EP2A70B724I8 - APEX II 70K LE FPGA 724-FCBGA | Altera
부품 번호: EP2A70B724I8 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 250 | $228 | $57,000.00 |
| 500 | $210 | $105,000.00 |
EP2A70B724I8 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect that can be reconfigured by the customer after manufacture. APEX II devices sit in the high-density, multi-standard I/O tier of the Altera product tree: FPGA -> programmable logic -> programmable logic IC -> semiconductor. Each LE is paired with a four-input lookup table, a programmable register, and dedicated carry chain logic, while embedded system blocks (ESBs) implement dual-port RAM, ROM, and CAM. The combination makes APEX II suitable for bus interfaces, on-chip datapaths, and glue-logic consolidation.
Key features of the EP2A70B724I8 include 67200 LEs, 3 M system gates, embedded multiplier support, True-LVDS and high-speed I/O standards, and a dedicated phase-locked loop (PLL) block for clock multiplication and deskew. The device supports active serial, passive serial, and passive parallel asynchronous configuration modes through the EPC4/EPC8/EPC16 enhanced configuration devices, and in-system programmability via JTAG (IEEE 1149.1). Each I/O bank is independently powered, allowing mixed-voltage interfacing (1.5 V, 1.8 V, 2.5 V, 3.3 V) on the same die.
The architecture is built on a 0.15 µm metal-layer CMOS process with eight layers of interconnect for low-skew global clock distribution. The embedded system block memory ranges to hundreds of kilobits and can be concatenated horizontally or vertically. TriMatrix memory supports per-bit write-masking and mixed-width data ports. The PLL block generates up to four derivative clocks with sub-100 ps jitter, while the MultiTrack interconnect minimizes routing congestion in dense designs.
Typical applications include telecommunications line cards, high-speed serial protocol bridging (UTOPIA, SPI-4.2, POS-PHY), DSP co-processing front-ends, and industrial control backplanes. The wide LVDS I/O count makes it well suited to bus multiplexing and parallel-to-serial concentration tasks.
When designing with this part, plan for a 1.5 V core supply, four PLL analog supplies (VCC_PLL pins), and careful bank voltage grouping; the 724-pin FCBGA requires a multilayer PCB with microvia fan-out. Use the Quartus II design software (legacy support) for synthesis, place-and-route, and timing closure; signal-integrity simulations should account for simultaneous switching noise on the 1.5 V rail.
This page consolidates distributor stock, drop-in same-package alternatives, and practical design notes for engineers sourcing the EP2A70B724I8 outside of Avnet/Mouser long-term contracts.
드롭인 대체품: EP2A70B724I8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A70B724I8 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, System Gates, Logic Elements, Maximum Internal Frequency.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A70B724C8
✅ 드롭인✓ 재고 있음
$1250 / 개
데이터시트 보기 →EP2A70B724C8N
✅ 드롭인✓ 재고 있음
$240 / 개
데이터시트 보기 →EP2A70B724I7N
✅ 드롭인✓ 재고 있음
$218 / 개
데이터시트 보기 →EP2A70B724I7
✅ 드롭인✓ 재고 있음
$198.5 / 개
데이터시트 보기 →EP2A70B724I-8
✅ 드롭인✓ 재고 있음
$119 / 개
데이터시트 보기 →EP2A70B724I-7
✅ 드롭인✓ 재고 있음
$245 / 개
데이터시트 보기 →EP2A70B724C9N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2A70B724C9
✅ 드롭인✓ 재고 있음
$998.27 / 개
데이터시트 보기 →EP2A70B724I8 최대 정격 & 전기적 특성
| Family | APEX II |
| Logic Elements (LEs) | 67200 |
| System Gates | 3 M (typical maximum) |
| Process Technology | 0.15 µm CMOS |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 281 MHz (typical) |
| 패키지 | 724-pin FCBGA |
| 핀 수 | 724 |
| Operating Temperature (Industrial) | -40 °C to +100 °C |
| Speed Grade | 8 |
| Embedded Memory | ESB / TriMatrix (size not in provided data) |
| Configuration Modes | Active Serial, Passive Serial, Passive Parallel Asynchronous |
| Supported I/O Standards | LVTTL, LVCMOS, SSTL, LVDS (True-LVDS), PCI, HSTL |
| 실장 유형 | Surface Mount (BGA) |
| Configuration Device Compatibility | EPC4, EPC8, EPC16 (Enhanced Configuration Devices) |
| Design Software | Quartus II (legacy support) |
EP2A70B724I8 724-pin fcbga 핀 구성 가이드
EP2A70B724I8(724-pin fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A70B724I8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A70B724I8 적합 용도: 7 애플리케이션s: Telecommunications Line-Card Interface, DSP Co-Processing Front-End, Industrial Control Backplane Bridging, High-Speed Parallel-to-Serial Concentration, Aerospace Avionics Data Concentrator, Medical Imaging Pre-Processing, Legacy Network Switching Fabric Glue.
