EP2AGX45DF29I5G - Arria II GX FPGA, 45K LE, 3.5Mbit | Intel
부품 번호: EP2AGX45DF29I5G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $398.5 | $3,985.00 |
| 100 | $365 | $36,500.00 |
| 250 | $340 | $85,000.00 |
| 500 | $315 | $157,500.00 |
EP2AGX45DF29I5G 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement arbitrary digital logic functions, memory blocks, DSP arithmetic, and high-speed serial interfaces on a single silicon die. Within the programmable-logic taxonomy, FPGAs sit between fixed-function ASICs (which offer the highest density and lowest unit cost at scale but no post-tape-out flexibility) and CPLDs (which are simpler, non-volatile, and used for glue logic). The Arria II GX family specifically targets mid-bandwidth applications that need integrated transceivers without the cost or power of higher-end Stratix-class parts, placing it in the broader hierarchy of programmable-logic devices -> FPGAs -> mid-range FPGAs with transceivers.
Key features of the EP2AGX45DF29I5G include 45,000 LEs, 3,517,440 embedded memory bits, 42,959 logic elements per the simplified datasheet summary, and 364 maximum user I/Os. The device also embeds dedicated 18x18 multipliers for DSP workloads, PLLs for clock management, and multi-gigabit transceivers supporting common backplane and chip-to-chip protocols. The integrated transceivers eliminate external PHY ICs in many designs, simplifying board layout and BOM.
The architectural core uses a sea-of-LUTs fabric combined with embedded SRAM blocks, hardware DSP slices, and high-speed serial interface tiles. The transceiver tiles support data rates typical of the Arria II GX family for protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and common serial digital interface rates. The 780-ball FCBGA package provides the I/O density required to break out the 364 user I/Os while preserving signal integrity for the multi-gigabit links.
Typical applications include wireless baseband and radio card preprocessing, broadcast video bridging and processing, military and aerospace signal acquisition, and high-speed serial protocol bridging. The combination of mid-range logic density with integrated transceivers also suits imaging, medical imaging back-ends, and industrial test instrumentation where deterministic latency and high data throughput are required.
When designing with this part, allocate the LVDS and transceiver pairs to the package's dedicated banks before general-purpose I/O to preserve signal integrity and meet the multi-gigibt routing constraints. Use the Altera/Intel Quartus II design software (which supports the Arria II GX device family) for place-and-route, timing closure, and transceiver channel configuration; failure to meet transceiver reference-clock jitter budgets is a common cause of link-up failures in production.
This page synthesizes distributor availability, drop-in same-package alternatives from the Arria II GX family, and practical design notes that go beyond the manufacturer datasheet summary, giving engineers a faster path to part selection and qualification.
드롭인 대체품: EP2AGX45DF29I5G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX45DF29I5G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Process Node, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX45DF29I5
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP2AGX45DF29I5N
✅ 드롭인✓ 재고 있음
$318 / 개
데이터시트 보기 →EP2AGX45DF29I3G
✅ 드롭인✓ 재고 있음
$690 / 개
데이터시트 보기 →EP2AGX45DF29I4N
✅ 드롭인✓ 재고 있음
$195.75 / 개
데이터시트 보기 →EP2AGX45DF29C6G
✅ 드롭인✓ 재고 있음
$121.75 / 개
데이터시트 보기 →EP2AGX45DF29I5G 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Logic Elements (LE) | 45,000 |
| Embedded Memory Bits | 3,517,440 bits |
| Maximum User I/O | 364 |
| 패키지 | 780-BBGA / FCBGA |
| Speed Grade | I5 (Industrial) |
| 동작 온도 | -40C to +100C (Industrial) |
| Core Supply Voltage (VCC) | 0.9 V nominal |
| Transceivers | Multi-gigabit transceivers integrated |
| DSP Blocks | Embedded 18x18 multipliers |
| PLLs | On-chip PLLs for clock management |
| Configuration Scheme | FPGA, programmable via SRAM |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
EP2AGX45DF29I5G 780-bbga / fcbga 핀 구성 가이드
EP2AGX45DF29I5G(780-bbga / fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX45DF29I5G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX45DF29I5G 적합 용도: 6 애플리케이션s: Wireless Baseband Preprocessing, Broadcast Video Bridging and Processing, Military and Aerospace Signal Acquisition, High-Speed Serial Protocol Bridging, Industrial Test and Measurement Instrumentation, Medical Imaging Back-End Processing.
