EP2A70B724C9N - APEX II 70K FPGA, 724-FCBGA | Intel / Altera
부품 번호: EP2A70B724C9N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $195 | $195,000.00 |
EP2A70B724C9N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be re-programmed to implement arbitrary digital logic functions. FPGAs sit in the digital IC hierarchy as: FPGA -> Programmable Logic Device (PLD) -> Logic IC -> Integrated Circuit -> Semiconductor. The APEX II family targets high-performance, multi-gate designs such as telecommunication infrastructure, high-speed datapath processing, and ASIC prototyping, bridging the gap between mid-range CPLDs and full custom ASICs.
Key features include 3 M system gates, 67,200 logic cells, embedded memory blocks, four phase-locked loops (PLLs) for clock management, multi-standard I/O support including LVDS, and 198 MHz internal operation. The 0.15 µm process technology reduces die size while delivering low static power, and the FCBGA-724 package offers a thermal-resistance advantage suitable for high-utilization designs. Each APEX II device is built around Look-Up Table (LUT)-based logic elements combined with a hierarchical interconnect fabric optimized for predictable timing closure.
The architecture combines LUT-based logic elements, embedded system blocks (ESBs) for RAM/ROM, fast interconnect, and on-chip PLLs for clock synthesis. This combination enables designers to absorb entire subsystems — including memory controllers, datapath engines, and bus interfaces — into a single device, eliminating the need for multiple CPLDs or ASIC gates. The 3 M system-gate rating positions the EP2A70 well above mid-range FPGAs in capacity and below high-end Stratix-class devices.
Typical applications include telecommunications line cards, ASIC prototyping, high-speed image processing pipelines, network switches/routers, and DSP co-processing. The 724-pin FCBGA package supports dense I/O layouts required by parallel bus architectures and high-pin-count memory interfaces. APEX II devices are commonly deployed in designs migrated from APEX 20KE families where higher logic density or extended I/O is needed.
When designing with this part, ensure robust 1.5 V core power decoupling with low-ESR ceramic capacitors placed adjacent to every VCC/VCCIO pin pair. The FCBGA-724 package requires controlled-impedance PCB stack-up and microvia technology; reflow profile must respect the 724-ball mass and the moisture sensitivity level (MSL) preconditioning. Signal integrity at 198 MHz operation demands matched-length routing and proper termination on LVDS pairs.
This page synthesizes distributor pricing, drop-in alternatives from the same APEX II family, and practical design notes not found in the manufacturer datasheet, helping engineers select, source, and integrate the EP2A70B724C9N efficiently.
드롭인 대체품: EP2A70B724C9N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A70B724C9N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, System Gates, Configuration Method, Maximum Internal Frequency.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A70B724C9
✅ 드롭인✓ 재고 있음
$998.27 / 개
데이터시트 보기 →EP2A70B724C9ES
✅ 드롭인✓ 재고 있음
$1250 / 개
데이터시트 보기 →EP2A70B724C8N
✅ 드롭인✓ 재고 있음
$240 / 개
데이터시트 보기 →EP2A70B724C7N
✅ 드롭인✓ 재고 있음
$188 / 개
데이터시트 보기 →EP2A40B724C9N
✅ 드롭인✓ 재고 있음
$99.5 / 개
데이터시트 보기 →EP2A70B724C9N 최대 정격 & 전기적 특성
| Family | APEX II |
| Series | EP2A70 |
| Device Logic Elements | 67,200 cells |
| System Gates | 3,000,000 |
| Process Technology | 0.15 µm CMOS |
| Core Voltage (VCCINT) | 1.5 V nominal (1.425 V – 1.575 V) |
| Maximum Internal Frequency | 198 MHz |
| User I/O Pins | 536 |
| 패키지 | 724-pin FCBGA |
| 실장 유형 | Surface Mount (BGA) |
| Propagation Delay | 2.87 ns |
| PLLs | 4 |
| I/O Standards | LVDS, LVTTL, LVCMOS, PCI, GTL+ (per APEX II datasheet) |
EP2A70B724C9N 724-pin fcbga 핀 구성 가이드
EP2A70B724C9N(724-pin fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A70B724C9N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A70B724C9N 적합 용도: 6 애플리케이션s: Telecommunications Line Card Processing, ASIC Prototyping and Emulation, High-Speed Image Processing Pipeline, Network Switch and Router Fabric, DSP Co-Processing and Acceleration, Industrial Automation and Control.
Telecommunications Line Card Processing
The EP2A70B724C9N's 3 M system gates and 67,200 logic elements make it well-suited for telecom line-card datapath processing where parallel protocol handling and high-throughput state machines are required. The 198 MHz internal frequency and 536 user I/O lines support multi-channel framers, traffic managers, and ATM/Packet-over-SONET interfaces. PLLs allow recovery of multiple telecom-grade clocks from a single reference oscillator, simplifying board-level clock trees. Compared to a CPLD stack, the APEX II absorbs the entire line-card glue logic plus protocol-aware datapath into one device, reducing board area and BOM cost in legacy telecom infrastructure.
추천
ASIC Prototyping and Emulation
Engineers use the EP2A70B724C9N as an ASIC prototype platform because its 3 M system gates can map large ASIC RTL blocks at near-final timing. The 0.15 µm CMOS process and APEX II architecture are well-characterized, and Quartus II provides mature synthesis, place-and-route, and timing-analysis flows that allow engineers to validate an ASIC before committing to mask costs. The 724-pin FCBGA exposes up to 536 I/O, which is enough to emulate wide ASIC busses and external memory interfaces. This drastically reduces pre-silicon verification risk by running real-world workloads on FPGA hardware months before ASIC tape-out.
