EP2A70B724I-9 - APEX II FPGA 70K LE, BGA-724, -9 Speed | Altera / Intel
부품 번호: EP2A70B724I-9 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1325 | $13,250.00 |
| 100 | $1185 | $118,500.00 |
| 500 | $1050 | $525,000.00 |
| 1,000 | $925 | $925,000.00 |
EP2A70B724I-9 개요
APEX II (Advanced Programmable Element Matrix II) is Altera's second-generation MultiCore architecture FPGAs that combine look-up-table (LUT) logic, embedded system blocks (ESBs) for memory, and a hierarchical row/column interconnect for predictable timing closure. They are positioned in Altera's product hierarchy as APEX II -> APEX family -> SRAM-based programmable logic -> FPGA -> programmable logic device -> semiconductor. APEX II devices were widely adopted in high-density glue logic, data-path processing, and pre-SOC prototyping designs of the late 1990s and early 2000s.
Key features include high-density fine-grained logic with 70K typical LEs, 4,290 Kbits of embedded system block (ESB) memory for distributed RAM and FIFO applications, and the MultiCore interconnect that provides predictable row-and-column based routing. The -9 speed grade targets higher clock-frequency designs versus the slower -10 bin. The 'I' suffix designates the industrial temperature range (-40C to +100C operating), making it suitable for harsh-environment deployments. The BGA-724 package with 1.27 mm pitch is the largest in the APEX II family and supports maximum user I/O for dense interconnect.
Typical applications include high-performance data-path processing, telecom protocol engines, network switch fabric, and legacy high-density glue-logic replacement. The large embedded memory count makes it suitable for FIFO-intensive designs such as ATM/SDH framers and base-station channel cards. APEX II devices retain an installed base in industrial control and military/aerospace systems where long lifecycle support and ITAR/legacy compatibility matter more than raw modern Fmax.
When designing with the EP2A70B724I-9, engineers must use the legacy Altera Quartus II design tool (versions 4.x-9.x recommended) since later Quartus versions dropped APEX II device support after Altera's 2010+ portfolio refresh. Configuration requires an EPC4, EPC8, or EPC16 enhanced configuration device or a passive serial/PROM-based boot. Decoupling guidelines call for at least 12 bulk + 24 high-frequency capacitors distributed around the BGA power pins to control simultaneous switching noise.
드롭인 대체품: EP2A70B724I-9 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A70B724I-9 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Logic Elements, I/O Standards Supported.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A70B724I-8
✅ 드롭인✓ 재고 있음
$119 / 개
데이터시트 보기 →EP2A70B724I-7
✅ 드롭인✓ 재고 있음
$245 / 개
데이터시트 보기 →EP2A70B724C9
✅ 드롭인✓ 재고 있음
$998.27 / 개
데이터시트 보기 →EP2A70B724C9N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2A70B724C9ES
✅ 드롭인✓ 재고 있음
$1250 / 개
데이터시트 보기 →EP2A40B724I-9
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$605 / 개
데이터시트 보기 →EP2A40B724I-8
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$280 / 개
데이터시트 보기 →EP2A70B724I-9 최대 정격 & 전기적 특성
| Family | APEX II |
| Logic Elements (typical) | 70,000 |
| Embedded RAM (ESB bits) | 4,290 Kbit |
| 패키지 | BGA-724 |
| Speed Grade | -9 |
| 동작 온도 | -40C to +100C (industrial, 'I' suffix) |
| Supply Voltage Core | 1.5 V (typical) |
| Supply Voltage I/O | 3.3 V (typical, multi-voltage I/O banks supported) |
| Configuration Method | Passive Serial, Passive Parallel, EPC4/EPC8/EPC16 enhanced configuration devices |
| Peak Reflow Temperature | 220 C |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | unknown |
EP2A70B724I-9 bga-724 핀 구성 가이드
EP2A70B724I-9(bga-724 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A70B724I-9.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A70B724I-9 적합 용도: 7 애플리케이션s: Telecom Protocol Engine, High-Density Data-Path Processing, Network Switch Fabric Interface, Legacy Industrial Control, Test and Measurement Instrumentation, Military / Aerospace Legacy Programs, Pre-SOC Prototyping.
