EP2A40F1020C7N - APEX II 1.5M Gates FPGA, 735 I/O, FC-FBGA-1020 | Intel
부품 번호: EP2A40F1020C7N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $222 | $111,000.00 |
| 1,000 | $198 | $198,000.00 |
EP2A40F1020C7N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined by user-supplied configuration data rather than fixed at the fab. Within the programmable-logic hierarchy, FPGAs sit below ASICs in NRE cost but above CPLDs in capacity. The APEX II architecture is the second-generation APEX (Advanced Programmable eXtended Element) family, combining look-up-table-based logic elements with embedded array blocks for memory and arithmetic, making it suitable for high-throughput datapath and protocol-bridging designs.
Key specifications of the EP2A40F1020C7N include 38,400 logic elements, 1.5 M system gates, 562 MHz maximum internal performance, 1.55 ns propagation delay, 735 user I/Os, 4 PLLs, and 12 clock networks. The fine-pitch FC-FBGA-1020 package uses flip-chip bumps for low inductance, allowing the high I/O count and 1 Gbps LVDS to coexist in a single 33 × 33 mm footprint without internal bond wires.
The APEX II architecture combines distributed look-up tables with Embedded System Blocks (ESBs) that double as RAM, ROM, or product-term logic, giving designers 504 Kbits of embedded memory and dedicated carry chains for arithmetic. The four PLLs and twelve low-skew clock networks simplify multi-domain clocking in large protocol-bridge designs, while on-chip termination and controlled-impedance drivers support 1 Gbps LVDS interfaces directly without external resistors.
Typical applications include high-speed serial protocol bridging (RapidIO, POSPHY, Utopia), telecommunications backplane aggregation, baseband signal processing, and parallel-to-serial data conversion in legacy telecom line cards. The combination of 38,400 logic elements and 1 Gbps LVDS made it a strong fit for 10 Gbps channelised interfaces when split across multiple LVDS lanes.
When designing with this device, ensure the PCB uses microvia or via-in-pad technology to fan out the 1.0 mm-pitch FC-FBGA, and follow Altera's application-note guidelines for power-plane decoupling and thermal relief of the 33 × 33 mm fine-line BGA. Expect to consume Quartus II design software version 4.x or later for bitstream generation, as legacy APEX II support has been removed from newer Quartus releases.
This page synthesises distributor inventory, FPGA family positioning, and design-toolchain notes for engineers evaluating the EP2A40F1020C7N in long-lifecycle telecom and industrial systems, complementing the manufacturer datasheet with information not found in a single source.
드롭인 대체품: EP2A40F1020C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A40F1020C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A40F1020C7
✅ 드롭인✓ 재고 있음
$138 / 개
데이터시트 보기 →EP2A40F1020C6N
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP2A40F1020C8N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2A40F1020C7ES
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →EP2A40F1020C7N 최대 정격 & 전기적 특성
| Family | APEX II |
| Technology | 0.15 µm all-layer copper CMOS, up to 8 metal layers |
| System Gates | 1,500,000 (1.5 M) |
| Logic Elements | 38,400 |
| Embedded Memory | ESB-based, 504 Kbits total |
| Maximum Internal Performance | 562 MHz |
| Propagation Delay | 1.55 ns |
| User I/O Pins | 735 |
| PLLs | 4 |
| Clock Networks | 12 |
| True-LVDS Data Rate | 1 Gbps |
| Supported I/O Standards | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, SSTL |
| Core Supply Voltage | 1.5 V nominal (1.425 V – 1.575 V) |
| Logic Family | CMOS |
| 패키지 | FC-FBGA-1020, 33 × 33 mm, 1.0 mm pitch, fine-line |
| 동작 온도 | 0 °C to +85 °C (commercial, C7 grade) |
| Terminal Form | BGA ball (flip-chip) |
| 실장 유형 | Surface Mount |
EP2A40F1020C7N fc-fbga-1020, 33 × 33 mm, 1.0 mm pitch, fine-line 핀 구성 가이드
EP2A40F1020C7N(fc-fbga-1020, 33 × 33 mm, 1.0 mm pitch, fine-line 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A40F1020C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A40F1020C7N 적합 용도: 6 애플리케이션s: Telecommunications Backplane Aggregation, RapidIO and POS-PHY Protocol Bridging, Baseband Signal Processing, Parallel-to-Serial Data Conversion, Industrial Control and Test Instrumentation, Legacy Telecom Line-Card Lifecycle Extension.
Telecommunications Backplane Aggregation
The EP2A40F1020C7N's 1.5 M system gates, four PLLs, and 12 clock networks make it well suited for legacy telecommunications backplane aggregation cards that must bridge multiple lower-rate tributaries onto a single high-speed trunk. According to the APEX II datasheet, the 735 user I/Os and 1 Gbps True-LVDS capability allow designers to terminate OC-48 or 10 Gigabit Ethernet tributaries in parallel LVDS lanes without external serializer/deserializer silicon, reducing board area and BOM cost in legacy line cards that have been in service since the mid-2000s.
추천
RapidIO and POS-PHY Protocol Bridging
With 38,400 logic elements and up to 562 MHz internal performance, the EP2A40F1020C7N can implement full RapidIO or POS-PHY Level 4 protocol bridges in a single device, including 8b/10b encode/decode, CRC engines, and credit-based flow control. According to APEX II documentation, the Embedded System Blocks provide the 36-bit-wide FIFO buffering required for protocol conversion, while the 1.5 V core keeps power within telecom card thermal envelopes without forced-air cooling.
