EP2AGZ350FH29C3G - 350K LE Arria II GZ FPGA | Intel | 780-HBGA
부품 번호: EP2AGZ350FH29C3G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1580 | $158,000.00 |
| 250 | $1450 | $362,500.00 |
| 500 | $1350 | $675,000.00 |
EP2AGZ350FH29C3G 개요
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that uses configurable logic blocks (CLBs), routing switches, and I/O cells to implement arbitrary digital functions after manufacturing. Positioned in the broader programmable logic hierarchy as FPGA > programmable logic > logic IC > semiconductor, Arria II GZ sits in the mid-density segment between Cyclone (low-cost) and Stratix (high-end) families, targeting price/performance-sensitive applications that still need multi-gigabit transceivers.
Key features of the EP2AGZ350FH29C3G include 350K logic elements, up to 16.4 Mbits of embedded RAM, 24 transceivers supporting data rates up to 8.5 Gbps in some speed grades, 4 PCI Express hard IP blocks compliant with PCIe Gen2 x4, and dedicated external memory interfaces supporting DDR3 up to 800 MHz. The 780-HBGA package exposes 281 user I/O pins and integrates 8 dedicated clock PLL blocks. Operating junction temperature spans 0C to +85C for the commercial C3 speed grade.
Architecturally, the EP2AGZ350FH29C3G uses 8-input adaptive logic modules (ALMs), 9 Kbit MLAB blocks, and TriMatrix memory structures. The 8.5 Gbps transceivers support CPRI, OBSAI, Serial RapidIO, and 10 GbE (XAUI) protocols, while hard PCIe Gen2 controllers simplify endpoint and root-port implementations without consuming logic resources.
Typical applications include wireless baseband processing, military radar signal processing, broadcast video switching, and high-performance computing accelerators. The combination of high logic density, embedded transceivers, and DDR3 support suits data plane processing in telecom and datacom equipment. Designers should note that the C3 speed grade is the slower commercial tier; C4/I4/I5 grades offer higher Fmax but at higher cost. Power estimation requires Quartus II PowerPlay early in the design cycle because the device can exceed 20 W in fully-utilized configurations.
드롭인 대체품: EP2AGZ350FH29C3G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGZ350FH29C3G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Transceivers, Speed Grade, Logic Elements (LE), Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGZ350FH29I3G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1450 / 개
데이터시트 보기 →EP2AGZ350FH29C4G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2205 / 개
데이터시트 보기 →EP2AGZ350FH29I4G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP2AGZ300FH29C3G
✅ 드롭인✓ 재고 있음
$1545 / 개
데이터시트 보기 →EP2AGZ350FF35C3G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2680 / 개
데이터시트 보기 →EP2AGZ300FH29C4N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2AGZ350FH29C3G 최대 정격 & 전기적 특성
| Logic Elements | 350,000 |
| Embedded Memory (Bits) | 16,402,944 |
| User I/O Pins | 281 |
| Transceivers | 24 channels |
| Transceiver Data Rate (max) | 8.5 Gbps |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ |
| PLLs | 8 (4 enhanced, 4 fast) |
| Global Clocks | 16 |
| Process Node | 40 nm TSMC |
| Speed Grade | C3 (commercial, slowest) |
| 동작 접합 온도 | 0C to +85C |
| 패키지 | 780-ball FBGA (HBGA, 29x29 mm) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP2AGZ350FH29C3G 780-ball fbga (hbga, 29x29 mm) 핀 구성 가이드
EP2AGZ350FH29C3G(780-ball fbga (hbga, 29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGZ350FH29C3G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGZ350FH29C3G 적합 용도: 7 애플리케이션s: Wireless Baseband Processing, Military Radar Signal Processing, Broadcast Video Switcher, High-Performance Computing Accelerator, Medical Imaging Systems, Industrial Automation Controller, Telecom Line Card with PCIe Gen2.
