EP2A40F1020C6N - APEX II 40K LE FPGA, 1020-FBGA | Altera
부품 번호: EP2A40F1020C6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262.5 | $2,625.00 |
| 100 | $235 | $23,500.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $198 | $198,000.00 |
EP2A40F1020C6N 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that lets designers implement arbitrary digital logic through a configuration bitstream rather than masked silicon. APEX II sits within the broader taxonomy of CPLD/FPGA > programmable logic > logic IC > integrated circuit. Compared with older CPLDs, FPGAs like the APEX II family provide register-rich datapaths and on-chip memory, while remaining reprogrammable in-system via JTAG.
Key features include 40,000 logic elements, 655,360 bits of embedded RAM, dedicated MultiCore multipliers for DSP, and support for multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS. The device is powered by a 1.5 V core supply and offers user-selectable I/O voltages, with hot-socketing support for live insertion applications.
The APEX II architecture combines four types of structured ASIC blocks — LUTs, product-term logic, dual-port RAM, and high-speed MultiCore multipliers — on a single die. This heterogeneous fabric allows the EP2A40 to accelerate datapath-intensive designs (e.g., FFTs, FIR filters, packet processors) while still handling glue logic and state machines efficiently. The LUT-based elements operate at core speeds well into the 100+ MHz range in typical designs.
Typical applications include high-speed telecom interface cards, ASIC prototyping, custom DSP front-ends, broadcast video processing, and industrial control systems requiring large I/O counts. Its 735 user I/O also suit backplane bridging, where many buses must be observed or driven simultaneously.
Designers should plan for the 1020-ball FBGA as a fine-pitch (likely 1.27 mm or 1.0 mm pitch) package requiring multilayer PCB with buried vias, controlled-impedance traces, and matched-length routing for LVDS/clock pairs. Power-rail sequencing and decoupling follow standard Altera APEX II reference designs.
This page consolidates distributor availability, APEX II same-family drop-in alternatives, and design considerations not found in the original 99-page Altera APEX II datasheet — useful when the original part is in tight supply.
드롭인 대체품: EP2A40F1020C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A40F1020C6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, System Gates, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A40F1020C6
✅ 드롭인✓ 재고 있음
$149 / 개
데이터시트 보기 →EP2A40F1020C8ES
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$185.25 / 개
데이터시트 보기 →EP2A40F1020C9
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$160 / 개
데이터시트 보기 →EP2A25F1020C8ES
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$165 / 개
데이터시트 보기 →EP2A40F1020C6N 최대 정격 & 전기적 특성
| Series | APEX II |
| Family | APEX II (EP2A) |
| Logic Elements | 40,000 |
| Embedded RAM Bits | 655,360 bits |
| User I/O Pins | 735 |
| 패키지 | FBGA-1020 |
| Core Voltage | 1.5 V (typical) |
| Speed Grade | C6 |
| Process Technology | 0.15 µm |
| MultiCore Multipliers | Yes (DSP blocks) |
| Configuration Method | JTAG / Passive Serial |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, LVDS |
| Dual-Port RAM | Yes (embedded) |
| RoHS 상태 | unknown |
| 실장 유형 | Surface Mount (BGA) |
EP2A40F1020C6N fbga-1020 핀 구성 가이드
EP2A40F1020C6N(fbga-1020 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A40F1020C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A40F1020C6N 적합 용도: 6 애플리케이션s: ASIC Prototyping, High-Speed Telecom Interface Cards, Custom DSP Front-Ends, Broadcast Video Processing, Industrial Control and Backplane Bridging, Test & Measurement Instrumentation.
ASIC Prototyping
The EP2A40F1020C6N's 40,000 logic elements and 655,360 bits of embedded dual-port RAM make it a strong fit for ASIC prototyping where a target ASIC must be mapped onto programmable logic. The LUT/dual-port-RAM/MultiCore-mixer fabric mirrors many ASIC datapath structures, allowing designers to validate RTL behavior at near-ASIC clock rates. With 735 user I/O, even I/O-heavy ASIC designs (multiple memory buses, parallel interfaces) can be brought onto a single device. Placed on a standard 1020-FBGA carrier PCB, the EP2A40 lets prototype bring-up proceed in parallel with backend ASIC tape-out, shrinking development schedules.
추천
High-Speed Telecom Interface Cards
Telecom line cards demand many I/O for parallel TDM buses, status/control signals, and backplane interfaces — exactly where the EP2A40F1020C6N's 735 user I/O and LVDS/LVCMOS/PCI/SSTL support excel. MultiCore multipliers accelerate V.42bis, Reed-Solomon, or convolutional coding blocks, while dual-port RAM provides packet buffers and elastic stores. Operating from a 1.5 V core, the device fits within typical telecom blade power budgets and supports hot-socketing for live line-card replacement. The 1020-FBGA package's high pin density suits the compact ATCA/AMC form factors used in central-office equipment.