Telecommunications Line-Card Interface
The EP2A70B724I8 is well suited for high-density telecom line cards because of its 67200 LEs, embedded memory blocks, and True-LVDS I/O support. The device can implement UTOPIA, SPI-4.2, or POS-PHY Level 3 bridging between network processors and framer/mapper ASICs in a single chip. With industrial temperature rating (-40 °C to +100 °C), it tolerates the airflow temperatures inside central-office racks. Designers should allocate separate I/O banks per voltage domain to mix 1.5 V LVDS with 3.3 V LVCMOS control signals on the same die.
추천
DSP Co-Processing Front-End
With up to 3 M system gates and embedded multiplier blocks, the EP2A70B724I8 acts as a parallel pre-processor that performs filtering, FFT pre-conditioning, and protocol decode before handing data to a host DSP or ASIC. The 281 MHz internal Fmax supports 16-tap FIR filtering at 100 MSPS with headroom for sample-rate conversion. The dedicated PLL block generates low-jitter derivative clocks for the multiplier array, minimizing spurious content in spectral-sensitive applications. Pin compatibility with EP2A70B724I7N enables drop-in upgrades when timing margin is too tight.
추천
Industrial Control Backplane Bridging
The industrial temperature rating and 1.5 V low-power operation make the EP2A70B724I8 a reliable glue-logic hub on factory automation backplanes. It bridges legacy 5 V peripheral buses to modern 3.3 V or 2.5 V controllers, implements motor-control state machines, and provides per-channel fault isolation. Its 724-pin FCBGA package offers sufficient I/O count for parallel encoder interfaces, while embedded ESBs implement buffer RAM for asynchronous transfer between clock domains. Estimated power dissipation at typical industrial workloads: 3-5 W.
추천
High-Speed Parallel-to-Serial Concentration
The True-LVDS I/O transceivers of the EP2A70B724I8 aggregate multiple parallel LVDS data streams into a smaller number of high-speed serial links. This is particularly useful in test and measurement equipment where multiple ADC channels must be serialized for off-board transport. The 281 MHz core frequency and dedicated multiplier blocks enable 8B/10B encoding and CRC insertion without external logic. The 724-pin FCBGA's high pin density accommodates both the parallel input banks and the serialized outputs on the same die.
추천
Aerospace Avionics Data Concentrator
Aerospace data-concentrator designs use the EP2A70B724I8 for ARINC 429/664 channel aggregation and MIL-STD-1553 bus bridging. The industrial temperature range is suitable for pressurized avionics bays, though designers typically derate to commercial parts for long-lifecycle programs. The device's JTAG support and in-system programmability enable in-flight reconfiguration. Note: for flight-critical applications, designers should consult DO-254 compliance evidence, which is not available for this obsolete commercial part.