Wireless Baseband Preprocessing
The EP2AGX45DF29I5G is well suited to wireless baseband preprocessing cards where the 45K LE fabric runs channel estimation, equalization, FFT/iFFT engines, and MAC-layer glue logic while the integrated multi-gigabit transceivers carry digitized IF or baseband samples to a host ASIC or DSP. The 3,517,440 bits of embedded memory provide line-rate buffering between the antenna framer and the host CPU/PCIe interface without external SRAM, which reduces BOM cost. Industrial speed grade and -40C to +100C operation support outdoor radio units and small-cell deployments. Designers should allocate at least two transceiver channels for CPRI or OBSAI links and budget reference-clock jitter per the Arria II GX transceiver handbook to meet the protocol's eVM mask.
추천
Broadcast Video Bridging and Processing
For broadcast video bridges and processing blades, the EP2AGX45DF29I5G implements SDI (SMPTE 259M/292M/424M) deserializers/serializers, genlocking cross-points, and downstream color-space conversion in the programmable fabric. The integrated transceivers handle 270 Mbps / 1.485 Gbps / 2.97 Gbps SDI rates natively without external cable equalizers, simplifying BOM and PCB routing. The 364 user I/Os are sufficient for multi-channel SDI I/O plus housekeeping GPIO. Industrial temperature grade supports outside-broadcast trucks and stadium installations. Use the Quartus II ALTLVDS and transceiver mega-functions to meet SDI jitter masks and lock the genlock PLL to a black-burst reference.
추천
Military and Aerospace Signal Acquisition
The EP2AGX45DF29I5G with its I5 industrial speed grade and -40C to +100C operating range suits ruggedized signal-acquisition subsystems in defense and avionics platforms. The 45K LE fabric is large enough to host a full radar preprocessor, electronic-warfare channelizer, or MIL-STD-1553 / ARINC 429 bridge alongside the integrated transceivers that pump digitized RF to a backplane. The 780-ball FCBGA supports the dense break-out required for multiple LVDS ADC/DAC channels. Designers should derate transceiver data rates for the avionics thermal envelope and follow the Arria II GX military temperature derating guidelines in the device handbook. Conformal coating and underfill are recommended for high-vibration environments.
추천
High-Speed Serial Protocol Bridging
The EP2AGX45DF29I5G is widely used as a protocol bridge converting between PCIe, Serial RapidIO, Gigabit Ethernet, Aurora, and proprietary backplane links. Its hard multi-gigabit transceivers implementing PCIe Gen1/Gen2 and SRIO eliminate the external PHY that would otherwise be needed, shrinking board area and BOM cost. The 364 I/Os are adequate for 8 lanes of PCIe plus four SRIO lanes plus a 1 GbE management port. The 3.5Mbit of embedded memory buffers packets during rate adaptation. Designers should use the Quartus II hard IP cores (PCIe, SRIO, GBE) to minimize logic utilization and accelerate timing closure at the Gen2 data rate.
추천
Industrial Test and Measurement Instrumentation
In modular test instruments such as PXI/PXIe cards, protocol analyzers, and ATE load boards, the EP2AGX45DF29I5G provides the logic capacity and transceiver bandwidth to capture, time-stamp, and pre-process high-speed serial traffic before forwarding to the host CPU. Industrial temperature grade is appropriate for chassis ambient up to +55C with adequate airflow. The integrated transceivers enable direct connection to SATA, USB 3.0 (PIPE), DisplayPort 1.1, or 10 GbE XFI test points without an external retimer. Designers should use the device's JTAG and SignalTap logic analyzer features during bring-up to debug transceiver link-up issues without removing the FPGA from the test slot.
