EP20K400CF672C8 - APEX 20K 400K Gates FPGA 652-BGA | Intel
부품 번호: EP20K400CF672C8 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $162 | $1,620.00 |
| 100 | $138 | $13,800.00 |
| 500 | $121 | $60,500.00 |
| 1,000 | $108 | $108,000.00 |
EP20K400CF672C8 개요
What is an FPGA: A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs occupy the top of the programmable logic hierarchy, sitting above CPLDs and below custom ASICs, and are widely used for parallel DSP, glue logic, and rapid prototyping in telecom, industrial, and military systems.
Key features: 400K system gates, 16,640 LEs, 212,992 RAM bits, 488 max user I/Os, MultiCore architecture combining look-up table (LUT) logic with embedded array blocks (EABs), 2.5V core supply, in-system programmability via SRAM configuration, and industrial temperature grade (0C to 85C). The 672-ball FineLine BGA exposes a wide I/O count while keeping PCB routing manageable.
Technical depth: The APEX 20KC MultiCore architecture integrates a fine-grained LUT fabric optimized for high-speed combinational and registered logic with coarse-grained EABs that implement RAM, ROM, multipliers, and CAM in densities up to 2,048 bits per block. Distributed embedded array blocks reduce die area versus pure register-based architectures while delivering 2.5ns propagation delay for the targeted speed grade (C8).
Typical applications: high-bandwidth telecommunication line cards, network switches and routers, ASIC prototyping, DSP co-processing, and industrial control systems requiring parallel wide-word arithmetic.
Design consideration: the 652-ball FineLine BGA requires a multi-layer PCB with controlled-impedance routing, microvia stack-ups, and matched-length tracking for LVDS or SSTL interfaces; signal-integrity simulation is recommended for buses above 100 MHz.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet.
드롭인 대체품: EP20K400CF672C8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K400CF672C8 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Process Technology, Package, Speed Grade, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K400CF672C7
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP20K400CF672C-8
✅ 드롭인✓ 재고 있음
$95 / 개
데이터시트 보기 →EP20K400CF672C-7
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP20K400CF672C7N
✅ 드롭인✓ 재고 있음
$160 / 개
데이터시트 보기 →EP20K400CF672C7ES
✅ 드롭인✓ 재고 있음
$152 / 개
데이터시트 보기 →EP20K400CF672C7GA
✅ 드롭인✓ 재고 있음
$92.5 / 개
데이터시트 보기 →EP20K400CF672C8 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Series | APEX 20K |
| System Gates | 400,000 |
| Logic Elements | 16,640 |
| Max User I/Os | 488 |
| Embedded RAM Bits | 212,992 |
| Macros | 1,664 |
| Core Voltage | 2.5 V |
| Logic Family | CMOS |
| Propagation Delay | 2.5 ns |
| 패키지 | 672-ball FineLine BGA (FC-FBGA) |
| Package Type Code | BGA-652 |
| 동작 온도 | 0C to 85C |
| Speed Grade | C8 |
| 실장 유형 | Surface Mount |
EP20K400CF672C8 bga-652 핀 구성 가이드
EP20K400CF672C8(bga-652 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K400CF672C8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K400CF672C8 적합 용도: 6 애플리케이션s: Telecommunication Line Cards, ASIC Prototyping and Emulation, Industrial Control and Automation, DSP Co-Processing, Network Switches and Routers, Military and Aerospace Embedded Systems.
Telecommunication Line Cards
The EP20K400CF672C8 fits telecom line-card designs because its 400,000 system gates and 1,664 embedded array blocks provide the parallel fabric needed for high-speed packet processing, ATM cell assembly, and multi-channel TDM framing. The 488 user I/Os comfortably route 8-bit UTOPIA buses plus multiple E1/T1 framers without external mux logic. Its 2.5ns propagation delay enables glue-logic and framer interfaces at 77 MHz, and the 672-ball BGA exposes enough I/O to support both LVTTL control and LVDS backplane interconnect on the same PCB.
추천
ASIC Prototyping and Emulation
With 16,640 logic elements, 212,992 RAM bits, and MultiCore LUT+EAB architecture, the EP20K400CF672C8 has long been favored for ASIC prototyping and pre-silicon emulation of mid-complexity ASICs. Engineers map RTL designs into Quartus II and use the EAB blocks to emulate SRAM and FIFO macros, accelerating verification before tape-out. The 672-ball BGA footprint and 488 I/Os allow realistic I/O behavior emulation including LVDS and SSTL signal integrity studies.
