EP2AGX45DF29I5N - Arria II GX FPGA 45K LE FC-FBGA-780 | Intel
부품 번호: EP2AGX45DF29I5N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $398 | $3,980.00 |
| 100 | $365 | $36,500.00 |
| 250 | $340 | $85,000.00 |
| 500 | $318 | $159,000.00 |
EP2AGX45DF29I5N 개요
What is an FPGA? A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that lets designers implement custom digital logic via a hardware description language, then re-program the device after manufacturing. Within the broader programmable logic taxonomy, FPGAs sit alongside CPLDs as the two main branches of programmable logic devices; the Arria II GX family further specializes as a transceiver-rich mid-range family optimized for serial connectivity protocols including PCI Express Gen2, Gigabit Ethernet, and Serial RapidIO. This positions the EP2AGX45DF29I5N as a power- and cost-optimized mid-density alternative to high-end Stratix devices and a step up from Cyclone IV/ V families.
Key features include 3.5 Mbits of M9K embedded memory blocks, 4 PLLs per device, and high-speed transceivers with data rates up to 3.75 Gbps. The device operates from a 0.9 V core supply with multiple auxiliary rails and supports industrial temperature range (-40C to +100C case). The FC-FBGA-780 flip-chip package provides excellent thermal and electrical performance suitable for high-density PCB designs.
The Arria II GX architecture employs logic element-based fabric with dedicated DSP blocks for signal processing, hard PCIe Gen2 IP cores, and embedded SERDES channels. This combination delivers deterministic performance and protocol-ready interfaces, reducing soft-IP development time and silicon real estate. The 40 nm low-power process reduces dynamic power consumption relative to previous-generation 65 nm Arria GX devices.
Typical applications include wireless infrastructure baseband processing, video broadcast equipment, industrial imaging and machine vision, military/aerospace signal processing, and PCI Express endpoint cards. The integrated transceivers and PCIe hard IP make it particularly well-suited for protocols requiring multi-gigabit serial links with minimal external components.
When designing with this device, allocate sufficient PCB layers (typically 8-12) for the FC-FBGA-780 breakout, observe controlled-impedance routing for transceiver channels, and follow Intel's recommended decoupling scheme. Designers should use Quartus II design software (v13.0 or later) for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design guidance not assembled in the manufacturer datasheet.
드롭인 대체품: EP2AGX45DF29I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX45DF29I5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Logic Elements, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX45DF29I5G
✅ 드롭인✓ 재고 있음
$315 / 개
데이터시트 보기 →EP2AGX45DF29I5
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP2AGX45DF29I4N
✅ 드롭인✓ 재고 있음
$195.75 / 개
데이터시트 보기 →EP2AGX45DF29I3N
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →EP2AGX45DF29C6N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP2AGX45DF29I5N 최대 정격 & 전기적 특성
| Device Family | Arria II GX |
| Logic Elements | 42,959 |
| Logic Array Blocks (LABs) | 1,805 |
| Embedded Memory (M9K blocks) | 3,517,440 bits |
| User I/Os | 364 |
| Max Transceiver Data Rate | 3.75 Gbps |
| PLLs | 4 |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| 동작 온도 | -40C to +100C (industrial) |
| Package Type | 780-ball FC-FBGA |
| Package Dimensions | 29 mm x 29 mm |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP2AGX45DF29I5N 29 mm x 29 mm 핀 구성 가이드
EP2AGX45DF29I5N(29 mm x 29 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX45DF29I5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX45DF29I5N 적합 용도: 6 애플리케이션s: Wireless Infrastructure Baseband Processing, Video Broadcast Equipment, Industrial Machine Vision Systems, PCI Express Endpoint Cards, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
Wireless Infrastructure Baseband Processing
The EP2AGX45DF29I5N is well suited for wireless baseband signal processing in LTE/3G small-cell and picocell base stations. Its 42,959 logic elements and dedicated DSP blocks deliver the arithmetic throughput needed for FFT/iFFT, channel coding, and digital up/down-conversion. The integrated transceivers up to 3.75 Gbps enable CPRI/OBSAI fronthaul connectivity to remote radio heads without external SERDES. Industrial-temperature operation permits deployment in outdoor-rated enclosures on tower tops. Designers typically pair this FPGA with TI ADC32RF45 RF ADCs and Marvell 88X3310 PHYs for complete RF-to-baseband chains. Power consumption stays under 5 W core at typical loading.
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Video Broadcast Equipment
Studio-grade video routers, format converters, and frame synchronizers benefit from the EP2AGX45DF29I5N's 3.5 Mbits of embedded memory and 364 user I/Os. The 780-ball FC-FBGA package supports multiple 3G-SDI / HD-SDI channels via SerDes interfaces, while logic capacity handles scaling, de-interlacing, and color-space conversion. Industrial temperature rating ensures reliability in 24/7 broadcast operation. The integrated PCIe Gen2 hard IP enables direct connectivity to host CPU cards. Compared with ASSP video processors, the FPGA approach offers late-binding flexibility for evolving codecs (AVC, HEVC partial support via soft cores).
