Altera

EP20K400FI784-2 - 400K Gate APEX 20K FPGA, 784-BGA | Altera

부품 번호: EP20K400FI784-2 ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
2.5 V Vdss S-PBGA-B784 (FineLine BGA) Package -2 Speed SRAM-based (volatile) Memory
시작가 $82.4 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-07
볼륨 가격
수량 단가 합계
1 $145 $145.00
10 $128.5 $1,285.00
100 $108.75 $10,875.00
250 $95.2 $23,800.00
500 $82.4 $41,200.00
ℹ️ 모든 가격은 USD 기준입니다

EP20K400FI784-2 개요

The Altera EP20K400FI784-2 is a member of the APEX 20K family of programmable logic devices (PLDs), delivering approximately 400,000 typical gates in a 784-ball FineLine BGA package. Operating from a nominal 2.5 V core supply (2.375 V min, 2.625 V max) and supporting industrial-grade -40 °C to +100 °C temperatures, the device integrates embedded system blocks (ESBs) for memory and arithmetic functions alongside a look-up-table (LUT)-based logic fabric. The FineLine BGA-784 package has a 1.000 mm ball pitch and is supplied in a Speed Grade -2 variant (tuned timing closure).

드롭인 대체품: EP20K400FI784-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP20K400FI784-2 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Speed Grade, Package, Logic Elements, Family.

Altera
Package: 784-ball PBGA (FC784)
Family: APEX 20K
비교 대상: EP20K400FI784-2 →
Altera
Process Technology: 0.22 µm CMOS SRAM
Speed Grade: -2 (industrial)
Package: 784-Ball FineLine BGA (FC)
비교 대상: EP20K400FI784-2 →
Intel
Process Technology: 0.18 µm CMOS
Speed Grade: -3
Package: 784-ball FineLine BGA (FC)
비교 대상: EP20K400FI784-2 →
Altera
Process Technology: 0.18 µm CMOS, 6-layer metal
Logic Elements: 1,560
Family: APEX 20K
비교 대상: EP20K400FI784-2 →
Intel
Process Technology: 0.18 µm CMOS SRAM
Speed Grade: -3 (slowest)
Package: 784-ball PBGA (Fine-pitch BGA)
비교 대상: EP20K400FI784-2 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP20K400FI784-1

✅ 드롭인
Altera
📦 FineLine BGA-784 (S-PBGA-B784)
APEX 20K · EP20K400 · Loadable PLD (FPGA-class) · 400,000 · 1,560 · 212,992 bits · 488 · 6.1 GHz

✓ 재고 있음

$175 / 개

데이터시트 보기 →

EP20K400FC784-2

✅ 드롭인
Altera
📦 FineLine BGA-784 (S-PBGA-B784)
APEX 20K · EP20K400C · 400,000 · 488 (784-BGA) · 16,640 · 212 Kbits

✓ 재고 있음

$175 / 개

데이터시트 보기 →

EP20K400FC784-3

✅ 드롭인
Intel
📦 FineLine BGA-784 (S-PBGA-B784)
APEX 20K (MultiCore) · 400,000 · 1,052,000 · 21,168 · 212,992 · 100 · 4 · 488

✓ 재고 있음

$175 / 개

데이터시트 보기 →

EP20K400FC784-1

✅ 드롭인
Altera
📦 FineLine BGA-784 (S-PBGA-B784)
APEX 20K · 400,000 gates (typical) · 212 Kbits · 6.1 GHz · 2.5 V · 2.375 V to 2.625 V · 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) · 4

✓ 재고 있음

$92 / 개

데이터시트 보기 →
ℹ️ 1 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.

EP20K400FI784-2 최대 정격 & 전기적 특성

Device Family APEX 20K
Typical Gates 400,000
Dedicated Inputs 4
Nominal Core Supply Voltage (VCCINT) 2.5 V
VCCINT Range 2.375 V to 2.625 V
Speed Grade -2
동작 온도 범위 -40 °C to +100 °C
Package Type S-PBGA-B784 (FineLine BGA)
Package Pin Count 784 balls
Ball Pitch 1.000 mm
실장 유형 Surface Mount
Device Form Factor Loadable PLD
Configuration Memory SRAM-based (volatile)

EP20K400FI784-2 784 balls 핀 구성 가이드

EP20K400FI784-2(784 balls 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP20K400FI784-2의 784 balls 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP20K400FI784-2.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP20K400FI784-2 적합 용도: 6 애플리케이션s: Telecom Backplane Glue Logic, Industrial Control and Factory Automation, Legacy ASIC Replacement, Medical Imaging Data Aggregation, Test and Measurement Instrumentation, Legacy Networking Line Cards.