추천
Custom DSP Front-Ends
The MultiCore multipliers and embedded dual-port RAM in the EP2A40F1020C6N accelerate FIR filters, FFTs, and adaptive equalizers. With 40K logic elements, designers can pipeline several filter stages or instantiate parallel FFT engines; 655 Kbits of RAM holds coefficient tables and twiddle factors. The 1020-FBGA package's matched-length routing capability is critical for LVDS ADC/DAC interfaces used in software-defined radio and instrumentation. Operating at typical 100+ MHz internal rates, the device comfortably handles video-rate DSP and intermediate-frequency signal processing for wireless infrastructure.
추천
Broadcast Video Processing
Broadcast video processing engines demand parallel pixel pipelines operating at 27-148.5 MHz, and the EP2A40F1020C6N's 40K logic elements plus 735 user I/O comfortably accommodate SDI input/output, de-interlacers, scalers, and color-space converters on a single die. Embedded dual-port RAM acts as line buffers and frame-store, while MultiCore multipliers handle scaling and chroma-keying blends. The wide I/O count allows direct connection to multiple parallel video buses without external muxing. The 1020-FBGA package supports controlled-impedance routing required for SDI at 270 Mbps and HD-SDI at 1.485 Gbps.
추천
Industrial Control and Backplane Bridging
Industrial backplanes often combine legacy parallel buses (VME, ISA, custom), modern serial links, and many discrete GPIO, and the EP2A40F1020C6N's 735 user I/O make it a natural bridging hub. The 40K logic elements handle bus protocol translation, while embedded dual-port RAM buffers data between domains. The 1.5 V core and SSTL I/O support give clean signal integrity for industrial-grade backplanes with moderate switching noise. Hot-socketing capability enables field-replaceable modules, and the 1020-FBGA package's mechanical stability suits vibration-prone environments when properly PCB-mounted.
추천
Test & Measurement Instrumentation
ATE and bench instruments need a flexible logic core to implement custom protocols, stimulus generation, and result capture, and the EP2A40F1020C6N fits well with 40K logic elements, 655 Kbits of RAM for pattern storage, and 735 I/O for high-pin-count DUT interfaces. MultiCore multipliers accelerate DSP-based measurements such as FFT analysis or RMS computation. JTAG configuration simplifies lab bring-up, and the 1020-FBGA package's high pin count keeps external bus-switching ICs to a minimum. Long-term availability concerns from the obsolete lifecycle status are mitigated by stocking and broker supply chains.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A40F1020C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A40F1020C6 | EP2A40F1020C8ES | EP2A40F1020C9 | EP2A25F1020C8ES |
|---|---|---|---|---|---|
| Brand | Altera (Intel FPGA legacy) | Altera | Altera | Altera | Altera |
| Package | FBGA-1020 | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 (-37.5%) |
| Embedded RAM Bits | 655,360 | 655,360 | 655,360 | 655,360 | 409,600 |
| User I/O Pins | 735 | 735 | 735 | 735 | 735 |
| Speed Grade | C6 | C6 | C8 (slower bin) | C9 (faster bin) | C8 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest logic element density in APEX II family (vs EP2A25F1020C8ES)
- C6 speed grade balances speed and power (vs EP2A40F1020C9)
- 'N' suffix indicates lead-free / RoHS-compliant finish (vs EP2A40F1020C6)
설계 노트
The 1020-ball FBGA package on the EP2A40F1020C6N requires multilayer PCB with buried and blind vias, controlled-impedance traces, and matched-length routing for LVDS/clock pairs. Use at minimum a 6-layer stackup with dedicated ground and power planes; for full 735-I/O utilization, an 8- or 10-layer stackup is recommended. Ball pitch and exact keep-out dimensions must be taken from the Altera APEX II package specification, not generic FBGA assumptions — pitch and ball diameter vary by device speed grade and assembly house capability.
Estimated: based on a typical APEX II 40K-LE design at 100 MHz core, plan for 3-5 W core power at 1.5 V plus I/O power proportional to switching activity. Provide at least 4-6 bulk 100 µF tantalum or polymer capacitors plus 0.1 µF and 0.01 µF ceramic decoupling per 10-20 balls. Implement a proper power-up sequence (1.5 V core before VCCIO, or per Altera's recommended sequence) to avoid latch-up; an LTC/simple-sequencer IC or FPGA-supervisor is recommended for production boards.
Because the EP2A40F1020C6N is obsolete, do not design it into new production runs without a long-term stocking agreement from a broker — supply volatility is high. Verify each shipment's date/lot code against Altera/Intel authorized distributor records to avoid counterfeit risk; the obsolete status makes it a frequent target. New designs should target Cyclone V/10, Stratix 10, or Agilex families with pin-compatible footprints via Altera's migration guides.
Estimated: for the 1020-FBGA package with typical APEX II power dissipation of 3-5 W, plan thermal dissipation through the PCB rather than a heatsink. Use thermal vias under the BGA (per the package datasheet's thermal-ball pattern), copper pours on top/bottom layers, and a minimum of 4-layer stackup with continuous ground planes. Junction-to-ambient thermal resistance (theta_JA) of the 1020-FBGA is on the order of 15-20 C/W on a typical 8-layer board; verify with the package-specific thermal model from Altera for production design.
규정 준수 정보
Lead-free per the 'N' suffix in the ordering code. RoHS compliance is inferred from the N designation; explicit Altera/Intel RoHS certificate was not located in the verified web data.