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Industrial Machine Vision Systems
Line-scan and area-scan camera interfaces for factory automation leverage the EP2AGX45DF29I5N's transceiver resources for CoaXPress, Camera Link, and GigE Vision aggregation. The 42,959 LE fabric supports real-time image preprocessing (filtering, thresholding, edge detection) before forwarding to host processors via PCIe. Industrial temperature operation allows placement near machine enclosures without thermal derating. The 780-ball FC-FBGA package is compatible with pick-and-place and standard SMT reflow profiles (peak 245C with proper MSL-3 handling). System latency stays below 50 us end-to-end with optimized DSP-block utilization.
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PCI Express Endpoint Cards
The integrated PCIe Gen2 hard IP cores make the EP2AGX45DF29I5N ideal for low-cost endpoint add-in cards: data acquisition, DSP accelerators, and protocol bridges. Designers can implement PCIe x4 Gen2 (5 Gbps per lane, 20 Gbps aggregate) without consuming fabric resources, leaving 42,959 LEs for user logic. The 780-ball FC-FBGA package provides ample ball escape for x4 lane routing. Quartus II includes pre-verified PCIe reference designs that shorten development cycles from months to weeks. Industrial temperature suits deployment in industrial PCs and test equipment chassis.
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Military and Aerospace Signal Processing
Defense signal-processing subsystems, including software-defined radio (SDR), radar front-end processing, and electronic-warfare receivers, use the EP2AGX45DF29I5N for its balance of logic density, embedded memory, and transceiver count. Industrial temperature range covers many MIL-STD-810G environmental profiles when paired with ruggedized enclosures. The 40 nm process provides reasonable radiation tolerance for low-orbit and tactical applications (though for full space-grade, hardened Stratix-V-equivalent families are recommended). Conduction-cooled chassis designs leverage the 780-ball FC-FBGA package's excellent thermal pad for direct heat-sink attach.
추천
Test and Measurement Instrumentation
High-speed oscilloscopes, logic analyzers, and protocol testers use the EP2AGX45DF29I5N to aggregate and pre-process sampled data from multiple front-end ADCs. The 3.75 Gbps transceivers accept LVDS or serializer outputs from TI ADC12D1800/ADC16DX515-class converters. With 3.5 Mbits of embedded memory, the device can buffer triggered events before forwarding to host CPUs via PCIe Gen2. The 780-ball FC-FBGA-780 package supports the high pin density required for parallel ADC interfaces (LVDS DDR buses at 1 Gbps). Quartus II signal-tap debugging is enabled via JTAG without disturbing operation.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX45DF29I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX45DF29I5G | EP2AGX45DF29I5 | EP2AGX45DF29I4N | EP2AGX45DF29I3N | EP2AGX45DF29C6N |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Altera | Intel | Intel | Intel |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 |
| Speed Grade | 5 (slowest) | 5 | 5 | 4 (faster) | 3 (fastest) | 6 (slowest) |
| Temperature Range | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C |
| User I/Os | 364 | 364 | 364 | 364 | 364 | 364 |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| RoHS / Pb-Free | Pb-free (N suffix) | Pb-free (G suffix, explicitly RoHS) | SnPb (non-RoHS) | Pb-free (N suffix) | Pb-free (N suffix) | Pb-free (N suffix) |
| Transceiver Data Rate | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps |
주요 차별점
- Lowest-cost Pb-free variant in this 780-ball FC-FBGA lineup (vs EP2AGX45DF29I5G)
- Speed grade 5 maximizes timing margin vs. faster grades (vs EP2AGX45DF29I3N)
- Industrial temperature range -40C to +100C (vs EP2AGX45DF29C6N)
설계 노트
The 780-ball FC-FBGA package with 1.0 mm ball pitch requires a high-density interconnect PCB with 8-12 layers for breakout routing. Use laser-drilled microvias or stacked-via structures for inner-row ball escape; standard 0.1 mm drilled through-vias cannot fit between balls at this pitch. Allocate at least two full ground planes beneath the FPGA for power-integrity decoupling and reference-plane continuity for high-speed transceivers. Impedance-controlled differential pairs (100 ohm diff for transceivers, 50 ohm single-ended for clocks) require stack-up planning before layout start.
The Arria II GX FPGA at full utilization can dissipate 5-8 W core power. The FC-FBGA-780 package exposes a large thermal pad on the underside - it MUST be soldered to the PCB with full paste coverage and connected via thermal vias to internal copper planes. For high-power designs, attach a heat-spreader or low-profile heat sink with thermal interface material (TIM). Forced-air cooling at 200 LFM is typical for industrial chassis. Junction temperature should stay below 100C for the industrial temp grade (per Altera Arria II GX reliability guidelines).
Several common pitfalls: (1) Do not omit the external clock source - the EP2AGX45DF29I5N requires a low-jitter reference clock (typically 50-156.25 MHz LVDS) feeding the PLL inputs; (2) Configure unused transceiver channels to powered-down state to reduce power and EMI; (3) Use Quartus II v13.0 or later for Arria II GX device support - older versions do not include the latest silicon errata fixes; (4) The N suffix indicates Pb-free - if your manufacturing line uses SnPb paste, you must use the non-N variant (e.g., EP2AGX45DF29I5); (5) Do not mix transceiver reference clocks between different banks without verifying the bank-VCC levels match.
규정 준수 정보
RoHS and REACH compliant per Intel/Altera product declarations. The N suffix denotes Pb-free / lead-free finish. Not AEC-Q100 qualified - this is a commercial/industrial FPGA not intended for automotive AEC-Q100 applications.