🌐

Telecom Backplane Glue Logic

The EP20K400FI784-2 fits telecom backplane glue-logic designs where approximately 400K gates are needed to bridge bus protocols, perform CRC/framing, and aggregate low-speed control planes. Its 784-ball BGA provides abundant user I/O for 32-bit or 64-bit parallel buses, while the industrial -40 to +100 °C range tolerates uncontrolled cabinet temperatures. Designers typically instantiate multiple LVTTL/LVCMOS I/O banks and use the embedded system blocks (ESBs) as small FIFOs or parity RAM.

🏭

Industrial Control and Factory Automation

Factory automation controllers benefit from the EP20K400FI784-2's combination of approximately 400K gates, embedded RAM for fast look-up tables, and industrial-grade temperature tolerance. Engineers use the APEX 20K device to implement deterministic state machines, encoder/decoder logic for fieldbus protocols, and safety interlocks. The FineLine BGA-784 with 1.0 mm pitch requires a 6+ layer PCB with microvias, which is standard for industrial controller mainboards already designed for high-density BGA logic.

✈️

Legacy ASIC Replacement

The EP20K400FI784-2 is widely used to replace obsolete ASICs in long-lifecycle programs such as avionics retrofit, military radio, and railway signaling. With approximately 400K gates, designers port netlists from gate-level ASIC tools into Quartus II, preserving logic equivalence while gaining supply-chain resilience. The 2.5 V VCCINT matches older ASIC rails, simplifying power-tree reuse, and the 784-ball BGA offers sufficient I/O for wide memory buses (SRAM, FIFO) common in legacy designs.

💊

Medical Imaging Data Aggregation

Medical imaging carts and bedside monitors use the EP20K400FI784-2 to aggregate multiple sensor streams (CCD/CMOS imagers, ultrasound probes) before forwarding compressed data over USB or Ethernet. The APEX 20K's ESB blocks provide fast dual-port RAM for line buffering, while the LUT fabric performs lossless compression and packetization. The industrial temperature range accommodates equipment that warms during continuous imaging. Note: medical safety certification requires additional system-level design; this part is not AEC-Q100 qualified.

🔧

Test and Measurement Instrumentation

Test and measurement instruments (oscilloscope digitizers, logic analyzers, protocol exercisers) leverage the EP20K400FI784-2 for pattern generation, custom triggering, and high-speed serial protocol decoding. With approximately 400K gates the device can implement parallel data acquisition state machines alongside protocol-aware search engines. The 784-ball FineLine BGA delivers enough user I/O to interface with multi-channel ADC front ends at rates up to 200 MHz when paired with external clock management.

🌐

Legacy Networking Line Cards

Multi-service edge routers and SDH/SONET line cards deployed in the early 2000s use the EP20K400FI784-2 for cell/packet processing, traffic shaping, and overhead processing. Although modern designs use newer Cyclone or Stratix families, the part remains in service for backward-compatible line-card spares. The 2.5 V VCCINT and 784-ball BGA match existing line-card PCB artwork, allowing direct swap into legacy platforms without re-spin.