Wireless Baseband Processing
The EP2AGZ350FH29C3G suits LTE and 5G NR baseband units that need 200K-300K logic elements for PHY-layer signal processing combined with CPRI/OBSAI links to remote radio heads. Its 24 transceivers at up to 8.5 Gbps aggregate 100+ Gbps of CPRI 7.0 throughput for 4T4R or 8T8R radio chains. The 16.4 Mbit embedded memory holds turbo decoder and channel estimator state, while the DDR3 interface at 800 MHz streams I/Q samples to off-chip buffers. Compared with ASICs, the FPGA allows late-binding protocol upgrades and is widely deployed in LTE eNodeB and small-cell baseband cards.
추천
Military Radar Signal Processing
The EP2AGZ350FH29C3G handles pulse compression, MTI filtering, and FFT computation for phased-array radar front ends in the 1-4 GHz range. Its 350K logic elements fit a 4096-point FFT plus adaptive beamforming weights, while 16.4 Mbits of embedded RAM holds coefficient tables and range-bin buffers. The 281 user I/Os connect to multi-channel ADCs and DACs via LVDS, and the 8.5 Gbps transceivers backhaul processed tracks to a higher-level processor over Serial RapidIO. Industrial or military temperature grades (I3/I4/I5) of the same package are preferred for harsh-environment radar platforms.
추천
Broadcast Video Switcher
The EP2AGZ350FH29C3G is widely used in broadcast video production switchers and routing matrices because its 350K logic elements and 281 user I/Os can simultaneously drive dozens of 3G-SDI or HD-SDI streams. Each SDI stream consumes roughly 5-8K logic elements, so the device supports 30-40 active SDI I/Os plus internal keying, mixing, and frame-sync logic. The DDR3 interface stores up to several frames of video delay for time-base correction, while the embedded 16.4 Mbit memory buffers line stores. PCIe Gen2 x4 links connect to host CPUs for control plane integration.
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High-Performance Computing Accelerator
HPC acceleration cards use the EP2AGZ350FH29C3G as a coprocessor for finance, genomics, and scientific workloads where PCIe Gen2 x4 lanes provide 16 Gbps host connectivity and the 350K logic elements implement custom arithmetic pipelines. The 8.5 Gbps transceivers bridge to additional FPGAs or to memory expansion cards at near-line rates. Embedded 16.4 Mbit RAM serves as register file and lookup cache for fixed-function pipelines, and DDR3 at 800 MHz provides 12.8 GB/s to external DRAM. Compared with GPU compute, the FPGA delivers 10-50x better performance-per-watt on bit-manipulation and streaming DSP kernels.
추천
Medical Imaging Systems
CT, MRI, and ultrasound imaging carts and consoles integrate the EP2AGZ350FH29C3G for front-end image reconstruction, beamforming, and DICOM-grade image processing. Its 350K logic elements fit a 1024-channel ultrasound beamformer or a CT back-projection kernel, while 16.4 Mbits of embedded RAM holds mid-reconstruction slices. DDR3 at 800 MHz streams raw ADC data from the receive chain, and the 281 user I/Os connect to high-channel-count analog front ends. The device's low-power 40 nm architecture suits portable cart-based ultrasound where thermal budget is constrained.
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Industrial Automation Controller
Programmable Logic Controllers (PLCs) and motion controllers deploy the EP2AGZ350FH29C3G when they need industrial protocols (EtherCAT, PROFINET, EtherNet/IP) plus deterministic multi-axis motion control in a single device. The 350K logic elements handle up to 64 axes of motion with PID loops, S-curve profiling, and synchronized servo control. The 24 transceivers connect to multi-gigabit EtherCAT or SERCOS III master interfaces, while the DDR3 controller manages large recipe and trace buffers. Industrial temperature grades (I3/I4) of the same package are preferred for factory-floor deployment.
