EP2AGZ300FF35I4N - Arria II GZ FPGA, 298K LE, 1152-FBGA | Intel
부품 번호: EP2AGZ300FF35I4N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 50 | $2380 | $119,000.00 |
| 100 | $2150 | $215,000.00 |
| 500 | $1925 | $962,500.00 |
EP2AGZ300FF35I4N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing configurable logic blocks (LBs), programmable interconnects, and dedicated hard IP such as transceivers, memory controllers, and DSP slices. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits, and they are typically positioned between general-purpose microcontrollers and ASICs in terms of performance, parallelism, and design flexibility. The Arria II GZ family specifically targets mid- to high-performance applications where designers need transceiver-based serial connectivity and significant DSP throughput.
Key features of the EP2AGZ300FF35I4N include 298,000 logic elements, 18,854,912 bits of embedded RAM, support for high-speed serial transceivers, dedicated DSP blocks for fixed- and floating-point arithmetic, and a 0.9 V core supply with on-chip voltage regulation. The device also features configuration via active serial, passive serial, JTAG, and Fast Passive Parallel modes, plus multi-cycle PLL support for clock synthesis. Hard PCIe and external memory controller IP reduce soft-logic overhead and accelerate time-to-market for bandwidth-intensive designs.
The Arria II GZ architecture pairs a logic fabric with hardened transceivers operating up to 6.375 Gbps, enabling protocols such as PCIe Gen2, SATA, and 10 GbE (XAUI). On-board DSP blocks deliver up to 8 TFLOPs of single-precision throughput, while the 1152-ball package provides extensive I/O including LVDS, DDR3, and SERDES-capable pins. Together these resources support designs that require simultaneous high-throughput DSP and high-speed serial I/O.
Typical applications include high-end communications infrastructure, broadcast video processing, defense radar and signal intelligence, medical imaging acceleration, ASIC prototyping, and test & measurement instrumentation. Industrial-grade operating temperature and the 1152-FBGA package make the part suitable for ATCA and AMC modules in telecommunications equipment.
When designing with this device, ensure the PCB supports the fine-pitch 35 mm x 35 mm FC-FBGA with appropriate microvia stack-up, and follow Intel power-up sequencing guidelines. Use the Quartus II design software (version 13.0 or later with service pack) for synthesis, place-and-route, and timing closure; the 0.9 V core requires careful power plane design to meet transceiver jitter specifications.
This page synthesizes distributor availability, drop-in same-package alternatives within the Arria II GZ family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP2AGZ300FF35I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGZ300FF35I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Transceivers, Operating Temperature, Logic Elements (LE), Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGZ300FF35I4G
✅ 드롭인✓ 재고 있음
$2610 / 개
데이터시트 보기 →EP2AGZ300FF35I4
✅ 드롭인✓ 재고 있음
$1015 / 개
데이터시트 보기 →EP2AGZ300FF35I3N
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →EP2AGZ300FF35I3G
✅ 드롭인✓ 재고 있음
$1230 / 개
데이터시트 보기 →EP2AGZ300FF35C4N
✅ 드롭인✓ 재고 있음
$1350 / 개
데이터시트 보기 →EP2AGZ300FF35C4G
✅ 드롭인✓ 재고 있음
$2240 / 개
데이터시트 보기 →EP2AGZ300FF35I4N 최대 정격 & 전기적 특성
| Series | Arria II GZ |
| Family | Field Programmable Gate Array (FPGA) |
| Logic Elements | 298,000 |
| Number of LABs/CLBs | 11,920 |
| Total RAM Bits | 18,854,912 bits |
| Number of I/O | 554 |
| Supply Voltage Core | 0.9 V |
| Process Technology | 40 nm |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial) |
| Package Type | 1152-BBGA, FCBGA |
| Package Dimensions | 35 mm x 35 mm |
| Supplier Device Package | 1152-FBGA (35x35) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP2AGZ300FF35I4N 1152-fbga (35x35) 핀 구성 가이드
EP2AGZ300FF35I4N(1152-fbga (35x35) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGZ300FF35I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGZ300FF35I4N 적합 용도: 7 애플리케이션s: High-End Communications Infrastructure, Broadcast Video Processing, Defense Radar and Signal Intelligence, Medical Imaging Acceleration, ASIC Prototyping, Test and Measurement Instrumentation, Industrial Automation and Machine Vision.
High-End Communications Infrastructure
The EP2AGZ300FF35I4N fits telecommunications baseband and line-card designs because its 298,000 logic elements and 18,854,912 bits of embedded RAM can buffer multi-Gbps packet streams while its hardened transceivers operate up to 6.375 Gbps. In a typical ATCA line card the FPGA implements MAC framing, traffic shaping, and OTN/SONET mapping between backplane SERDES and external optics. The 1152-FBGA's 554 user I/Os also provide ample LVDS lanes for fabric interconnect, and the industrial -40C to +100C temperature range meets the NEBS thermal envelope required by carrier-grade equipment. Compared with smaller Arria II GX variants, the EP2AGZ300 gives designers roughly 30% more logic and DSP resources for the same power budget, simplifying multi-channel aggregation without resorting to a companion ASIC.
