EP2AGX45DF25C5N - Arria II GX FPGA, 42K LE, 572-FBGA | Intel / Altera
부품 번호: EP2AGX45DF25C5N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $396.72 | $396.72 |
| 10 | $357.05 | $3,570.50 |
| 100 | $319 | $31,900.00 |
| 500 | $287.1 | $143,550.00 |
| 1,000 | $258.2 | $258,200.00 |
EP2AGX45DF25C5N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that the user configures after manufacture to implement arbitrary digital functions, ranging from glue logic and state machines to full processor subsystems and high-speed serial protocol bridges. Within the broader taxonomy, the EP2AGX45DF25C5N sits at the intersection of programmable logic devices (PLD), the FPGA sub-class, the Arria II GX family, and the mid-density 45K-LE segment. Each LE contains a 4-input LUT, dedicated adder/subtractor carry logic, and a programmable register, while LABs (Logic Array Blocks) group 16 LEs with shared control signals and local interconnect, enabling efficient pipelined datapath implementation.
Key features that distinguish the EP2AGX45DF25C5N include integrated multi-gigabit transceivers (MGTs) supporting data rates up to 3.125 Gbps, dedicated hard IP for PCI Express Gen1 (x1/x4), an embedded memory subsystem with up to 4.65 Mbits of block RAM plus MLAB distributed RAM, fractional PLL and general-purpose PLL blocks for clock synthesis, and a DDR/DDR2/DDR3 SDRAM memory controller hard IP block. The transceiver channels support protocols such as Serial RapidIO, Gigabit Ethernet, XAUI, and PCIe Gen1, offloading serialization, deserialization, clock-data recovery, and 8b/10b encoding from programmable fabric to hardened silicon. DSP blocks implement 18×18 multipliers with adders for FIR filters, FFTs, and baseband processing.
In the broader system hierarchy, Arria II GX FPGAs like this part are typically paired with external DDR3 SDRAM, flash configuration memory (EPCS or EPCQ), clock generators, and PHY interfaces. They sit between low-cost Cyclone families and high-end Stratix families, offering the optimal balance when designers need integrated transceivers and DSP blocks at lower cost than Stratix IV/V. Configuration is typically via JTAG, Active Serial (AS), Passive Serial (PS), or Fast Passive Parallel (FPP) modes using Altera/Intel Quartus II design software.
Typical applications include telecom baseband processing, broadcast video bridges, military secure communications, industrial imaging, and PCIe endpoint cards. The EP2AGX45DF25C5N is well suited to designs requiring 4–8 transceiver channels, low DSP density, and a mid-range logic budget at a lower price than Stratix-class parts.
When designing with this part, ensure the PCB uses matched-length routing on all high-speed serial lanes, with continuous reference planes for the 100 Ω differential impedance. Provide decoupling of at least 100 µF bulk + 0.1 µF + 0.01 µF per supply pin group. The 572-BGA requires a multilayer PCB with via-in-pad or microvia technology to escape the 1 mm pitch ball array; verify thermal dissipation against the 27 °C/W θJA typical value with adequate copper area or forced airflow.
