EP2A25B652C9 - 24K LE APEX II FPGA 652-pin BGA | Intel
부품 번호: EP2A25B652C9 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $140 | $14,000.00 |
| 500 | $120 | $60,000.00 |
| 1,000 | $105 | $105,000.00 |
EP2A25B652C9 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic function is defined by the customer's configuration bitstream rather than by the foundry mask set. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs in density and below ASICs in unit cost at very high volumes. APEX II devices specifically extend the APEX architecture with embedded multipliers, embedded memory blocks (EABs), and high-speed LVDS-capable I/O, enabling single-chip implementation of datapath-intensive systems.
Key features include up to 24,320 logic elements, embedded array blocks for wide memory and multiplier functions, multi-gigabit interconnect support, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The device supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS through programmable I/O buffers, allowing direct interfacing with DDR SDRAM, ZBT SRAM, and legacy TTL peripherals.
The APEX II architecture combines a multi-level routing fabric (FastTrack, MegaLAB, and DirectDrive interconnect) with embedded system blocks, giving designers a flexible platform for bus-oriented designs. Multi-voltage I/O banks allow independent selection of 1.5 V, 1.8 V, 2.5 V, or 3.3 V signalling on the same die, simplifying mixed-voltage board designs.
Typical applications include telecommunications line-card datapaths, baseband processing, video and imaging pipelines, and ASIC prototyping. APEX II devices were widely adopted in late-1990s and early-2000s communications infrastructure and continue to appear in long-lifecycle industrial and aerospace systems that depend on stable supply.
When designing with this device, plan power sequencing carefully: VCCINT must ramp before VCCIO to avoid latch-up, and decoupling must use a low-impedance distribution network with multiple bulk and ceramic capacitors near each bank. Configuration should default to a fail-safe scheme (e.g. MAX configuration) so that unconfigured I/O do not drive the board at power-up.
드롭인 대체품: EP2A25B652C9 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A25B652C9 (동일 폼 팩터 및 풋프린트) — 차이점: Logic Elements, Operating Temperature, Speed Grade, Package, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A25B652C8
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP2A25B652C7
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP2A15B652C9
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2A25B652C9 최대 정격 & 전기적 특성
| Device Family | APEX II (EP2A25) |
| Logic Elements | 24,320 |
| 패키지 | 652-ball FineLine BGA |
| Speed Grade | C9 (-7 commercial) |
| Process Technology | 0.18 µm CMOS |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage Standards | LVTTL, LVCMOS, SSTL, LVDS |
| Configuration Interface | JTAG (IEEE 1149.1), passive serial, MAX configuration scheme |
| Embedded Memory | Embedded array blocks (EABs) |
| Embedded Multipliers | Yes (DSP blocks) |
| 실장 유형 | Surface Mount (BGA) |
EP2A25B652C9 652-ball fineline bga 핀 구성 가이드
EP2A25B652C9(652-ball fineline bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A25B652C9.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A25B652C9 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Datapath, Image and Video Processing Pipeline, DSP Co-Processor and FFT Accelerator, ASIC Prototyping and Emulation, Industrial Control and Factory Automation, Military and Aerospace Avionics (Legacy Programs).
Telecommunications Line-Card Datapath
The EP2A25B652C9's 24,320 logic elements and embedded multipliers make it well suited for telecommunications line-card datapaths carrying ATM, framers, and protocol-mapping functions. Its C9 speed grade supports the multi-hundred-MHz fMAX needed for OC-12 / OC-48 framer designs, while multi-standard I/O banks interface directly to 3.3 V framers and 2.5 V network processors. Place the device with local decoupling close to each VCCINT and VCCIO pin group; the 652-ball BGA footprint offers generous power/ground balls for low-impedance distribution critical at these clock rates.
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Image and Video Processing Pipeline
In imaging pipelines, the EP2A25B652C9's embedded multipliers deliver DSP throughput for FIR filters, colour-space conversion, and motion estimation at video rates. The 24,320 logic elements provide sufficient capacity for line buffers and pipeline control, while embedded array blocks implement dual-port line memory without consuming logic. The C9 speed grade is required to keep horizontal-line timing margins tight at 100+ MHz pixel clocks, and the LVDS I/O capability interfaces directly to common CMOS image sensors over low-EMI differential pairs.
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DSP Co-Processor and FFT Accelerator
The EP2A25B652C9's embedded multipliers and wide embedded memory blocks form an efficient engine for FFT, convolution, and Reed-Solomon codecs. Cores mapped onto the embedded array blocks can sustain hundreds of MSPS on 16-bit datapaths, while soft logic implements the surrounding control and address-generation state machines. The 652-ball BGA delivers enough I/O to expose wide external data buses (32-64 bit) to a host DSP or microprocessor without muxing penalties, and LVDS I/O enables glue-free connection to high-speed SRAM banks.