추천
Broadcast Video Processing
The EP2AGZ300FF35I4N suits broadcast video processing because its DSP blocks can simultaneously handle multiple channels of 3G-SDI, H.264, or JPEG2000 codecs at full raster resolution. Its 298,000 logic elements provide the routing and control fabric for color-space conversion, scaling, and overlay engines, while the 18,854,912 bits of embedded RAM line-buffer memory up to several video lines per channel. Designers use the device in production switchers, multi-viewers, and broadcast encoder chassis where deterministic latency is critical. The industrial temperature rating and 1152-FBGA package allow integration into 1-RU and 3-RU broadcast enclosures with forced-air cooling, and the 0.9 V core supply keeps total board power within the 60-80 W typical for rack-mount video gear.
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Defense Radar and Signal Intelligence
The EP2AGZ300FF35I4N is well-matched to defense radar and SIGINT applications because its hardened transceivers can stream digitized RF data from multiple ADC channels into the FPGA fabric at multi-gigabit rates while its DSP blocks perform pulse compression, FFT, and digital beamforming in real time. The 298,000 logic elements are sufficient to implement channelizer, detector, and tracker stages in parallel across a wide instantaneous bandwidth. The industrial -40C to +100C temperature rating and the 1152-FBGA package suit 6U VPX and OpenVPX payload cards operating in MIL-STD-810 environments. Compared with the smaller EP2AGX125 family, the EP2AGZ300 triples the available logic and embedded RAM for the same SERDES lane count, enabling higher channel density per slot.
추천
Medical Imaging Acceleration
The EP2AGZ300FF35I4N accelerates medical imaging workloads such as CT reconstruction, MRI k-space processing, and ultrasound beamforming by using its on-chip DSP blocks for filter and matrix operations that would otherwise dominate CPU time. The 298,000 logic elements and 18,854,912 bits of embedded RAM allow partial image frames to be buffered on-chip, reducing external memory bandwidth pressure during iterative reconstruction algorithms. The 1152-FBGA package and industrial temperature rating support integration into imaging carts and rack-mounted scanner chassis with controlled-air cooling. Designers pair the FPGA with high-speed ADCs and DDR3 external memory via the device's dedicated memory controllers, achieving reconstruction pipelines that run an order of magnitude faster than software-only baselines.
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ASIC Prototyping
The EP2AGZ300FF35I4N is widely used for ASIC prototyping because its 298,000 logic elements can map sizable ASIC RTL blocks into real silicon for pre-tape-out verification, and multiple EP2AGZ300 devices can be chained on a prototyping board to emulate larger ASICs. The 18,854,912 bits of embedded RAM and 554 user I/Os provide sufficient on-chip storage and off-chip connectivity to mimic ASIC pad rings, while the 0.9 V core and 40 nm process let prototyping run at close to target ASIC clock rates. The 1152-FBGA package is accepted by most commercial FPGA prototyping platforms such as HAPS and ProFPGA, simplifying bring-up. Compared with the EP2AGX260 variant, the EP2AGZ300 delivers roughly 15% more logic and twice the DSP resources, enabling larger SoC partitions per board.
추천
Test and Measurement Instrumentation
The EP2AGZ300FF35I4N fits high-end oscilloscope, logic analyzer, and protocol tester designs because it can simultaneously capture, buffer, and process multiple high-speed data channels while triggering and timestamping with deterministic latency. The 298,000 logic elements implement custom acquisition state machines and on-chip protocol decoding, while the 18,854,912 bits of embedded RAM provide sample buffering that minimizes host transfer overhead. The 1152-FBGA package and 554 user I/Os support direct connection to multi-channel front-end ADCs and probes. The industrial -40C to +100C temperature rating and the device's reputation for timing margin make it attractive for bench and portable instruments where calibration stability across temperatures matters. Designers typically pair the EP2AGZ300 with external DDR3 memory and high-precision clocking PLLs to deliver multi-GS/s acquisition systems.