추천
Medical Imaging Pre-Processing
In ultrasound and MRI pre-processing pipelines, the EP2A70B724I8 implements beamforming, FIR filtering, and envelope detection across dozens of channels in parallel. Its embedded memory blocks serve as line buffers for ultrasound scan-line accumulation, while the 67200 LEs hold finite-state machines for adaptive gain control. The 281 MHz Fmax comfortably exceeds the 100 MHz sample rates typical of mid-range imaging systems. Industrial temperature rating supports the controlled thermal environment of diagnostic carts and rack-mounted imaging equipment.
추천
Legacy Network Switching Fabric Glue
The EP2A70B724I8 remains a popular drop-in for legacy 10G/40G switching fabrics that were designed around APEX II glue logic. It implements cell-header editing, congestion-status aggregation, and per-port statistics counters that interface between switch ASICs and CPU management controllers. Despite its obsolete lifecycle, large installed bases continue to use it for in-service upgrades. Designers upgrading legacy hardware can use the EP2A70B724C8 commercial variant for cost savings when industrial temperature is not required.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A70B724I8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A70B724C8 | EP2A70B724C8N | EP2A70B724I7N | EP2A70B724I7 | EP2A70B724I-8 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 724-pin FCBGA | 724-pin FCBGA (same) | 724-pin FCBGA (same) | 724-pin FCBGA (same) | 724-pin FCBGA (same) | 724-pin FCBGA (same) |
| Logic Elements | 67200 | 67200 | 67200 | 67200 | 67200 | 67200 |
| System Gates | 3 M | 3 M | 3 M | 3 M | 3 M | 3 M |
| Speed Grade | 8 | 8 | 7 (faster) | 7 (faster) | 8 | 9 (slower) |
| Operating Temperature | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Industrial temperature grade with same performance envelope (vs EP2A70B724C8)
- Slower speed grade for power-constrained designs (vs EP2A70B724I7N)
- Same die across industrial and commercial variants (vs EP2A40B724I8)
설계 노트
The EP2A70B724I8 requires a stable 1.5 V core supply with peak currents up to 3-5 A during simultaneous switching events. Use a low-ESR ceramic decoupling network of 4-6 × 100 µF bulk capacitors plus 0.1 µF high-frequency bypass on every power pin. Estimated power dissipation at typical industrial workloads (50% utilization, 100 MHz): 4-6 W. Bulk supply ripple must remain below 50 mV pk-pk to avoid PLL jitter degradation.
Estimated: at 6 W dissipation in a 724-pin FCBGA with θJA around 12 °C/W (assuming 4-layer JEDEC test board with airflow), junction temperature rises roughly 72 °C above ambient. For industrial operation up to +100 °C ambient, maximum allowable dissipation is approximately 1.5 W without airflow or 3 W with 200 LFM forced air. Use thermal vias beneath the package thermal pad and a copper spreader for higher power budgets.
The 724-pin FCBGA requires a multilayer PCB with microvia-in-pad or staggered microvia fan-out. Maintain 50 Ω controlled impedance on all high-speed LVDS and clock traces, with length matching within ±50 ps for parallel interfaces. Route four PLL analog VCC pins separately from the digital core supply, with their own ferrite-bead isolation and star-ground topology. Layer stack-up should provide uninterrupted reference planes beneath each BGA row.
Do not assume the trailing 'I' suffix guarantees -40 °C operation; verify the device datasheet's full temperature window. The '8' suffix indicates a slower speed grade than '7' or '6'; mis-ordering between speed grades causes timing closure failures. Avoid mixing leaded and lead-free solder profiles when reworking populated boards - the EP2A70B724I8 is not lead-free unless marked with an 'N' suffix.
규정 준수 정보
RoHS, REACH, and lead-free status not explicitly stated in the provided data; verify against the device marking or Intel/Altera legacy documentation. The 'N' suffix in alternate part numbers typically indicates lead-free balls per Altera convention.