Telecom Protocol Engine
The EP2A70B724I-9 fits telecom protocol engines because its 70K logic elements and 4,290 Kbits of embedded system block (ESB) RAM enable parallel processing of cell/packet headers, CRC generation/checking, and FIFO buffering across high-bandwidth links. In SDH/SONET framer and ATM switch fabric designs, the FPGA's MultiCore interconnect provides the predictable row/column routing essential for meeting tight ATM cell- and SDH frame-timing budgets. Industrial-grade temperature operation supports outdoor cabinet deployments where commercial-grade parts would thermally fail. Designers chain the EP2A70B724I-9 to an EPC8 configuration device to boot at power-on without external MCU intervention.
추천
High-Density Data-Path Processing
The EP2A70B724I-9's combination of 70K LUT-based logic elements and 4,290 Kbits of distributed ESB memory makes it well matched to wide-bit data-path designs such as HDLC framers, video encoders, and DSP pre-processors. The MultiCore interconnect distributes registers and ALU-like logic across multiple MegaLAB structures, supporting 32-bit and 64-bit datapath pipelining at 100+ MHz clock frequencies in the -9 speed grade. Industrial temperature support lets the part ride in chassis-side blade systems with elevated airflow temperatures. Compared to early-2000s ASIC NRE, the APEX II offers similar logic density with field-upgradable bitstreams.
추천
Network Switch Fabric Interface
Switch fabric cards of the late 1990s and early 2000s relied on APEX II-class FPGAs like the EP2A70B724I-9 to bridge multiple PHYs/MACs to the central switching ASIC. The BGA-724's high pin count exposes enough user I/O for 8-16 simultaneous Gigabit Ethernet MAC interfaces, while 4,290 Kbits of ESB memory buffers packet bursts between line-rate ingress and the switching core. Industrial temperature supports line-card deployments in thermally loaded chassis. Configuration via passive serial with an EPC8 keeps the BOM small for cost-sensitive line cards.
추천
Legacy Industrial Control
Many factory-automation controllers continue to use APEX II FPGAs like the EP2A70B724I-9 because the installed base, certified firmware, and long-life replacement stocks are mature. The industrial -40C to +100C temperature range meets IEC 60068-2 cold and hot-soak test requirements for shop-floor deployment, while the BGA-724's high I/O count allows direct glue-logic replacement of multiple discrete CPLDs on legacy boards. The -9 speed grade supports deterministic scan-time implementation for PLC backplanes where microsecond jitter is unacceptable.
추천
Test and Measurement Instrumentation
Test-and-measurement platforms (logic analyzers, protocol testers, ATE pin cards) historically used the EP2A70B724I-9 for stimulus generation, response capture, and protocol-decoder logic. Its 4,290 Kbits of ESB memory holds deep capture buffers, while the -9 speed grade meets timing margins of 200 MHz+ parallel interfaces such as LVDS and PCI. Industrial temperature operation supports bench and lab environments without active cooling. Multi-voltage I/O banks interface directly to 1.8 V, 2.5 V, 3.3 V, and 5 V DUT rails without level shifters.
추천
Military / Aerospace Legacy Programs
Long-lifecycle defense and aerospace programs retain the EP2A70B724I-9 because re-design certification of a replacement FPGA in avionics, radar signal conditioning, or electronic warfare subsystems can cost millions and delay deployment by years. The industrial -40C to +100C range supports MIL-STD-810 environmental envelopes, while the BGA-724 package is compatible with long-qualified PCB layouts. Altera has historically supported APEX II in long-life-buy programs for defense customers. The -9 speed grade delivers deterministic timing for radar DSP pre-processing and serial-bus bridging.
