EP20K60EFC324-2X - APEX-20KE FPGA 60K LE 324-FBGA | Intel
부품 번호: EP20K60EFC324-2X ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262.5 | $2,625.00 |
| 100 | $238.75 | $23,875.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195.5 | $195,500.00 |
EP20K60EFC324-2X 개요
What is an FPGA? A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device composed of an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O elements, sitting between Application-Specific Integrated Circuits (ASICs) and general-purpose microcontrollers in the digital logic hierarchy (FPGA → programmable logic device → logic IC → integrated circuit → semiconductor). The APEX-20KE family adds embedded system blocks (ESBs) for dual-port RAM, FIFO, and CAM functions.
The EP20K60EFC324-2X integrates 16 Embedded System Blocks for memory functions, four phase-locked loops (PLLs) for clock management, and supports MultiVolt I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) for direct interfacing with mixed-voltage logic families. It features in-system programmability via IEEE 1149.1 (JTAG) and supports configuration via passive serial, passive parallel asynchronous, and passive parallel synchronous modes using the Altera Quartus / MAX+PLUS II tool chain.
The device architecture combines a fine-grained Look-Up Table (LUT)-based logic fabric with high-density memory blocks, enabling high-throughput datapath and DSP applications. The four PLLs provide flexible clock synthesis, frequency multiplication, and skew management, critical for synchronous designs operating across multiple clock domains.
Typical applications include telecommunications infrastructure (SONET/SDH framer, ATM switching), high-speed serial protocol bridging, data acquisition systems with embedded FIFO buffering, and industrial control platforms with custom parallel interfaces. The 19×19 mm FBGA-324 footprint is suitable for moderate-density boards.
When designing with this device, observe the 1.8 V (±5 %) core supply tolerance and place at least 8 decoupling capacitors (0.1 µF and 10 µF) around the periphery. JTAG pins should be pulled appropriately for reliable in-system programming.
This page synthesizes current distributor inventory, drop-in alternatives, and engineering design notes that go beyond the manufacturer datasheet to support sourcing and board-level integration.
드롭인 대체품: EP20K60EFC324-2X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K60EFC324-2X (동일 폼 팩터 및 풋프린트) — 차이점: Package / Case, Operating Temperature, Family, Process Technology, Total Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K60EFC324-2N
✅ 드롭인✓ 재고 있음
$52.73 / 개
데이터시트 보기 →EP20K60EFC324-2
✅ 드롭인✓ 재고 있음
$41.75 / 개
데이터시트 보기 →EP20K60EFC324-1X
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP20K60EFC324-1
✅ 드롭인✓ 재고 있음
$76.5 / 개
데이터시트 보기 →EP20K60EFC324-2X 최대 정격 & 전기적 특성
| Family | APEX-20KE |
| Number of Logic Elements (LEs) | 2,560 |
| Typical Gates | 60,000 |
| Total RAM Bits | 32,768 |
| Number of I/O Pins | 196 |
| Number of Embedded System Blocks (ESBs) | 16 |
| Number of PLLs | 4 |
| Core Voltage | 1.71 V to 1.89 V |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Package Type | 324-FBGA (Fine-pitch BGA) |
| Package Dimensions | 19 mm × 19 mm |
| Operating Temperature Grade | Industrial (per -2 speed suffix) |
| Configuration Mode | Passive Serial / Passive Parallel (Async & Sync) |
| In-System Programming | Yes (IEEE 1149.1 JTAG) |
EP20K60EFC324-2X 19 mm × 19 mm 핀 구성 가이드
EP20K60EFC324-2X(19 mm × 19 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K60EFC324-2X.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K60EFC324-2X 적합 용도: 6 애플리케이션s: Telecommunications Backplane Bridging, Industrial Motion Control Platform, Data Acquisition Front-End, Custom Parallel Protocol Converter, Medical Imaging Pre-Processor, Aerospace Test & Measurement Equipment.
Telecommunications Backplane Bridging
The EP20K60EFC324-2X fits telecommunications backplane bridging applications because it combines 2,560 LEs with 32,768 bits of dual-port RAM and four PLLs capable of low-jitter clock synthesis. In SONET/SDH framer designs, the device supports STS-1/STM-0 payload processing at 51.84 Mbps with the 196 user I/Os providing parallel backplane interfaces. The 16 Embedded System Blocks (ESBs) implement FIFOs for clock-domain crossing between backplane and fabric clocks. Its industrial temperature grade (-2X suffix) makes it suitable for central-office and outdoor cabinet deployments where ambient temperatures span -40 C to +100 C. Estimated: this configuration typically utilizes 70-80% of the available LEs.
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Industrial Motion Control Platform
The EP20K60EFC324-2X is well-suited for industrial motion-control platforms requiring deterministic parallel I/O for servo-loop feedback and PWM generation. Its 196 user I/Os accommodate multi-axis encoder inputs (quadrature decoding), limit-switch monitoring, and drive-stage control signals without external bus expanders. The four PLLs synthesize independent timebases for each axis from a single crystal reference, simplifying BOM. The 32,768-bit embedded RAM supports trajectory-buffer storage and PID-loop parameter tables. MultiVolt I/O compatibility allows direct interfacing with 3.3 V logic-level MCUs and 5 V driver ICs. Estimated: at 50 MHz system clock, design Fmax for -2 speed grade is approximately 200 MHz internal.