추천
Industrial Automation and Machine Vision
The EP2AGZ300FF35I4N supports multi-camera machine vision systems because its DSP blocks perform real-time image preprocessing such as filtering, edge detection, and color-space conversion while its logic fabric runs custom classifiers and quality-control algorithms. The 554 user I/Os handle Camera Link, CoaXPress, or GigE Vision links from several cameras in parallel, and the 18,854,912 bits of embedded RAM buffer multiple image lines per channel for low-latency decision making. The industrial -40C to +100C temperature range and 1152-FBGA package suit factory-floor enclosures with ambient temperatures above 60C. Compared with smaller Arria II GX devices, the EP2AGZ300 delivers about 30% more logic and DSP resources, allowing larger inspection regions and higher line rates without compromising throughput.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGZ300FF35I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGZ300FF35I4G | EP2AGZ300FF35I4 | EP2AGZ300FF35I3N | EP2AGZ300FF35I3G | EP2AGZ300FF35C4N | EP2AGZ300FF35C4G |
|---|---|---|---|---|---|---|---|
| Package | 1152-FBGA (35x35) | 1152-FBGA (35x35) | 1152-FBGA (35x35) | 1152-FBGA (35x35) | 1152-FBGA (35x35) | 1152-FBGA (35x35) | 1152-FBGA (35x35) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 298,000 | 298,000 | 298,000 | 298,000 | 298,000 | 298,000 | 298,000 |
| LABs/CLBs | 11,920 | 11,920 | 11,920 | 11,920 | 11,920 | 11,920 | 11,920 |
| Total RAM Bits | 18,854,912 bits | 18,854,912 bits | 18,854,912 bits | 18,854,912 bits | 18,854,912 bits | 18,854,912 bits | 18,854,912 bits |
| User I/O Count | 554 | 554 | 554 | 554 | 554 | 554 | 554 |
| Speed Grade | I4 (industrial fast) | I4 | I4 | I3 (slower, ~10% looser timing) | I3 (slower, ~10% looser timing) | C4 (commercial temperature) | C4 (commercial temperature) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Terminal Finish | Lead-free / RoHS (N suffix) | Pb-free (G suffix) | Lead-free (no suffix) | Lead-free / RoHS | Pb-free | Lead-free / RoHS | Pb-free |
| Approx. Unit Price (qty-1) | ~$2,850 | ~$2,800 | ~$2,800 | ~$2,500 | ~$2,500 | ~$2,400 | ~$2,400 |
주요 차별점
- Highest-density Arria II GZ option in the 1152-FBGA package (vs EP2AGZ225FF35I4N)
- Industrial temperature range with the I4 fast speed grade (vs EP2AGZ300FF35C4N)
- RoHS-compliant with documented Pb-free terminal finish (N suffix) (vs EP2AGZ300FF35I4G)
- Fastest speed grade at the I4 timing bin (vs EP2AGZ300FF35I3N)
설계 노트
Estimated: at 0.9 V core and typical Arria II GZ utilization near 70%, the EP2AGZ300FF35I4N draws around 8-10 W from VCCINT alone, with total board power near 15-20 W including transceivers. With the FC-FBGA package theta-JA of roughly 12 C/W at 1 m/s airflow, designers should provide a thermal pad or heat-spreader interface and at least 200 LFM of airflow. Always read the Arria II GZ PowerPlay Early Power Estimator output before committing to a passive heatsink-only solution, because transceiver-heavy designs can push junction temperature above 95 C in sealed enclosures.
Use a high-density PCB stack-up with laser-drilled microvias to break out the 1.0 mm pitch 1152-ball FC-FBGA. The reference design in the Arria II GZ Hardware Reference Manual recommends 12+ layers, with dedicated ground and 0.9 V VCCINT planes directly under the package. Decoupling per the Arria II GZ pin-out guidelines uses 0402 or 0201 capacitors within 2 mm of the balls, including high-frequency 0.1 uF and bulk 22 uF ceramics. Power-pin sequencing (VCCINT before VCCAUX before VCCIO) is mandatory and must be enforced with the Intel-supplied power sequencer or discrete logic; failing to follow this can permanently damage the device.
Transceiver channels rated up to 6.375 Gbps require controlled-impedance routing of 100 ohm differential pairs with intra-pair skew under 1.5 ps and length matching to within 5 mils. Use the Arria II GZ transceiver user guide recommendations for AC-coupling capacitor placement (within 250 mil of the transmitter), via count minimization (no more than 2 vias per transceiver lane), and reference plane continuity across the entire channel. Memory interfaces (DDR3) need 50 ohm single-ended impedance with matched trace lengths per byte lane, and write leveling should be verified across all operating temperatures with the design's actual loading.
Estimated: avoid the common pitfall of configuring a design for the I4 speed grade while the FPGA is actually I3 silicon - the resulting setup/hold violations will only appear at temperature corners. Also, do not omit MSEL pin settings; the EP2AGZ300 supports AS, PS, JTAG, and FPP configuration modes that are selected by MSEL[3:0] and must match the Quartus II programming file generator settings. Finally, confirm the 0.9 V core regulator has at least 30 A peak headroom for in-rush during configuration, or the device may fail to enter user mode.
규정 준수 정보
RoHS-compliant per Altera/Intel product page. Lead-free terminal finish standard. Halogen-free status not explicitly listed in distributor data - set to unknown. AEC-Q100 not applicable to FPGAs in this family.