What is the EP20K400FI784-2?
The EP20K400FI784-2 is an Altera APEX 20K series FPGA delivering roughly 400,000 typical gates in a 784-ball FineLine BGA package. It uses a 2.5 V core supply and operates across -40 °C to +100 °C. According to the APEX 20K datasheet, the device combines LUT-based logic with embedded system blocks (ESBs) that provide RAM, ROM, and product-term functions, targeting high-density data-path and glue-logic designs.
What is the core supply voltage of the EP20K400FI784-2?
The EP20K400FI784-2 operates from a nominal 2.5 V core supply (VCCINT), with a permitted range of 2.375 V to 2.625 V. The APEX 20K datasheet specifies this range to support SRAM-based configuration cells and 4-input LUTs. Designs must use a low-noise regulator with adequate decoupling; recommended bulk is 100 µF tantalum plus 0.1 µF ceramics close to each VCCINT pin group.
What package does the EP20K400FI784-2 use?
The EP20K400FI784-2 ships in a 784-ball FineLine BGA (JEDEC code S-PBGA-B784) with 1.000 mm ball pitch. The package body is square with perimeter ball rows and a partial/full depopulation of the interior for signal escape. Designers must use a multilayer PCB with microvia or via-in-pad technology to fan out the 1.0 mm pitch BGA reliably.
What is the temperature range of the EP20K400FI784-2?
The EP20K400FI784-2 supports industrial-grade operation from -40 °C to +100 °C junction temperature. The 'I' in the device suffix denotes industrial range, while the 'F' indicates the FineLine BGA package and '784' the ball count. This makes it suitable for uncontrolled-environment deployments such as outdoor telecom, factory automation, and ruggedized embedded systems.
Is the EP20K400FI784-2 still in production?
The EP20K400FI784-2 is listed as obsolete by Altera (now part of Intel). The APEX 20K family reached end-of-life many years ago and Intel recommends migrating to Cyclone, Stratix, or Arria series FPGAs. As of 2026-09-08, only limited distributor and broker stock remains; long-term designs should plan for last-time-buy replacement or design re-spin.
Where can I buy the EP20K400FI784-2?
As of 2026-09-08, the EP20K400FI784-2 is available through brokers and obsolete-component distributors including Jotrin Electronics, MicrochipUSA, Corphita, and Digiode, plus spot stock on Octopart and eBay. XAIPART also lists current inventory with lead-time quotes. Pricing is volatile because the part is obsolete; request a quote for current unit price and minimum-order quantity.
What is the price of the EP20K400FI784-2?
The EP20K400FI784-2 lists at roughly USD 145 per unit at qty 1, USD 108.75 at qty 100, and USD 82.40 at qty 500 as of 2026-09-08. Because the part is obsolete, pricing fluctuates with broker availability and lot quality. Always confirm RoHS/lead-free status, date code, and traceability before procurement for production builds.
What is the lead time for the EP20K400FI784-2?
Lead time for the obsolete EP20K400FI784-2 is typically 4-12 weeks as of 2026-09-08, depending on lot size and traceability requirements. Authorized distributors no longer stock new parts, so most supply flows through independent brokers who source from decommissioned equipment and factory overstock. XAIPART can provide a current lead-time quote on request.
What is the difference between the EP20K400FI784-2 and EP20K400FI784-1?
The EP20K400FI784-2 is the speed grade -2 (slower) version, while the EP20K400FI784-1 is the speed grade -1 (faster) version. Both share the same 784-ball FineLine BGA, 2.5 V core supply, and 400K-gate APEX 20K architecture. The -1 grade offers tighter timing at the cost of higher power consumption; the -2 grade is preferred for lower-power or relaxed-timing designs.
What is the best drop-in replacement for the EP20K400FI784-2?
The best drop-in alternative is another APEX 20K family member in the same 784-ball BGA package, such as EP20K400FI784-1 (same package, faster speed grade). Cross-brand drop-in replacements in the identical 784-ball BGA are not available because the ball map is Altera-proprietary. For new designs, consider migrating to an Intel Cyclone 10 or Cyclone IV GX in a compatible footprint - but expect PCB rework.
Where can I download the EP20K400FI784-2 datasheet PDF?
The official Altera APEX 20K datasheet is available from Mouser at https://www.mouser.com/datasheet/2/612/apex-1299388.pdf and was mirrored on Alldatasheet at https://www.alldatasheet.com/datasheet-pdf/pdf/170338/ALTERA/EP20K400.html. The document describes ESB architecture, I/O standards, configuration modes, and package thermal data for the entire APEX 20K family, including the EP20K400FI784-2.
What are the key specifications engineers should know about the EP20K400FI784-2?
Key EP20K400FI784-2 specifications: approximately 400,000 typical gates, 2.5 V VCCINT (range 2.375-2.625 V), 4 dedicated inputs, 784-ball FineLine BGA with 1.000 mm pitch, industrial -40 °C to +100 °C operating range, and speed grade -2. The device is part of the APEX 20K PLD family featuring embedded system blocks (ESBs) for RAM/ROM and product-term functions, with SRAM-based volatile configuration.
Is the EP20K400FI784-2 pin-compatible with EP20K400FI672-2?
No, the EP20K400FI784-2 (784-ball BGA) is not pin-compatible with EP20K400FI672-2 (672-ball BGA). Although both belong to the APEX 20K family with the same 2.5 V core and similar logic capacity, the smaller 672-ball package removes 112 balls and re-routes the periphery. Migrating between them requires PCB redesign; only parts in the same 784-ball BGA can serve as drop-in replacements.
What is the configuration method for the EP20K400FI784-2?
The EP20K400FI784-2 uses SRAM-based volatile configuration loaded at power-up via Altera's passive serial (PS), active serial (AS), or JTAG modes. Configuration bitstream is typically held in a serial configuration PROM such as the EPC2 or EPC16. Designers must include a valid configuration source; without it the device remains unconfigured and all I/O pins stay tri-stated.

엔지니어링 참조 데이터: EP20K400FI784-2 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP20K400FI784-2 when you need an industrial-temperature APEX 20K FPGA with approximately 400K gates in the 784-ball FineLine BGA, and timing closure is feasible at speed grade -2. If timing is tight, drop in EP20K400FI784-1 (faster) without PCB changes. If the deployment is climate-controlled, use EP20K400FC784-2 (commercial temp) for lower cost and better availability. For lowest power and slowest timing, EP20K400FC784-3 is acceptable. None of these alternatives are recommended for new designs - migrate to Intel Cyclone 10 LP or Cyclone IV E for active supply. Note that all 784-ball BGA APEX 20K parts are obsolete and limited to broker stock.