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Data Acquisition Front-End
For data-acquisition front-end designs, the EP20K60EFC324-2X provides 16 ESBs implementing deep FIFOs that decouple ADC sampling bursts from downstream DMA transfers. Its 196 I/Os accept parallel ADC outputs up to 16 bits wide plus discrete control signals, while the four PLLs generate phase-aligned clocks for multi-channel simultaneous sampling. The 1.8 V core with MultiVolt I/O supports direct connection to modern low-voltage ADCs (LVDS or 1.8 V CMOS) without external buffers. According to the APEX-20KE datasheet, the JTAG interface enables in-field firmware updates for calibration-table refresh. Estimated: typical DAQ design uses 40-60% of available LEs for state-machine logic.
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Custom Parallel Protocol Converter
The EP20K60EFC324-2X serves as the protocol-conversion bridge between legacy parallel buses (e.g., 16-bit ISA, VME) and modern high-speed serial links (LVDS, SERDES). The 32,768 bits of dual-port RAM buffer transactions between mismatched clock domains, while the four PLLs regenerate clocks at any required ratio. The 196 user I/Os accommodate full 32-bit data buses plus address and control signals. Industrial temperature grade ensures reliable operation in factory-floor enclosures with fluctuating ambient temperatures. Estimated: protocol-converter designs typically utilize 60-65% of LEs for state machines and approximately 50% of ESBs for FIFO buffering.
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Medical Imaging Pre-Processor
For medical-imaging pre-processing tasks such as ultrasound beamforming or endoscopy pixel-pipeline correction, the EP20K60EFC324-2X delivers the deterministic latency required for real-time operation. The parallel LUT architecture processes multiple pixel streams in parallel with predictable timing. The four PLLs derive pixel clocks from sensor reference inputs with sub-nanosecond jitter. 32,768 bits of embedded RAM implement line-buffers and look-up tables for gamma-correction or beam-delay compensation. Industrial temperature grade supports operation in controlled clinical environments. Estimated: beamforming designs typically utilize 70% of LEs and 12 of 16 ESBs.
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Aerospace Test & Measurement Equipment
The EP20K60EFC324-2X is commonly deployed in aerospace ground-test equipment where mid-density programmable logic is required but full radiation-hardened FPGAs are not justified. Its 196 I/Os interface directly to MIL-STD-1553 transceivers, ARINC 429 receivers, and discrete instrumentation signals. The four PLLs synthesize any required reference frequency from a single 10 MHz or 20 MHz master oscillator. The 324-FBGA package is suitable for conduction-cooled chassis designs, while the industrial temperature range accommodates laboratory and field-deployed environments. Estimated: aerospace test designs typically achieve 100 MHz internal Fmax at -2 speed grade.
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추천 제품 요약
엔지니어링 참조 데이터: EP20K60EFC324-2X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K60EFC324-2N | EP20K60EFC324-2 | EP20K60EFC324-1X | EP20K60EFC324-1 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-FBGA (19x19) | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same |
| Speed Grade | -2 (faster) | -2 (same) | -2 (same) | -1 (slower) | -1 (slower) |
| Operating Temperature Range | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) |
| Logic Elements | 2,560 | 2,560 | 2,560 | 2,560 | 2,560 |
| Total RAM Bits | 32,768 | 32,768 | 32,768 | 32,768 | 32,768 |
| Number of I/Os | 196 | 196 | 196 | 196 | 196 |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Speed grade -2 enables higher Fmax (vs EP20K60EFC324-1X)
- Industrial temperature range (vs EP20K60EFC324-2)
- Higher PLLs and ESB count than predecessors (vs APEX-20K (non-E) family)
설계 노트
The APEX-20KE core requires a tightly regulated 1.8 V (±5 %) supply. Use a low-dropout regulator such as the LT3021 or TPS74401 capable of at least 1.5 A peak current with < 50 mV load transient response. Place at least eight decoupling capacitors (four 0.1 µF X7R and four 10 µF X5R) within 5 mm of the supply pin field, distributed evenly around the BGA perimeter. Estimated: core current draw at 100% utilization approaches 0.8 A.
While FBGA packages have low thermal resistance via the solder ball array, the EP20K60EFC324-2X in 100% LE utilization can dissipate 1.5 to 2 W. For industrial temperature operation, ensure the PCB thermal design incorporates at least 4 thermal vias per ball array quadrant to inner copper planes. Junction temperature should remain below 125 C per APEX-20KE datasheet. Estimated: a 4-layer FR4 board with 1 oz copper gives Theta-JA approximately 18 C/W.
The 324-FBGA with 1.0 mm pitch demands a 4-layer PCB minimum with controlled-impedance routing (50 ohm single-ended, 100 ohm differential) for LVDS signals. Use a solder-mask-defined land pad with non-solder-mask-defined (NSMD) preferred for BGAs of this pitch. BGA requires X-ray inspection post-reflow to verify joint integrity; plan rework access accordingly. Estimated: reflow profile should peak at 245 C with TAL of 60-90 seconds.
Do not confuse the -1X speed grade with the -2X speed grade: the -1X has approximately 15-20% lower internal Fmax but is fully pin-compatible. Do not use EPC1 configuration memories - the EP20K60 requires EPC2 or larger for full bitstream storage. The JTAG chain must include the correct IR length (10 bits) or boundary-scan failures will occur. Configuration data integrity must be verified via CRC per APEX-20KE datasheet conventions.
규정 준수 정보
RoHS, REACH, and conflict-mineral status not explicitly stated in the verified web data; lead-free per Altera APEX-20KE family convention. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