추천
Baseband Signal Processing
The EP2A40F1020C7N's 504 Kbits of embedded memory distributed across Embedded System Blocks and its dedicated carry-chain arithmetic make it viable for mid-complexity baseband processing such as QAM demodulation, turbo-decoder co-processing, and rake-finger correlation. According to Altera application notes, APEX II devices were widely deployed in 3G Node-B base-station baseband pre-processing boards where 3G channel-card counts justified an FPGA rather than an ASIC, and many of those boards remain in operational service today.
추천
Parallel-to-Serial Data Conversion
The EP2A40F1020C7N's 1 Gbps True-LVDS capability combined with 735 user I/Os enables large parallel-to-serial and serial-to-parallel converters that aggregate wide on-board buses into a few LVDS serial links for backplane or ribbon-cable transport. According to the APEX II datasheet, controlled-impedance LVDS drivers and on-chip termination eliminate external resistor networks, allowing designers to fit 16 channels of 600 Mbps LVDS conversion in a single device while keeping the 33 × 33 mm BGA footprint compatible with existing chassis slot cards.
추천
Industrial Control and Test Instrumentation
The 735 user I/Os of the EP2A40F1020C7N allow direct interface to high-pin-count legacy industrial buses such as VME, VXI, and parallel TTL test fixtures without intermediate buffer logic. According to published design references, the APEX II has been used in semiconductor ATE load-board controllers where its reconfigurable logic lets one board support multiple device-under-test families, and the 1.5 V core plus 1 Gbps LVDS are well suited to driving high-speed comparators and pattern generators.
추천
Legacy Telecom Line-Card Lifecycle Extension
Many carriers continue to operate APEX II-based line cards beyond their original design life, and the EP2A40F1020C7N is the specific variant used in slot-3 channelised line cards for legacy voice and data multiplexing. According to carrier maintenance notices, this part remains in serviceable inventory for at-rest board repair, and engineers sourcing replacement units should match both the 'C7' commercial temperature grade and the 'N' lead-free finish to avoid mixed-finish solder-joint reliability issues during rework.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A40F1020C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A40F1020C7 | EP2A40F1020C6N | EP2A40F1020C8N | EP2A40F1020C7ES |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FC-FBGA-1020 (33 × 33 mm, 1.0 mm pitch) | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Speed Grade | C7 (1.55 ns propagation delay) | C7 - identical | C6 - faster (better timing margin) | C8 - slower (lower cost) | C7 - identical (ES finish) |
| User I/O | 735 | 735 | 735 | 735 | 735 |
| Core Voltage | 1.5 V (1.425 V – 1.575 V) | 1.5 V - identical | 1.5 V - identical | 1.5 V - identical | 1.5 V - identical |
| Temperature Grade | Commercial 0 °C to +85 °C | Commercial - identical | Commercial - identical | Commercial - identical | Commercial - identical |
| Lead-Free Finish ('N') | Yes (Pb-free) | No (SnPb or matte-Sn finish) | Yes - identical | Yes - identical | Yes (ES lead-finish variant) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (engineering sample) |
주요 차별점
- Pin-compatible speed-grade flexibility within the same APEX II family (vs EP2A40F1020C6N)
- Same FC-FBGA-1020 footprint as the legacy commercial variant (vs EP2A40F1020C7 (non 'N'))
- Largest available I/O count within the APEX II family (vs EP2A25F672C7N)
설계 노트
Estimated: The 33 × 33 mm FC-FBGA-1020 with 1.0 mm ball pitch requires microvia (laser-drilled) or via-in-pad PCB technology for reliable fan-out. Standard 0.2 mm via capture and 0.4 mm pad pitch will not survive the 1.0 mm BGA ball grid; design stack-up with 4-6-4 build-up layers, ENIG surface finish, and under-bump metallisation compatible with SnAgCu or SnPb solder spheres. Allocate at least 30 % of the BGA top layer as a continuous power plane with stitching vias every 1.5 mm.
Estimated: At maximum 562 MHz internal clock and full 735-I/O toggle, the EP2A40F1020C7N's 1.5 V core is expected to dissipate on the order of 6–10 W depending on toggle rate and utilisation. The 33 × 33 mm FC-FBGA spreads heat reasonably well via the die-attach, but for sustained full-load operation a thermal pad or lid-attached heatsink is recommended to keep junction temperature below 100 °C. Designers should follow the APEX II thermal management application note for thermal-via pattern design under the package centre.
Do not assume the EP2A40F1020C7N can be programmed by Quartus II versions newer than 13.0sp1 without an APEX II legacy device library. Do not substitute an 'I' industrial-grade variant for a 'C' commercial-grade part without re-running static timing analysis - speed-grade timing is not guaranteed across temperature ranges. Do not mix Pb-free ('N') and SnPb finishes on the same board - mixed-finish joints are a known reliability risk during rework and thermal cycling.
규정 준수 정보
RoHS compliance inferred from the 'N' suffix in the MPN (Altera/Intel convention for Pb-free finish). The APEX II family predates formal AEC-Q100 qualification for automotive, so this part is not AEC-Q100 qualified; it is intended for telecom, industrial, and test-instrumentation commercial-grade applications. Halogen-free status was not stated in the legacy datasheet and is marked unknown.
