EP2A70B724I9 - APEX II FPGA 3M Gates 724-FCBGA | Altera
부품 번호: EP2A70B724I9 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $215 | $21,500.00 |
| 500 | $185 | $92,500.00 |
| 1,000 | $160 | $160,000.00 |
EP2A70B724I9 개요
What is a FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic fabric, routing, and I/O can be reconfigured by the end user after manufacture. FPGAs sit above general-purpose microcontrollers and below fixed-function ASICs in the programmable-logic taxonomy (FPGA -> programmable logic -> semiconductor IC), offering parallel processing, deterministic timing, and hardware-level customization for data-path acceleration, glue logic, and prototyping. The APEX II family specifically targets high-density, multi-standard I/O designs by integrating up to four embedded system blocks (ESBs) with each ESB providing up to 32 Kbits of dual-port RAM.
Key features of the EP2A70B724I9 include 540 Kbits of embedded memory, 4 phase-locked loops (PLLs) for flexible clock management, support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, and an industrial operating temperature range. The 724-pin FCBGA package provides a high-density interconnect suitable for high-speed designs with numerous differential pairs and high pin-count I/O requirements.
The EP2A70B724I9 architecture combines four-input look-up tables (LUTs) with embedded system blocks and high-speed interconnect, allowing designers to implement both register-rich datapaths and memory-intensive functions in a single device. The PLLs allow multiple clock-domain synthesis and zero-delay buffering for backplane or source-synchronous interfaces such as LVDS and SSTL.
Typical applications include telecommunications infrastructure, network switching and routing equipment, high-speed serial backplanes, digital signal processing (DSP) pipelines, and ASIC prototyping. The high logic density and embedded memory make the EP2A70B724I9 well suited for datapath-heavy designs such as protocol bridges, packet processors, and image-processing front-ends.
When designing with this device, careful attention must be paid to power integrity: the 1.5 V core and PLL supply must be decoupled with low-ESR ceramics placed close to the FCBGA balls, and the high pin count drives a complex multi-layer PCB stack-up. Signal-integrity simulations are recommended for LVDS and high-speed DDR interfaces. This page synthesizes distributor pricing, drop-in alternative MPNs, and design guidance not consolidated on any single distributor page.
드롭인 대체품: EP2A70B724I9 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A70B724I9 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Operating Temperature, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A70B724I8
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP2A70B724I7
✅ 드롭인✓ 재고 있음
$198.5 / 개
데이터시트 보기 →EP2A70B724C9
✅ 드롭인✓ 재고 있음
$998.27 / 개
데이터시트 보기 →EP2A70B724C8
✅ 드롭인✓ 재고 있음
$1250 / 개
데이터시트 보기 →EP2A70B724C7
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2A70B724I-9
✅ 드롭인✓ 재고 있음
$925 / 개
데이터시트 보기 →EP2A40B724I9
✅ 드롭인✓ 재고 있음
$150 / 개
데이터시트 보기 →EP2A70B724I9 최대 정격 & 전기적 특성
| Family | APEX II |
| Logic Elements | 67,200 |
| System Gates | Approximately 3,000,000 |
| Embedded Memory | 540 Kbits (1,146,880 bits total ESB memory per Jotrin listing) |
| Process Technology | 0.15 µm CMOS |
| Core Voltage | 1.5 V |
| Maximum Operating Frequency | 198 MHz |
| Number of PLLs | 4 |
| Embedded System Blocks (ESBs) | 4 |
| 패키지 | 724-pin FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| 실장 유형 | Surface Mount |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, LVDS |
| Configuration Mode | SRAM-based, configurable via JTAG or EPC enhanced configuration devices |
EP2A70B724I9 724-pin fcbga (flip-chip bga) 핀 구성 가이드
EP2A70B724I9(724-pin fcbga (flip-chip bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A70B724I9.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A70B724I9 적합 용도: 7 애플리케이션s: Telecommunications Infrastructure, ASIC Prototyping and Emulation, High-Speed Network Switching, Digital Signal Processing (DSP) Pipelines, Industrial Control and Automation, Legacy Military and Aerospace Avionics Upgrades, Medical Imaging Front-Ends.
Telecommunications Infrastructure
The EP2A70B724I9 fits telecommunications infrastructure such as SONET/SDH framers, multi-protocol label switching (MPLS) engines, and 10G backplane controllers because its 67,200 logic elements and 540 Kbits of embedded memory can map deep queue managers and lookup tables in parallel. The four PLLs support multiple clock domains for line-card and fabric interfaces, while the 198 MHz core speed enables wire-speed processing of packet headers. The 724-pin FCBGA package exposes the high I/O count required for LVDS and SSTL interfaces to SFP modules and backplane connectors. Source: Altera APEX II datasheet (ds_apollo2.pdf).
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ASIC Prototyping and Emulation
The EP2A70B724I9 is a strong ASIC prototyping platform for designs in the 1.5M-3M gate range because its APEX II architecture combines four-input LUTs with embedded system blocks that can emulate ASIC RAM macros. The 198 MHz Fmax enables verification of most synchronous ASIC blocks at near-real-time speed. Designers can map multi-clock ASIC domains to the four on-chip PLLs and use the 724-pin FCBGA for high-fanout signal observability. For larger ASICs, multiple EP2A70B724I9 devices can be time-multiplexed using the JTAG chain.
