EP20K600CB652C7E5 - APEX 20KC 600K Gates FPGA 652-BGA | Intel
부품 번호: EP20K600CB652C7E5 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252 | $2,520.00 |
| 100 | $225 | $22,500.00 |
| 500 | $198 | $99,000.00 |
| 1,000 | $175 | $175,000.00 |
EP20K600CB652C7E5 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs), embedded memory, and programmable interconnect that can be re-programmed in-system to implement any digital logic function. In the broader taxonomy: FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor. FPGAs sit between fixed-function ASICs (lower NRE, higher per-unit cost at volume) and CPLDs (smaller, faster, non-volatile), giving designers high logic density and parallel processing without the long lead time of custom silicon.
Key features include 488 maximum user I/O pins, 311,296 bits of embedded SRAM distributed across EAB (Embedded Array Block) memory, MultiCore interconnect with direct-drive and PIP registers, four phase-locked loops (PLLs) for clock synthesis, and LVTTL/LVCMOS/PCI/SSTL/HSTL I/O standards support. The 0.15 um CMOS process and 1.8 V core supply balance performance against power, while the 652-ball BGA provides high I/O count in a 45 x 45 mm footprint suitable for multi-layer PCBs.
The APEX 20KC architecture combines look-up table (LUT) logic with embedded array blocks for on-chip RAM and ROM, enabling designers to integrate wide data-path functions, FIFO buffers, and CAM structures alongside datapath logic. FastTrack interconnect provides continuous routing resources for predictable timing closure, and dedicated clock networks with PLL support simplify multi-clock domain designs.
Typical applications include telecommunications ASIC prototyping, high-speed parallel DSP (such as multi-channel video processing), network routers and switches, graphics accelerators, and high-density glue-logic replacement. The 488 I/O count also suits processor-bus bridging and backplane interface designs where many parallel buses must be terminated in a single device.
When designing with the EP20K600CB652C7E5, pay close attention to BGA fan-out and escape routing on the PCB - 1.0 mm or finer pitch BGA requires microvia or via-in-pad technology. Use the Quartus II (or Max+Plus II) toolchain for place-and-route, and ensure the configuration scheme (EPC16 / EPC8 / passive serial / JTAG) is chosen to match board-level boot requirements.
This page synthesizes distributor pricing, lifecycle context, drop-in package-compatible alternatives from the same APEX 20K family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP20K600CB652C7E5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K600CB652C7E5 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Propagation Delay.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K600CB652C7
✅ 드롭인✓ 재고 있음
$1320 / 개
데이터시트 보기 →EP20K600CB652-8
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K400CB652C7ES
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →EP20K400CB652I7
✅ 드롭인✓ 재고 있음
$149.5 / 개
데이터시트 보기 →EP20K400CB652C9
✅ 드롭인✓ 재고 있음
$89.2 / 개
데이터시트 보기 →EP20K600CB652C7E5 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Typical Gate Count | 600K gates |
| Logic Elements / Macros | 24,320 |
| Maximum User I/O | 488 |
| Embedded Memory (EAB bits) | 311,296 bits |
| 패키지 | 652-ball FineLine BGA |
| Core Voltage | 1.8 V |
| Process Technology | 0.15 um CMOS |
| 동작 온도 | 0C to +85C (commercial, suffix C7) |
| Speed Grade | 7 (-1 speed bin equivalent, E5 suffix) |
| PLL Count | 4 |
| Supported I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL |
| Configuration Scheme | Passive Serial / JTAG / EPC16 / EPC8 |
| 수명 주기 상태 | Obsolete - last time buy has passed |
EP20K600CB652C7E5 핀 구성
| 핀 A1 | I/O — User I/O pin (bank 1) |
| 핀 A2 | I/O — User I/O pin (bank 1) |
| 핀 A3 | I/O — User I/O pin (bank 1) |
| 핀 A4 | VCCIO — I/O supply voltage |
| 핀 A5 | I/O — User I/O pin (bank 1) |
| 핀 A6 | I/O — User I/O pin (bank 1) |
| 핀 A7 | I/O — User I/O pin (bank 1) |
| 핀 A8 | GND — Ground |
| 핀 A9 | I/O — User I/O pin (bank 1) |
| 핀 A10 | I/O — User I/O pin (bank 1) |
| 핀 A11 | I/O — User I/O pin (bank 1) |
| 핀 A12 | I/O — User I/O pin (bank 1) |
| 핀 A13 | VCCIO — I/O supply voltage |
| 핀 A14 | I/O — User I/O pin (bank 1) |
| 핀 A15 | I/O — User I/O pin (bank 1) |
| 핀 A16 | I/O — User I/O pin (bank 1) |
| 핀 A17 | I/O — User I/O pin (bank 1) |
| 핀 A18 | GND — Ground |
| 핀 A19 | I/O — User I/O pin (bank 1) |
| 핀 A20 | I/O — User I/O pin (bank 1) |
| 핀 A21 | I/O — User I/O pin (bank 1) |
| 핀 A22 | I/O — User I/O pin (bank 1) |
| 핀 A23 | VCCIO — I/O supply voltage |
| 핀 A24 | I/O — User I/O pin (bank 1) |
| 핀 A25 | I/O — User I/O pin (bank 1) |
| 핀 A26 | I/O — User I/O pin (bank 1) |
일반적인 애플리케이션
EP20K600CB652C7E5 적합 용도: 6 애플리케이션s: Telecommunications ASIC Prototyping, High-Speed Parallel DSP, Network Router and Switch Line Cards, Graphics and Image Processing Accelerators, High-Density Glue Logic Replacement, Industrial Control and Test Equipment.