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ASIC Prototyping and Emulation
The EP2A25B652C9 is widely used as an ASIC prototyping vehicle because its 24,320 logic elements map enough gates to validate sub-blocks of larger ASICs before tape-out. Multi-voltage I/O banks emulate the mixed-signal environment of an ASIC, and JTAG-based configuration lets engineers iterate bitstreams in seconds. The 652-ball BGA supports bring-up on high-speed prototype boards with controlled-impedance traces; pair it with the lower-density EP2A15B652C9 sibling for partitioning large ASIC designs across multiple pin-compatible FPGAs.
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Industrial Control and Factory Automation
Long-lifecycle industrial systems still rely on the EP2A25B652C9 for deterministic control logic, motor-control loop computation, and legacy fieldbus bridging. The embedded multipliers accelerate PI/PID control loops and SVPWM generation, while the broad I/O standard support interfaces 5 V tolerant LVTTL sensors and 3.3 V MCUs from the same device. The 652-ball BGA's robust thermal performance supports enclosed industrial cabinets; -7 commercial speed grade is acceptable for sub-100 kHz control loops common in PLCs and servo drives.
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Military and Aerospace Avionics (Legacy Programs)
Many legacy aerospace and defence platforms use the EP2A25B652C9 because the design was qualified under existing certification baselines that cannot be re-opened. The device's deterministic silicon behaviour, JTAG-based configuration, and -7 commercial speed grade suit mission computers, displays, and signal-conditioning units where lifecycle stability outranks raw performance. Obsolete-stock sourcing through authorised distributors is critical here; pin-compatible EP2A25B652C8 or EP2A25B652C7 (slower grades) are acceptable form-fit-function substitutes on the same 652-ball BGA.
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추천 제품 요약
엔지니어링 참조 데이터: EP2A25B652C9 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A25B652C8 | EP2A25B652C7 | EP2A15B652C9 |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 652-ball FineLine BGA | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same |
| Logic Elements | 24,320 | 24,320 (same) | 24,320 (same) | ~15,600 (-36%) |
| Speed Grade | C9 (-7 commercial) | C8 (-8 commercial, ~15% slower) | C7 (-9 commercial, ~30% slower) | C9 (-7 commercial, same) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) |
| Embedded Multipliers | Yes | Yes (same) | Yes (same) | Yes (fewer count due to lower density) |
| Pin-to-Pin Compatible | Reference | Yes - same 652-ball BGA footprint | Yes - same 652-ball BGA footprint | Yes - same 652-ball BGA footprint |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest-density APEX II in 652-ball BGA at C9 speed grade (vs EP2A25B652C8)
- Higher logic density at the same speed grade (vs EP2A15B652C9)
- Faster speed grade over the slowest member of the family (vs EP2A25B652C7)
설계 노트
Power sequencing on APEX II devices requires VCCINT to ramp monotonically to 1.8 V before VCCIO begins to ramp; reverse sequencing risks I/O latch-up and possible damage. Use a multi-rail power supervisor (such as a TI TPS3808-style voltage supervisor) to gate each rail's enable until the prior rail crosses its Power-Good threshold. Decoupling must combine bulk tantalum/polymer caps (47-100 µF) with 0.1 µF and 0.01 µF ceramics placed within 5 mm of each VCC ball group on the 652-ball BGA. Estimated: at typical 25K-LE utilisation with 50% toggle rate, expect ~3-5 W core dissipation - verify with the Altera PowerPlay early estimator.
The 652-ball FineLine BGA has a fine pitch (typically 1.0 mm) that demands 4-6 layer PCB stack-up with controlled-impedance traces for high-speed I/O. Use microvia (laser-drilled) technology on inner layers to fan-out the BGA balls to escape traces; dog-bone fan-out is standard. Match trace lengths within LVDS pairs to within 150 mil and within DDR data/clock groups to within 50 mil to preserve timing margins. Solid ground planes directly under the BGA improve thermal dissipation and reduce simultaneous-switching-noise (SSN) on the I/O banks.
Do not assume any new-fabricated APEX II units are available - the family has been obsolete since the late 2000s, so all EP2A25B652C9 units today are from old factory or authorised-distributor stock. Verify date code and factory seal when sourcing; consider third-party X-ray inspection and electrical test for high-reliability programs. For new designs, migrate to a current Intel FPGA family (Cyclone IV/V, MAX 10) instead - APEX II software (Quartus II version 4.x) is end-of-life and not supported by current Quartus Prime releases.
Estimated: at 1.8 V VCCINT and ~5 W core dissipation in the 652-ball FineLine BGA, the junction-to-ambient thermal resistance θJA for this package is approximately 12-15 C/W on a standard 4-layer JEDEC test board with adequate thermal vias. This yields a junction temperature rise of 60-75 C above 25 C ambient. For industrial temperature range operation (up to 85 C ambient), keep core dissipation below 4 W or use forced-air cooling. Reference the APEX II handbook thermal-management section for board-level thermal characterisation.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not retrievable from the Verified Web Data for EP2A25B652C9. APEX II family devices predate widespread RoHS adoption, so most factory-stock units are lead-bearing unless specifically re-qualified. Mark these markers for downstream compliance review.