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High-Speed Image Processing Pipeline
The 3 M system gates and 198 MHz fabric of the EP2A70B724C9N can absorb real-time image processing pipelines for medical imaging, machine vision, and broadcast video. Its 536 user I/O support wide parallel sensor buses, while embedded memory blocks (ESBs) provide on-chip line buffers and convolution kernels to minimize external memory accesses. The four PLLs generate pixel clocks, line-sync timing, and DDR memory clocks from a common reference. Compared with discrete DSP+ASIC solutions, a single APEX II FPGA simplifies PCB layout and allows late-stage algorithm changes by re-programming the device.
추천
Network Switch and Router Fabric
The EP2A70B724C9N is well-matched to mid-range network switches and routers because its 67,200 logic elements can implement multi-port MACs, lookup engines, and QoS schedulers while the 536 I/O lines provide direct parallel connectivity to PHY devices and switch fabrics. The 198 MHz fabric supports gigabit-rate packet processing with deterministic latency, and PLLs synthesize multiple port-rate clocks from one reference. The 724-pin FCBGA package also enables direct attach to high-density parallel busses like SPI-4.2 or Interlaken, which legacy switch ASICs commonly expose.
추천
DSP Co-Processing and Acceleration
The EP2A70B724C9N's 3 M system gates and 67,200 logic elements can implement multi-channel FIR/IIR filters, FFT engines, and radar/wireless baseband blocks as FPGA co-processors paired with a host CPU or DSP. The 198 MHz fabric and embedded ESBs allow sustained 16-bit MAC operations at sample rates suitable for voice-band, ultrasonic, and narrowband radio processing. Four PLLs generate the multiple sample-rate clocks needed in multi-mode radios. Compared with running the same workload in software, an APEX II co-processor reduces host-CPU load and improves deterministic response in real-time DSP chains.
추천
Industrial Automation and Control
The EP2A70B724C9N suits industrial automation controllers where deterministic, parallel I/O handling, motor-control PWM generation, and protocol bridging are required in a single device. The 536 user I/O can directly drive multi-axis stepper/servo interfaces, encoder counters, and field-bus transceivers. The 198 MHz fabric allows closed-loop control loops at sub-microsecond period, while PLLs generate precisely phased PWM carriers. Housed in a robust FCBGA-724 package, the device is appropriate for industrial-grade hardware when paired with proper thermal management and conformal coating.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A70B724C9N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A70B724C9 | EP2A70B724C9ES | EP2A70B724C8N | EP2A70B724C7N | EP2A40B724C9N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 724-pin FCBGA | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 1,500,000 |
| Logic Elements | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 40,960 |
| Maximum Internal Frequency | 198 MHz | 198 MHz | 198 MHz | slightly slower (C8 grade) | slowest (C7 grade) | 198 MHz |
| User I/O | 536 | 536 | 536 | 536 | 536 | 536 |
| Speed Grade | C9 (fastest) | C9 | C9 | C8 | C7 | C9 |
| Lifecycle Status | NRND (legacy) | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Highest speed grade (C9) in the EP2A70 724-FCBGA family (vs EP2A70B724C8N)
- Doubled logic density over EP2A40 in the same 724-FCBGA footprint (vs EP2A40B724C9N)
- Extended-temperature C9 variant available for harsh-environment designs (vs EP2A70B724C9ES)
설계 노트
Estimated: at 198 MHz with 67,200 logic elements at typical 30% toggle rate, the EP2A70B724C9N core draws approximately 1.5–2.5 A from the 1.5 V VCCINT rail. Designers must provide low-impedance power delivery with at least four 10 µF X5R ceramic capacitors and one 47 µF tantalum bulk capacitor placed adjacent to the package. Independent VCCIO rails for each I/O bank are required if multiple I/O standards coexist; place 0.1 µF + 10 µF decoupling per VCCIO pin pair to suppress switching noise.
The 724-pin FCBGA package demands a controlled-impedance PCB stack-up with microvia technology for breakout routing. Use a 1.0 mm or 1.27 mm pitch BGA fan-out with at least two routing layers and a continuous ground plane directly under the device to control return paths. Matched-length routing (±50 mil tolerance) is required for any LVDS or high-speed parallel bus at 100 MHz+. Reflow profile must respect J-STD-020 moisture sensitivity; FCBGA devices typically require MSL-3 or better handling and dry-pack storage before assembly.
Estimated: at full 198 MHz operation with the entire fabric active, the EP2A70B724C9N dissipates approximately 4–6 W through its FCBGA-724 thermal pad. Designers should attach the central thermal pad to a 1 oz copper inner-plane via a 4×4 thermal via array (0.3 mm drill, 0.5 mm pitch) to spread heat to the opposite-side copper pour. Forced-air cooling or a low-profile heatsink is recommended for ambient temperatures above 55 °C or for fully enclosed industrial enclosures without airflow.
Do not exceed the maximum I/O bank current limit when assigning LVDS or PCI signals to one side of the device. Configuration mode selection (PS, AS, JTAG) must be set with proper pull-up/pull-down resistors during board bring-up, or the device may fail to enter user mode. Always check the Quartus II fitter report for unrouted nets before committing to board layout — APEX II routing congestion around embedded memory blocks is a frequent cause of timing closure failures. The device is NRNR as of 2026-09-08, so production designs should plan a migration path to a Cyclone or Stratix family.
규정 준수 정보
Specific RoHS/REACH compliance and lead-free status not present in the verified web data. The EP2A70B724C9ES variant is typically specified for industrial/military temperature grades. Confirm with Intel (Altera) documentation or distributor CoC before compliance-critical procurement.