This page synthesizes distributor pricing, package-specific drop-in alternatives within the Arria II GX family, and practical PCB/thermal design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP2AGX45DF25C5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX45DF25C5N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, Transceivers, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX45DF25C4N
✅ 드롭인✓ 재고 있음
$460 / 개
데이터시트 보기 →EP2AGX45DF25C5G
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →EP2AGX45DF25C4G
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →EP2AGX45DF25C6ES
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2AGX125DF25C5G
✅ 드롭인✓ 재고 있음
$399.5 / 개
데이터시트 보기 →EP2AGX45DF25C5N 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Series | Arria II GX |
| Number of Logic Elements (LEs) | 42,959 |
| Number of LABs/CLBs | 1,805 |
| Total RAM Bits | 3,517,440 |
| Number of User I/O | 252 |
| Number of Transceivers | 4 or 8 (device-dependent) |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Process Technology | 40 nm CMOS |
| Core Supply Voltage | 0.9 V |
| Maximum Internal Frequency | 500 MHz |
| Speed Grade | C5 (commercial, -20 °C to +85 °C) |
| 패키지 | 572-ball FC-FBGA (Flip-Chip BGA), 25 × 25 mm |
| 실장 유형 | Surface Mount (BGA) |
| Lead-Free / RoHS | Lead Free (MSL per JEDEC J-STD-020) |
| PCI Express Hard IP | Yes, PCIe Gen1 ×1/×4 |
| Configuration Modes | JTAG, AS, PS, FPP |
EP2AGX45DF25C5N 572-ball fc-fbga (flip-chip bga), 25 × 25 mm 핀 구성 가이드
EP2AGX45DF25C5N(572-ball fc-fbga (flip-chip bga), 25 × 25 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX45DF25C5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX45DF25C5N 적합 용도: 6 애플리케이션s: Telecom Baseband Processing, PCIe Endpoint Add-In Cards, Broadcast Video Bridges, Industrial Imaging and Machine Vision, Military Secure Communications, Wireless Baseband / Test Equipment.
Telecom Baseband Processing
The EP2AGX45DF25C5N is well suited to telecom baseband boards where 42,959 LEs handle channel-card DSP, scrambling, framing, and backhaul serialization at up to 3.125 Gbps per lane. Up to 8 hard multi-gigabit transceivers eliminate external SERDES ICs, reducing BOM and PCB area for CPRI / OBSAI fronthaul links. Hard PCIe Gen1 IP simplifies host-side backplane connectivity to a baseband SoC or DSP cluster. Quartus II transceiver toolkit provides eye-diagram margin analysis on every lane for production test.
추천
PCIe Endpoint Add-In Cards
Built-in hard IP for PCI Express Gen1 ×1 and ×4 makes the EP2AGX45DF25C5N ideal for endpoint add-in cards that acquire high-speed data and push it to a host CPU over PCIe. The 252 user I/Os are sufficient for parallel ADC/DAC interfaces, FMC HPC connectors, or LVDS breakout. Transceivers above the PCIe lane budget are repurposed for Aurora or Serial RapidIO to external FPGAs/ASICs. Hard PCIe eliminates soft IP timing closure work and frees roughly 5K LEs versus a soft IP implementation.
추천
Broadcast Video Bridges
For broadcast routers and SDI/HDMI bridge cards, the EP2AGX45DF25C5N provides transceivers running SDI at 2.97 Gbps (3G-SDI) plus DSP blocks for color-space conversion, scaling, and audio embedding. The 3.5 Mbit block RAM plus distributed MLAB RAM (about 0.6 Mbit) buffers line-rate video frames; DDR2/DDR3 hard controller hooks directly to external SDRAM for frame-store. Quartus II Video and Image Processing (VIP) suite provides drop-in IP for common bridging functions, accelerating development.
추천
Industrial Imaging and Machine Vision
The 42,959 LEs plus dedicated DSP blocks (18×18 multipliers) implement real-time Bayer demosaicing, gamma correction, and defect pixel correction on multi-megapixel sensor streams. Up to 8 transceivers drive CoaXPress or Camera Link HS uplinks at 3.125 Gbps with deterministic latency. The 252 user I/Os accept multiple LVDS / sub-LVDS image sensor channels in parallel, with internal PLLs generating the precise pixel clocks. Industrial temperature variants (-40 °C to +100 °C) are available in the same package for outdoor use.
추천
Military Secure Communications
Although the EP2AGX45DF25C5N is commercial temperature, the same Arria II GX family supports military / industrial temperature grades in identical 572-FBGA packages, making migration straightforward. The hardened AES engine plus 252 user I/Os and transceivers support secure voice, data, and link encryption across multiple channels at 3.125 Gbps. Hard PCIe simplifies secure router backplane designs. Quartus II supports design obfuscation and bitstream authentication for tamper resistance.