Telecommunications ASIC Prototyping
The EP20K600CB652C7E5's 600K typical gates and 24,320 logic elements make it a strong ASIC prototype vehicle for telecom ASICs targeting OC-192, ATM, and SONET designs. Its 488 user I/O pins support the wide parallel buses common in line-card designs, while the 311,296 bits of embedded EAB memory enable on-chip packet buffering and CAM structures without external SRAM. The 4 PLLs allow multiple clock domains typical of telecom backplanes. Designers benefit from the APEX 20K MultiCore interconnect for predictable timing closure on critical paths.
추천
High-Speed Parallel DSP
The EP20K600CB652C7E5 is well suited to multi-channel DSP workloads such as video processing, image filtering, and baseband signal processing. With 24,320 logic elements designers can instantiate dozens of parallel multiply-accumulate engines; the 311,296 EAB bits provide distributed FIFO and coefficient memory for FIR/FFT pipelines. The 0.15 um process at 1.8 V core supports clock rates up to the APEX 20KC speed-grade-7 bin while keeping power manageable for dense logic blocks.
추천
Network Router and Switch Line Cards
The 488 user I/O count of the EP20K600CB652C7E5 supports the wide parallel backplane interfaces used in router and switch line cards. Combined with 311,296 bits of EAB SRAM for queue management and the 4 PLLs for clock-domain multiplexing between fabric, PHY, and CPU interfaces, the device can integrate forwarding lookup tables, QoS engines, and statistics counters on a single chip. The 652-FineLine BGA provides the mechanical robustness and signal-integrity margins needed for backplane insertion.
추천
Graphics and Image Processing Accelerators
The EP20K600CB652C7E5's combination of 24,320 logic elements and 311,296 EAB bits makes it suitable for graphics pipeline acceleration, including rasterization, texture addressing, and alpha-blending stages. The 488 I/O pins are sufficient to drive wide video data buses (24/32-bit RGB) plus side-band control signals. Embedded array blocks can store lookup tables (LUTs) for gamma correction and color-space conversion at line rate.
추천
High-Density Glue Logic Replacement
For designs that previously used multiple CPLDs or discrete glue-logic chips, the EP20K600CB652C7E5 offers 24,320 logic elements and 488 I/O pins in a single BGA, reducing board area and BOM count. Common use cases include processor-bus bridging, custom memory controller interfacing, and backplane signal multiplexing. The Quartus II toolchain simplifies design migration from legacy CPLD schematics.
추천
Industrial Control and Test Equipment
The commercial 0C to +85C operating range of the EP20K600CB652C7E5 (speed grade E5 / C7) suits industrial test and measurement equipment where wide operating temperature is not required. The 488 user I/O count supports multi-channel instrumentation front-ends, while the embedded EAB memory implements deep sample buffers and trigger pattern matchers. Designers can leverage the APEX 20K MultiCore interconnect to maintain deterministic timing on control loops.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K600CB652C7E5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K600CB652C7 | EP20K600CB652-8 | EP20K400CB652C7 | EP20K400CB652I7 | EP20K400CB652C9 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 652-ball FineLine BGA | 652-ball FineLine BGA (same) | 652-ball FineLine BGA (same) | 652-ball FineLine BGA (same) | 652-ball FineLine BGA (same) | 652-ball FineLine BGA (same) |
| Typical Gate Count | 600K gates | 600K gates | 600K gates | 400K gates (-33%) | 400K gates (-33%) | 400K gates (-33%) |
| Logic Elements / Macros | 24,320 | 24,320 | 24,320 | 16,640 (-32%) | 16,640 (-32%) | 16,640 (-32%) |
| Maximum User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Embedded Memory (EAB bits) | 311,296 bits | 311,296 bits | 311,296 bits | 212,992 bits (-32%) | 212,992 bits (-32%) | 212,992 bits (-32%) |
| Operating Temperature | 0C to +85C (Commercial, C7) | 0C to +85C (Commercial, C7) | 0C to +85C (Commercial, -8) | 0C to +85C (Commercial, C7) | -40C to +100C (Industrial, I7) | 0C to +85C (Commercial, C9) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest gate density in the APEX 20K family (vs EP20K400CB652C7)
- Same-package drop-in second source (vs EP20K600CB652C7)
- Speed grade E5 bin flexibility vs -8 (vs EP20K600CB652-8)
설계 노트
The 652-ball FineLine BGA package uses 1.0 mm ball pitch. Per APEX 20K datasheet PCB design guidelines, use a minimum 4-layer PCB stack-up with dedicated ground and power planes. Microvia or via-in-pad technology is required for signal escape routing on inner balls. Maintain 50 ohm controlled impedance on high-speed I/O (LVTTL/PCI/SSTL) traces to preserve signal integrity.
Estimated: At full logic utilization and maximum toggle rate, the EP20K600CB652C7E5 can dissipate 3 to 5 W of power. The 652-BGA package thermal resistance is approximately 15 C/W theta-JA with standard JEDEC test board airflow. A thermal copper pad array under the BGA and adequate chassis airflow are required to keep junction temperature below the commercial 85C limit. Use multiple thermal vias beneath the die for heat extraction.
Configuration mode selection is critical: the EP20K600CB652C7E5 supports passive serial, JTAG, and EPC16/EPC8 configuration devices. Mixing MSEL pin strapping between modes causes boot failures. Per APEX 20K datasheet, verify the MSEL[2..0] pins are tied correctly for the chosen configuration device before PCB fab. Also note that Quartus II versions newer than 13.0 do NOT support APEX 20K - use legacy 13.0 SP1 or earlier.
규정 준수 정보
RoHS/REACH compliance status not explicitly stated in the verified web data; Altera APEX 20K parts were lead-free per industry norm but not all variants are documented as RoHS compliant. AEC-Q100 not applicable (FPGA family predates automotive qualification push).