추천
Pre-SOC Prototyping
Before ASIC/SOC fabrication, designers prototype the system in APEX II-class FPGAs such as the EP2A70B724I-9 because the 70K LE count and embedded memory provide enough headroom for an entire SOC's peripheral set plus a soft processor. The MultiCore interconnect offers realistic timing closure that closely predicts ASIC synthesis results, improving pre-tapeout sign-off confidence. BGA-724 high I/O count exposes ample pins for ASIC boundary-signal breakout. Industrial temperature rating lets engineers validate prototypes in the actual deployment chassis before ASIC silicon returns.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A70B724I-9 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A70B724I-8 | EP2A70B724I-7 | EP2A70B724C9 | EP2A70B724C9N | EP2A40B724I-9 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | BGA-724 | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same |
| Logic Elements | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 | 40,000 |
| Speed Grade | -9 | -8 (slower) | -7 (slowest) | -9 | -9 | -9 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| RoHS / Lead-Free | unknown | unknown | unknown | unknown | RoHS / lead-free (N suffix) | unknown |
| Approx. Unit Price (USD, qty 1) | 1,450 | ~1,250 | ~1,150 | ~1,400 | ~1,420 | ~1,200 |
주요 차별점
- Faster speed grade within same BGA-724 footprint (vs EP2A70B724I-8)
- Industrial temperature vs commercial-temperature -9 alternatives (vs EP2A70B724C9)
- Highest density drop-in vs the EP2A40 family (vs EP2A40B724I-9)
설계 노트
Estimated: at VCCINT=1.5V, full 70K-LE utilisation at 50% toggle rate, the EP2A70B724I-9 dissipates approximately 3-5 W. The BGA-724 thermal resistance is design-dependent on PCB stack-up and copper area - target at least 4-layer FR-4 with continuous inner-plane copper under the BGA to keep junction temperature below 100C. Add a thermal pad array under the package and consider aluminium heatsinks for high-ambient (>70C) industrial cabinets.
The EP2A70B724I-9 requires separate VCCINT (1.5 V core), VCCIO (3.3 V typical, with bank-selectable 1.8/2.5/3.3 V I/O voltages), and VCCPD (3.3 V) supplies. Decoupling guidelines call for 100 nF X7R capacitors on every VCC pin pair and at least four 47 uF bulk capacitors around the BGA perimeter. Sequence VCCINT before VCCIO/VCCPD to avoid I/O latch-up during power-up; add a soft-start controller if hot-plugging is required.
BGA-724 with 1.27 mm pitch requires PCB microvia stack-ups (laser-drilled 0.30-0.45 mm vias on 1.27 mm grid) on at least 6-layer stack-up. Fan-out routing must respect 50 ohm impedance-controlled traces for clock and high-speed I/O such as LVDS. Place configuration EPC8/EPC16 device within 50 mm of the FPGA to minimise passive-serial trace length, and route nSTATUS/nCONFIG/CONF_DONE as 4-wire impedance-matched buses with series-termination resistors near the FPGA end.
Newer Quartus versions (10.0+) dropped APEX II device support - use Quartus II 9.1 SP2 or earlier for bitstream generation. Programming files generated by Quartus Prime or Quartus Pro will NOT support the EP2A70B724I-9. Pin descriptions in the APEX II Pin Information file (.pin) must be cross-checked against the EP2A70B724I-9 device pinout, since the EP2A40 and EP2A70 in the same BGA-724 package share most but not all user I/O assignments on dedicated clock pins.
APEX II LVDS inputs require external 100-ohm differential termination across the receiver pair - the FPGA does NOT include on-die termination. For DDR-style source-synchronous interfaces, route data and clock traces on the same layer with matched length tolerance of +/-25 mils. Simultaneous switching noise (SSN) on the 33 x 33 BGA can corrupt clocks; use internal VREF pins for SSTL/HSTL standards and add 0.1 uF + 10 uF decoupling stacks within 100 mils of each switching I/O bank.
규정 준수 정보
Part is obsolete - original Altera/Intel compliance documentation no longer published on the manufacturer's current site. RoHS/REACH data not available in the verified web data set; verify with distributor documentation if compliance is required.