추천
Medical Imaging Back-End Processing
Ultrasound, endoscopy, and digital X-ray imaging systems use the EP2AGX45DF29I5G to interface high-channel-count LVDS ADC arrays and to run real-time beamforming, FIR filtering, and image reconstruction in the programmable fabric. The 364 user I/Os comfortably break out 64-128 LVDS pairs from the front-end ADCs, and the 3.5Mbit of embedded memory buffers scanline data between the front-end and the DSP/host. Multi-gigabit transceivers feed the reconstructed image to the host display processor via PCIe or a proprietary link. Industrial temperature grade supports operating-room carts and portable ultrasound units. Designers should leverage the device's hardware DSP blocks for beamforming to free the LE fabric for control and image-processing tasks.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX45DF29I5G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX45DF29I5 | EP2AGX45DF29I5N | EP2AGX45DF29I3G | EP2AGX45DF29I4N | EP2AGX45DF29C6G |
|---|---|---|---|---|---|---|
| Package | 780-BBGA / FCBGA | 780-BBGA / FCBGA (same) | 780-BBGA / FCBGA (same) | 780-BBGA / FCBGA (same) | 780-BBGA / FCBGA (same) | 780-BBGA / FCBGA (same) |
| Brand | Intel | Intel (same) | Intel (same) | Intel (same) | Intel (same) | Intel (same) |
| Family | Arria II GX | Arria II GX | Arria II GX | Arria II GX | Arria II GX | Arria II GX |
| Logic Elements | 45,000 | 45,000 | 45,000 | 45,000 | 45,000 | 45,000 |
| Embedded Memory | 3,517,440 bits | 3,517,440 bits | 3,517,440 bits | 3,517,440 bits | 3,517,440 bits | 3,517,440 bits |
| Maximum User I/O | 364 | 364 | 364 | 364 | 364 | 364 |
| Speed Grade | I5 (Industrial) | I5 (Industrial) | I5 (Industrial) | I3 (Industrial, slower) | I4 (Industrial) | C6 (Commercial, fastest) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Lead-Free / RoHS | Yes (G suffix) | No (SnPb finish) | Yes (N suffix) | Yes (G suffix) | Yes (N suffix) | Yes (G suffix) |
| Transceivers | Multi-gigabit integrated | Multi-gigabit integrated | Multi-gigabit integrated | Multi-gigabit integrated | Multi-gigabit integrated | Multi-gigabit integrated |
주요 차별점
- Mid-density 45K LE fabric with integrated multi-gigabit transceivers (vs Cyclone IV GX family (EP4CGX30/50/75/110))
- 780-ball FCBGA with 364 user I/Os (vs EP2AGX45DF25 series (25x25 mm 484-ball FCBGA))
- 3,517,440 bits of embedded memory (vs EP2AGX20DF29 (smaller family member))
설계 노트
The 780-ball FCBGA package is a high-thermal-mass surface-mount BGA. At full logic utilization with multiple active transceiver lanes, junction temperature can rise rapidly without adequate PCB copper. Per the Arria II GX device handbook, follow the recommended land pattern with at least eight thermal vias in a 4x4 grid under the die-flag pad to conduct heat to internal copper planes. For applications exceeding approximately 50% transceiver lane utilization at Gen2 data rates, a heatsink or forced-air cooling is recommended to keep Tj below +100C for industrial-grade parts.
Implement the 780-ball FCBGA land pattern with NSMD (non-solder-mask-defined) pads and a 0.5 mm or 0.8 mm pitch according to the package variant. Use a 4-6 layer stackup with continuous GND planes on layers 2 and (N-1) below the BGA, and route high-speed transceiver channels on the top layer with matched differential-pair length tuning. The transceiver reference clock traces must be isolated from noisy digital signals and length-matched to within the jitter tolerance specified in the Arria II GX transceiver user guide; violation of this is the most common cause of link-up failure in production.
Do not mix I5 and I3 speed grades within a single multi-FPGA board without re-running Quartus II timing analysis per part - timing models differ and inter-FPGA paths may close at I5 but fail at I3. Always configure the FPGA's configuration mode (AS, PS, JTAG, or FPP) via MSEL pins correctly for the chosen configuration device; a wrong MSEL setting leaves the FPGA unconfigured with no visible error. When migrating between EP2AGX45 variants (e.g., I5 to I3), verify that the Quartus II project settings are updated to match the new device ordering code and re-run fitter and timing analysis.
규정 준수 정보
RoHS compliance inferred from 'G' suffix per Intel/Altera ordering code convention. AEC-Q100 not applicable - Arria II GX is commercial/industrial grade. Halogen-free status not confirmed in the verified web data.