추천
Telecom Line Card with PCIe Gen2
Telecom line cards for OTN, MPLS, and packet-optical transport use the EP2AGZ350FH29C3G because its 4 integrated PCIe Gen2 hard IP blocks eliminate soft PCIe cores and free logic for traffic management. Each PCIe Gen2 x4 lane delivers 16 Gbps to switch fabric ASICs, while 24 transceivers provide 10GbE, OTU2, or CPRI uplinks. The 16.4 Mbit embedded RAM holds classifier tables and QoS queues, and DDR3 at 800 MHz provides deep packet buffering. Telecom NEBS-compliant chassis often select I-grade temperature variants of the same footprint.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGZ350FH29C3G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGZ350FH29I3G | EP2AGZ350FH29C4G | EP2AGZ350FH29I4G | EP2AGZ300FH29C3G | EP2AGZ300FH29C4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA (29x29 mm) | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same |
| Logic Elements | 350,000 | 350,000 | 350,000 | 350,000 | 300,000 (-14%) | 300,000 (-14%) |
| Speed Grade | C3 (slowest) | I3 (industrial) | C4 (faster) | I4 (industrial, faster) | C3 (same) | C4 (faster) |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Embedded Memory (bits) | 16,402,944 | 16,402,944 | 16,402,944 | 16,402,944 | 14,688,768 (-10%) | 14,688,768 (-10%) |
| Transceivers | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps |
| PCIe Hard IP | 4 x Gen2 | 4 x Gen2 | 4 x Gen2 | 4 x Gen2 | 4 x Gen2 | 4 x Gen2 |
주요 차별점
- Mid-range 350K LE density with 24 high-speed transceivers (vs EP2AGZ225HF40C3G)
- Lowest-cost speed grade for cost-sensitive designs (vs EP2AGZ350FH29I4G)
- Integrated PCIe Gen2 hard IP eliminates soft IP overhead (vs Cyclone V GX FPGAs)
설계 노트
The EP2AGZ350FH29C3G in the 780-ball FBGA can dissipate 15-25 W at high utilization. Estimated: at 100% logic utilization, 100% toggle rate, and full transceiver activity, total power can reach 22 W. Junction-to-ambient thermal resistance (theta_JA) for the 29x29 mm FBGA is approximately 8-10 C/W with a 12-layer PCB and thermal vias under the die. Without thermal management, junction temperature exceeds the 85C commercial limit. Design with at least 25 thermal vias under the BGA center and 4-6 layer PCB with internal copper pours to stay below the 85C limit. Always run Quartus II PowerPlay early in the design cycle.
The 780-ball FBGA requires 1.0 mm ball pitch and 0.5-0.6 mm trace/space rules on escape routing. Use a 4-6 layer stack-up with two internal ground planes directly under the BGA. Place 100nF 0402 decoupling capacitors on every 4-6 power/ground pin pairs and route them with short, wide traces. Transceiver reference clock inputs require 50-ohm controlled impedance to a low-jitter external clock; do not use the internal PLLs to generate the reference. Match all 8.5 Gbps lanes to within 50 mil length tolerance.
Do not confuse the C3 speed grade with the fastest grade - C3 is the slowest commercial tier and many designs fail timing closure if the Fmax margin is below 25%. Source: Intel Arria II GZ Device Handbook speed-grade notes. Also avoid mixing FH29 and FF35 packages on the same PCB layout; both are 780-ball FBGA but the ball maps differ and require different BGA fanout. Verify the .csv pinout file from the Intel FPGA support site for your specific speed grade before tape-out.
8.5 Gbps transceiver channels require AC-coupled connections with 100nF capacitors on each TX/RX pair and 50-ohm impedance to the connector. Use a 4-layer PCB with stripline routing for transceiver lanes longer than 2 inches. Estimated: at 8.5 Gbps, insertion loss of FR4 reaches 1.5 dB/inch above 4 GHz, so budget link channel loss carefully. Reference Intel AN 558 (Arria II GX/GZ Transceiver Signal Integrity) for eye diagram and pre-emphasis settings.
규정 준수 정보
RoHS and lead-free per Intel Arria II GZ product page. Not AEC-Q100 qualified; choose I-grade variants for industrial/military use cases. Halogen-free status not explicitly stated in verified web data.