추천
Wireless Baseband / Test Equipment
For wireless test platforms, the EP2AGX45DF25C5N implements arbitrary waveform generation, real-time FFT analysis, and multi-channel modulation / demodulation in the FPGA fabric, with transceivers digitizing or synthesizing IF signals up to 3.125 Gbps. About 16 to 24 DSP blocks provide the 18×18 multipliers and adders needed for vector modulation, with the 3.5 Mbit block RAM capturing sample bursts. The PCIe hard block streams processed IQ data to the host analyzer GUI in real time without CPU bottlenecks.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX45DF25C5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX45DF25C4N | EP2AGX45DF25C5G | EP2AGX45DF25C4G | EP2AGX45DF25C6ES | EP2AGX125DF25C5G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 572-ball FC-FBGA (DF25) | 572-ball FC-FBGA (DF25) | 572-ball FC-FBGA (DF25) | 572-ball FC-FBGA (DF25) | 572-ball FC-FBGA (DF25) | 572-ball FC-FBGA (DF25) |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 125,000 |
| Speed Grade | C5 (commercial) | C4 (commercial, slower) | C5 (commercial) | C4 (commercial, slower) | C6 (ES marking) | C5 (commercial) |
| Number of I/O | 252 | 252 | 252 | 252 | 252 | 252 |
| Transceiver Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Lifecycle Status | NRND | NRND | NRND | NRND | Production (ES) | NRND |
주요 차별점
- Same-package drop-in alternatives preserve PCB design (vs EP2AGX45DF25C4N)
- Hard PCIe Gen1 IP block eliminates soft IP overhead (vs Cyclone IV GX equivalents)
- Highest LE density in this footprint (vs Cyclone V GX 5CGXFC7C7F23C8N)
설계 노트
The 572-ball FC-FBGA at 1.0 mm ball pitch requires a multilayer PCB with via-in-pad or microvia escape technology. Use a 1-6-1 or 1-8-1 stack-up with continuous ground reference planes under the device. Route high-speed transceiver differential pairs with 100 Ω differential impedance and length-matched to within 5 mils; route reference clock to within 50 mils of receiver pairs. Provide 100 µF bulk + 0.1 µF + 0.01 µF decoupling per supply pin group, with the smallest caps placed closest to the BGA balls.
Estimated: at 5 W typical internal dissipation and a 27 °C/W θJA (with 4-layer PCB and adequate copper area per JEDEC JESD51), the junction-to-ambient temperature rise is roughly 135 °C. In a closed enclosure without airflow, the internal die temperature may exceed 85 °C ambient; deploy forced airflow (≥ 200 LFM) or attach a heatsink via thermal pad. Confirm thermal margin against the C5 grade maximum junction temperature of 100 °C using the Arria II GX PowerPlay early power estimator.
Do not configure Arria II GX transceivers at data rates above 3.125 Gbps; doing so violates IEEE specifications and may cause eye-margin failures. Always enable the 8b/10b encoding hard IP for PCIe, XAUI, and Serial RapidIO; never implement 8b/10b in soft logic, because the CDR circuits inside the MGT are designed for 8b/10b line code. Ensure configuration mode pins MSEL[2:0] are set correctly for the chosen AS/PS/FPP/JTAG boot mode before power-up; an incorrect setting prevents configuration.
For the PCI Express Gen1 hard IP block, route the PCIe transmit pair with DC-blocking capacitors per the PCIe CEM specification; reference clock must be a 100 MHz HCSL with ±300 ppm accuracy. For multi-gigabit transceiver (MGT) channels, provide AC-coupling capacitors of 0.1 µF on each serial lane, place at the receiver side as close to the BGA as possible. Match P and N lengths to within 0.13 mm (5 mils) and route over a continuous ground reference plane; do not cross plane splits.
규정 준수 정보
RoHS compliance per Altera / Intel product page. JEDEC J-STD-020 MSL rating applies; halogen-free status not explicitly listed in retrieved web data.