대체품과의 비교

파라미터 이 제품 EP20K400FI784-1 EP20K400FC784-2 EP20K400FC784-3 EP20K400FC784-1
Brand Altera Altera Altera Altera Altera
Package FineLine BGA-784 (S-PBGA-B784, 1.0 mm pitch) FineLine BGA-784 (same) FineLine BGA-784 (same) FineLine BGA-784 (same) FineLine BGA-784 (same)
Typical Gates 400,000 400,000 400,000 400,000 400,000
Speed Grade -2 (mid) -1 (fastest) -2 (mid) -3 (slowest) -1 (fastest)
Temperature Range -40 °C to +100 °C (industrial) -40 °C to +100 °C (industrial) 0 °C to +70 °C (commercial) 0 °C to +70 °C (commercial) 0 °C to +70 °C (commercial)
Core Voltage (VCCINT) 2.5 V nominal (2.375-2.625 V) 2.5 V nominal (same) 2.5 V nominal (same) 2.5 V nominal (same) 2.5 V nominal (same)
Dedicated Inputs 4 4 4 4 4
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete

주요 차별점

  • Speed grade -2 offers better timing margin vs -3 for moderate-speed designs (vs EP20K400FC784-3)
  • Industrial temperature range supports harsh-environment deployment (vs EP20K400FC784-2 (commercial))
  • Same 784-ball BGA as speed-grade -1 enables drop-in performance upgrade (vs EP20K400FI784-1)

설계 노트

The APEX 20K core requires a tightly regulated 2.5 V supply (range 2.375-2.625 V). Use a low-dropout regulator such as a TPS7A4533 followed by a ferrite bead network feeding the VCCINT pins. Place 100 µF tantalum bulk plus 0.1 µF X7R ceramic bypass capacitors within 100 mil of each VCCINT pin group; APEX 20K power integrity is sensitive to simultaneous switching noise on the parallel core rails.

Although APEX 20K static power is modest, dynamic power scales with toggle rate and can push junction temperatures high in dense designs. The 784-ball FineLine BGA uses a thermal-enhanced lid; thermal pad must be soldered to a flooded copper plane on the top PCB layer with thermal vias to inner ground planes. Derate to 70 percent of rated I/O toggle rate if ambient exceeds 70 °C.

The 1.000 mm pitch FineLine BGA-784 requires a multilayer PCB (at least 6 layers) with microvia or via-in-pad technology to fan out the interior balls. Use 4-mil line/space on outer layers and 1 oz copper inner planes. Follow the APEX 20K package-out reference design from Altera for breakout patterns - non-standard escape routing causes signal-integrity failures on LVDS and SSTL pairs.

Estimated: configuration PROMs must be sized for compressed bitstreams. EP20K400 compressed bitstreams typically fit in an EPC2 (2 Mbit) but only marginally - leave 30 percent headroom. A common pitfall is forgetting nCONFIG or nSTATUS pull-up resistors; if omitted the device fails to enter user mode and stays tri-stated. Always verify JTAG IDCODE before mass production to catch counterfeit or remarked parts.

Use series termination on all LVTTL outputs driving traces longer than 1 inch to match the APEX 20K I/O impedance of approximately 50 ohms. For SSTL2/SSTL3 memory interfaces, route clock and DQS to within 50 mil of matching length to avoid setup/hold violations. Do not share VCCIO banks between 3.3 V LVCMOS and 2.5 V SSTL - this is a frequent board-spin cause.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

RoHS/REACH compliance not verified in provided web data; APEX 20K family predates many modern compliance requirements. AEC-Q100 is not applicable (FPGA, not automotive-grade qualified). For new automotive designs, do not select this part.

데이터 검증일: 2026-09-08 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EP20K400FI784-2 EP20K400FI784-2 datasheet Altera APEX 20K 400K gates Altera EP20K400 BGA-784 EP20K400FI784-2 obsolete replacement EP20K400FI784-2 buy price stock APEX 20K FPGA FineLine BGA 1.0mm pitch EP20K400 vs EP20K200 Altera EP20K400FI784-2 configuration PROM EPC2 Altera APEX 20K industrial temperature FPGA what is the operating voltage of EP20K400FI784-2 EP20K400FI784-2 lead time quote

관련 부품 & 용어

Altera Intel EP20K400FI784-2 EP20K400FI784-1 EP20K400FC784-2 EP20K400FC784-3 EP20K400FC784-1 APEX 20K FPGA Programmable Logic Device (PLD) FineLine BGA BGA-784 S-PBGA-B784 Embedded System Block (ESB) Look-Up Table (LUT) VCCINT EPC2 EPC16 JTAG SRAM configuration industrial temperature range speed grade RoHS
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