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High-Speed Network Switching
The EP2A70B724I9 suits high-speed network switches and routers that need parallel lookup engines, TCAM emulators, and packet classifiers. Its 540 Kbits of embedded memory can buffer routing tables and queue descriptors, while the 67,200 logic elements implement CAM match logic and policers. The 198 MHz system clock combined with LVDS I/O allows direct interfacing to 1G/2.5G Ethernet PHYs without external serializer/deserializer overhead. The industrial temperature range supports thermally constrained top-of-rack switch deployments.
추천
Digital Signal Processing (DSP) Pipelines
The EP2A70B724I9 can implement DSP pipelines such as FIR filters, FFT engines, and forward error correction (FEC) decoders because its APEX II fabric includes dedicated multiplier chains within embedded system blocks. The 198 MHz core clock supports up to 198 million multiply-accumulate operations per second when implemented in hard multiplier blocks, and the 724-pin FCBGA exposes the high I/O count required for parallel data-path sampling. JTAG-based debug allows real-time signal observation in the lab.
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Industrial Control and Automation
The EP2A70B724I9 is well suited to industrial control systems such as PLC backplanes, motion controllers, and machine-vision pre-processors because its industrial temperature range (-40C to +100C) tolerates factory-floor thermal stress. The 3M-gate capacity allows integration of multiple motor-control loops or high-speed vision pipelines on a single device, while the LVTTL/LVCMOS I/O standards connect directly to industrial sensors and encoders. The FCBGA package, although advanced, is mechanically robust when properly reflowed and underfilled.
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Legacy Military and Aerospace Avionics Upgrades
The EP2A70B724I9 is found in legacy avionics and military systems where long-life-cycle support is required. Its SRAM-based architecture allows in-theatre reconfiguration via JTAG for mission updates. The 540 Kbits of embedded memory supports sensor-fusion pre-processing, while the 198 MHz Fmax handles INS/GPS navigation and electronic-warfare waveform synthesis. Obsolete-lifecycle status requires careful sourcing with traceability documentation for these high-reliability deployments.
추천
Medical Imaging Front-Ends
The EP2A70B724I9 supports medical imaging front-ends such as ultrasound beamformers, MRI pre-processors, and CT scanner data-acquisition boards. The 67,200 logic elements and 540 Kbits of embedded memory can implement real-time beamforming or digital down-conversion stages. The four PLLs synchronize multi-channel ADC sample clocks, and the LVDS I/O banks interface to high-speed medical-grade ADCs. Industrial temperature operation accommodates the thermal load of hospital equipment racks.
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추천 제품 요약
엔지니어링 참조 데이터: EP2A70B724I9 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A70B724I8 | EP2A70B724I7 | EP2A70B724C9 | EP2A70B724I-9 | EP2A40B724I9 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 724-pin FCBGA | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Logic Elements | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 40,000 (-40%) |
| System Gates | ~3,000,000 | ~3,000,000 | ~3,000,000 | ~3,000,000 | ~3,000,000 | ~1,600,000 (-47%) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | -9 (198 MHz Fmax) | -8 (~10-15% slower) | -7 (~20-25% slower) | -9 (198 MHz Fmax) | -9 (198 MHz Fmax) | -9 (198 MHz Fmax) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest speed grade in the APEX II 724-pin FCBGA family (vs EP2A70B724I8 and EP2A70B724I7)
- Industrial temperature range (vs EP2A70B724C9)
- Maximum logic density within the 724-pin FCBGA package (vs EP2A40B724I9)
설계 노트
The EP2A70B724I9 requires a low-noise 1.5 V core rail (VCCINT) plus separate VCCIO banks for I/O standards. Use a 4-layer PCB with a dedicated power plane for VCCINT and 1-2 low-ESR ceramic capacitors (10 µF + 0.1 µF) within 5 mm of each supply pin. The PLL analog supply (VCCA_PLL) must be filtered with an LC pi-network to minimize jitter, and the JTAG supply must remain active in standby to support in-system configuration.
Estimated: at 198 MHz and 90% logic utilization on the 724-pin FCBGA package, typical core power dissipation is approximately 4-6 W. The FCBGA exposed die requires thermal vias to the bottom PCB copper pour and, in enclosed enclosures, an aluminum heatsink or forced-air cooling. Industrial temperature operation (-40C to +100C) demands junction-to-ambient thermal resistance below 12 C/W for reliable deployment. Use IR thermography during prototype validation.
The 724-ball FCBGA requires a 6+ layer PCB stack-up with microvia technology on the top two layers for breakout. The BGA land pattern must comply with JEDEC MS-034-D standards, and the differential-pair routing for LVDS/LVCMOS must maintain 100 ohm differential impedance with matched lengths within 5 mil tolerance. Place the configuration memory (EPC4, EPC8, or EPC16) within 50 mm of the FPGA to meet passive-serial timing. Include a JTAG header for in-system programming and boundary-scan test.
Do not confuse the 'I9' suffix (industrial, -9 speed grade) with the 'I-9' or 'I8' suffix (different ordering codes for the same die). Always verify the full Altera ordering code with the sales channel before placing production orders. For ASIC prototyping, allocate spare user I/O for debug probes because the high pin count is often fully consumed by application logic. Finally, ensure the configuration bitstream CRC is validated at every power-up to catch SRAM upsets in safety-critical systems.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not explicitly stated in the verified web data. APEX II family predates many of these mandatory declarations. Request Material Declaration (MD-1) from the distributor for production orders.
