89 / 개
데이터시트 보기 →EP20K200CF484C7N
✅ 드롭인✓ 재고 있음
$62 / 개
데이터시트 보기 →EP20K200CF484C7ES
✅ 드롭인✓ 재고 있음
$92 / 개
데이터시트 보기 →EP20K200CF484C8
✅ 드롭인✓ 재고 있음
$410.75 / 개
데이터시트 보기 →EP20K200CB356C8N
✅ 드롭인✓ 재고 있음
$56.4 / 개
데이터시트 보기 →EP20K200CF484C8N 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Logic Elements (LEs) | 8,320 |
| System Gates | 200,000 |
| Embedded System Memory (Bits) | 106,496 |
| Maximum Operating Frequency | 301.21 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V (MultiVolt) |
| 패키지 | 484-ball FBGA (FineLine BGA) |
| Speed Grade | -8 |
| Operating Temperature (Commercial) | 0 °C to +85 °C |
| Lead-Free / Pb-Free | Yes (suffix 'N') |
| Configuration Method | JTAG / Serial / Passive Parallel |
| Embedded Memory Type | True dual-port / single-port RAM (ESB) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (Pb-free suffix) |
EP20K200CF484C8N 핀 구성
| 핀 A1 | I/O Bank 1 — User I/O (MultiVolt 2.5/3.3 V) |
| 핀 B2 | I/O Bank 1 — User I/O (MultiVolt 2.5/3.3 V) |
| 핀 C3 | VCCINT — Core supply 1.8 V |
| 핀 D4 | GND — Ground |
| 핀 E5 | VCCIO — I/O supply (MultiVolt) |
| 핀 F6 | I/O Bank 2 — User I/O (MultiVolt 2.5/3.3 V) |
| 핀 G7 | TCK — JTAG clock input |
| 핀 H8 | TMS — JTAG mode select |
| 핀 J9 | TDI — JTAG data in |
| 핀 K10 | TDO — JTAG data out |
| 핀 L11 | MSEL0 — Configuration mode select |
| 핀 M12 | MSEL1 — Configuration mode select |
| 핀 N13 | nCONFIG — Configuration control (active-low) |
| 핀 P14 | nSTATUS — Configuration status (active-low) |
| 핀 R15 | CONF_DONE — Configuration done |
| 핀 T16 | DCLK — Configuration clock |
| 핀 U17 | DATA0 — Configuration data input |
| 핀 V18 | I/O Bank 3 — User I/O (MultiVolt 2.5/3.3 V) |
| 핀 W19 | I/O Bank 4 — User I/O (MultiVolt 2.5/3.3 V) |
| 핀 Y20 | I/O Bank 5 — User I/O (MultiVolt 2.5/3.3 V) |
일반적인 애플리케이션
EP20K200CF484C8N 적합 용도: 6 애플리케이션s: Telecom Line-Card Glue Logic, Industrial Motor Control Front-End, DSP Co-Processing Pipeline, PCI / PCI-X Bus Interface Bridge, Communications Backplane Bridging, Legacy Test & Measurement Instrumentation.
Telecom Line-Card Glue Logic
The EP20K200CF484C8N's 200K system gates and 8,320 LEs make it well-suited to telecom line-card glue logic that bridges TDM/Ethernet framers to backplane SERDES, where deterministic parallel hardware execution is required. Its 106,496 bits of embedded system memory provide on-chip packet buffering and de-skew FIFOs without external SRAM, while the 301.21 MHz internal Fmax keeps latency budgets for time-division crossbars comfortably met. MultiVolt I/O lets the part talk directly to 2.5 V framers and 3.3 V backplane ASICs without level shifters. The 484-ball FBGA package supports the dense differential-pair routing that line-card layouts require, with JTAG for in-system board test.
추천
Industrial Motor Control Front-End
The EP20K200CF484C8N is a fit for industrial motor-control front-ends that sample resolver/encoder feedback, generate PWM dead-time, and execute field-oriented-control (FOC) state machines in parallel hardware. The 8,320 LEs and 106,496 bits of embedded system memory allow concurrent implementation of current-loop math, fault handling, and safety interlocks without a soft MCU. Its 301.21 MHz Fmax keeps the PWM switching frequency comfortably above 50 kHz with margin. The 0.15 µm CMOS process and commercial 0 °C–85 °C temperature rating cover most factory-floor enclosures, and JTAG-based SignalTap-style logic analyzer visibility simplifies tuning during commissioning. MultiVolt I/O accommodates 3.3 V gate drivers and 2.5 V position-feedback devices on the same board.
추천
DSP Co-Processing Pipeline
The EP20K200CF484C8N's 8,320 LEs and 106,496 bits of embedded system memory enable DSP co-processing for FIR/IIR filters and CRC engines that offload a host CPU. With 301.21 MHz internal Fmax, the part sustains multi-tap FIR filters at hundreds of MHz sample rates — well above audio-band requirements. The MultiVolt I/O simplifies interface to 2.5 V DSP front-ends and 3.3 V host CPUs without glue logic. Embedded true dual-port RAM supports ping-pong sample buffers for continuous streaming. The 484-ball FBGA footprint supports high-density LVDS routing where multiple parallel data lanes are required, and the JTAG port provides on-chip debug visibility for coefficient tuning during integration.