추천
Industrial Control and Automation
The EP20K400CF672C8 is well suited to industrial control platforms requiring parallel I/O handling, deterministic timing, and long-term lifecycle support. Its 488 I/Os can drive dozens of opto-isolated digital inputs, encoder counters, PWM outputs, and RS-485 transceivers simultaneously. The 0C to 85C operating range covers most factory-floor environments, and the embedded array blocks implement motor-control lookup tables and PID compensation tables in distributed RAM rather than external memory, reducing BOM cost.
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DSP Co-Processing
The EP20K400CF672C8's 1,664 embedded array blocks each implement up to 2,048 bits of RAM and can be configured as 8-bit multipliers or adder trees, enabling parallel DSP pipelines for FFT, FIR, and convolution. With 212,992 RAM bits distributed across the die, designers build wide-word shift registers and coefficient tables without starving the LUT fabric. The 368 MHz internal fmax supports 50 MHz+ sample-rate DSP chains for audio, sonar, or vibration analysis.
추천
Network Switches and Routers
Layer-2 and layer-3 switches in the early 2000s used APEX 20KC devices for packet classification, queue management, and TCAM-style lookup tables. The EP20K400CF672C8's 488 I/Os route 16-bit data buses plus multiple SPI management interfaces to PHYs and switch fabrics, while EABs implement content-addressable memories at line rate. The 652-ball BGA footprint supports fine-grained power islands across I/O banks for mixed 1.8V/2.5V/3.3V signaling standards.
추천
Military and Aerospace Embedded Systems
The APEX 20KC family was qualified into military and aerospace programs where its in-system programmability, high gate count, and wide I/O support allowed single-chip implementations of mission computers and signal processors. The EP20K400CF672C8 in particular served in radar pre-processors, secure-communication modems, and flight-control test benches. Although the commercial grade is rated 0C to 85C, military screening (-40C to 125C) is available on the EP20K400CB652I-series parts sharing the same logic.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K400CF672C8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K400CF672C7 | EP20K400CF672C-8 | EP20K400CF672C-7 | EP20K400CF672C7N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-ball FineLine BGA | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| Speed Grade | C8 | C7 (slower) | C8 (match) | C7 (slower) | C7 (slower) |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded RAM Bits | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| Max User I/Os | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Higher speed grade C8 versus C7 alternatives (vs EP20K400CF672C7)
- Drop-in compatibility across the APEX 20KC family (vs EP20K200FC484-3)
- Mature legacy design ecosystem with full Quartus II support (vs Cyclone V 5CEFA7)
설계 노트
The 672-ball FineLine BGA uses a 1.0mm ball pitch and demands a PCB stack-up with microvia (laser-drilled) vias to fan out signals from inner balls. Use a 6-layer or 8-layer stack-up with dedicated ground and power planes adjacent to the BGA escape layer to control impedance for LVDS (100-ohm differential) and SSTL2 (50-ohm single-ended) interfaces. Decoupling requires 0.1uF X7R ceramics within 5mm of each power ball, plus bulk 22uF tantalums per power island.
Although APEX 20KC devices are CMOS and consume modest power at low toggle rates, a fully-utilized 400K-gate design can dissipate 3W to 5W. Mount the BGA on a PCB with a continuous ground plane directly under the device; for 5W operation, add a copper heat-spreader or attach a small clip-on heatsink to the package lid. The commercial 0C to 85C rating limits junction temperature to 125C with derating; validate worst-case Tj using the device's theta_JA from the datasheet.
Configuration bitstreams for APEX 20KC are SRAM-based and reload on every power-up; design must include a configuration PROM (EPC16, EPC8) or a microcontroller-hosted JTAG fallback. Do NOT leave I/O pins floating during configuration or the device may source contention current into downstream drivers. When migrating an APEX 20K design to APEX 20KE, recompile the Quartus II project for the new core voltage and re-validate timing - the same bitstream will NOT work across families.
Match impedance on LVDS pairs within 0.5mm length tolerance to avoid skew above 100 ps. Place termination resistors within 15mm of the receiver balls. For DDR-style SSTL interfaces, route DQS and CLK in matched-length groups and reference them to the same ground plane segment to suppress simultaneous-switching noise (SSN).
규정 준수 정보
RoHS / REACH status not explicitly stated in the provided web data for this legacy part. APEX 20KC pre-dates strict RoHS enforcement for many variants - verify with broker traceability documentation. AEC-Q100 not applicable since this is a logic/FPGA device rather than an automotive analog IC.