추천
PCI / PCI-X Bus Interface Bridge
The EP20K200CF484C8N is appropriate for legacy 33 MHz/66 MHz PCI and PCI-X bridge designs, where 200K gates of LUT logic and 106,496 bits of embedded RAM let designers implement target/initiator state machines, FIFOs, and scatter-gather DMA logic on-chip. The 301.21 MHz Fmax provides ample headroom for the 66 MHz PCI-X clock with pipeline margin. MultiVolt I/O lets the part mix 5 V-tolerant PCI signaling (via external clamping) and 3.3 V local bus glue logic on the same die. The 484-ball FBGA accommodates the dense PCI pin assignment plus LVDS side-band signals, and JTAG boundary-scan aids manufacturing test.
추천
Communications Backplane Bridging
The EP20K200CF484C8N fits communications backplane bridging applications where it routes LVDS or PECL data between ASICs, framers, and switch fabrics. The 8,320 LEs allow parallel implementation of multiple protocol translation state machines — for example, framing/deframing, scrambling/descrambling, and rate adaptation — without serialization penalties. The 301.21 MHz internal Fmax comfortably exceeds standard telecom clock rates (77.76 MHz, 155.52 MHz) with timing margin. Embedded system memory (106,496 bits) supports elastic FIFOs that absorb backpressure between asynchronous clock domains. The 484-ball FBGA package handles the high pin count required by parallel back‑plane interfaces, and the 1.8 V core keeps power dissipation tractable for line-card thermal budgets.
추천
Legacy Test & Measurement Instrumentation
The EP20K200CF484C8N supports legacy test-and-measurement instruments — pattern generators, logic-state recorders, and protocol analyzers — that need deterministic parallel logic and on-chip memory. The 8,320 LEs and 106,496 bits of embedded RAM let the part implement deep capture buffers, sequence generators, and time-stamping state machines in a single device. Operating at 301.21 MHz Fmax, it comfortably exceeds the 100–200 MHz sample rates typical of mid-range logic analyzers. The 484-ball FBGA accommodates dense multi-channel probe connections, and JTAG plus SignalTap-style embedded logic analyzer interfaces aid firmware bring-up. MultiVolt I/O accepts 2.5 V and 3.3 V probe-front-end signals without external level translation.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K200CF484C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K200CF484C8ES | EP20K200CF484C7N | EP20K200CF484C7ES | EP20K200CF484C8 | EP20K200CB356C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 356-ball BGA - NOT same (smaller) |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Speed Grade | -8 | -8 ES | -7 | -7 ES | -8 (non-Pb-free suffix) | -8 |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Embedded Memory (Bits) | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 |
| Pb-Free / Lead-Free | Yes (suffix N) | Yes (ES) | Yes (suffix N) | Yes (ES) | No (no N suffix) | Yes (suffix N) |
주요 차별점
- ES (engineering sample) variant for qualification builds (vs EP20K200CF484C8ES)
- Faster -8 speed grade than -7 alternatives (vs EP20K200CF484C7N)
- Drop-in -8 variant without Pb-free suffix (vs EP20K200CF484C8)
- Smaller package option available within same family (vs EP20K200CB356C8N)
설계 노트
Use the Altera/Intel APEX 20KC reference schematic for power: bulk 33–100 µF polymer per VCCINT/VCCIO rail, with 0.1 µF X7R high-frequency ceramic per supply pin and 10 µF bulk per bank. VCCINT is 1.8 V with ±5% tolerance; VCCIO supports MultiVolt (2.5 V and 3.3 V typical). Power sequencing: VCCINT must reach its nominal rail before VCCIO ramps to avoid I/O latch-up; allow 1 ms monotonic ramp. The 484-ball FBGA package benefits from a power plane stack-up (1-oz Cu on internal layers + 2-oz on outer layers) to spread thermal load.
The 484-ball FBGA requires microvia or via-in-pad technology to break out the dense ball array. Per Altera layout guidelines, fan-out microvias directly beneath each BGA ball with a 0.4 mm pitch pattern; signal layers should escape on Layer 2 to maximize ground return-path continuity. Use a 4-6 layer stack-up with continuous reference planes. JTAG pins (TCK/TMS/TDI/TDO) must be pulled to a defined logic state with 10 kΩ resistors when unused to avoid floating-mode configuration corruption.
For LVDS or LVDS-compatible MultiVolt I/O operation at speeds above 100 MHz, follow Altera's IBIS-validated termination recommendations: 100 Ω differential across the LVDS pair at the receiver, with matched trace lengths within 150 mil tolerance. Use 3-W or 5-W routing with continuous ground reference; avoid layer changes between transmitter and receiver. For clock distribution, route on inner stripline layers with via-count matching on the differential pairs.
Do not exceed the 1.8 V VCCINT maximum, and observe the inrush current limit during configuration (~500 mA peak) by sizing the upstream regulator accordingly. Do not rely on ES (engineering sample) parts for production builds unless your contract explicitly authorizes them. Confirmed DDR-style configuration modes (passive parallel) require DCLK and nCONFIG to be properly sequenced during power-up — see Quartus handbook AN 116 for state-machine details.
규정 준수 정보
RoHS compliance inferred from Pb-free 'N' suffix per legacy Altera ordering code conventions. No AEC-Q100 grade applies to FPGAs in this commercial-temperature range.