EP2AGZ350HF40I3 - Arria II GZ FPGA, 350K LE, 1517-FBGA | Intel
부품 번호: EP2AGZ350HF40I3 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4085 | $40,850.00 |
| 100 | $3825 | $382,500.00 |
| 500 | $3650 | $1,825,000.00 |
| 1,000 | $3475 | $3,475,000.00 |
EP2AGZ350HF40I3 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - a category of digital integrated circuits whose logic function is defined by user configuration rather than fixed at the factory. In the taxonomy of digital semiconductors, FPGAs sit between microcontrollers and ASICs, offering parallel programmable fabric with hard IP cores for memory controllers and high-speed serial I/O. The Arria II GZ family is positioned as a mid-range transceiver-rich FPGA optimized for high-bandwidth applications where ASIC NRE costs cannot be justified.
Key differentiating features of the EP2AGZ350HF40I3 include 1.36 Gbps LVDS support on the LVDS side of the I/O, fractional phase-locked loops (fPLLs) for precision clocking, and 768 18x18 multipliers for DSP workloads. The device supports configuration via passive serial, fast passive parallel, and JTAG, with built-in encryption support for design security through AES-256 configuration bitstream encryption.
Architecturally, the device combines a programmable logic fabric with column-based DSP blocks arranged in rows alongside M20K embedded memory blocks. Hard IP for PCIe Gen2 and 10 Gigabit Ethernet reduces logic utilization and timing closure effort, making the device suitable for high-throughput data-path designs. The 40 nm process allows a favorable trade-off between static power, dynamic performance, and price-per-logic-element compared with 65 nm predecessors.
Typical applications include high-end test and measurement equipment, medical imaging, military radar and signal processing, broadcast video infrastructure, and high-performance computing accelerators. The transceiver-rich architecture and large logic density also suit the device for ASIC prototyping, where designers emulate full SoCs before committing to silicon.
When designing with this device, allocate at least 30 % of the available logic budget for future revisions, since utilization above 85 % complicates timing closure. Pay close attention to transceiver channel placement -24 channels must be evenly distributed across the four transceiver banks to meet lane skew requirements at 6.375 Gbps.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Cross-brand cross-reference is intentionally limited because the 1517-BGA footprint and Arria II GZ fabric are unique to Intel (formerly Altera), and true drop-in replacements from Xilinx or Lattice would require full PCB redesign.
드롭인 대체품: EP2AGZ350HF40I3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGZ350HF40I3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Embedded Memory Bits, Speed Grade, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGZ350HF40I4N
✅ 드롭인✓ 재고 있음
$2280 / 개
데이터시트 보기 →EP2AGZ350HF40I2N
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP2AGZ350HF40C4N
✅ 드롭인✓ 재고 있음
$3540 / 개
데이터시트 보기 →EP2AGZ350HF40C3N
✅ 드롭인✓ 재고 있음
$2150 / 개
데이터시트 보기 →EP2AGZ300HF40I3N
✅ 드롭인✓ 재고 있음
$3820 / 개
데이터시트 보기 →EP2AGZ225HF40I3N
✅ 드롭인✓ 재고 있음
$2210 / 개
데이터시트 보기 →EP2AGZ350HF40I3 최대 정격 & 전기적 특성
| Family | Arria II GZ |
| Logic Elements | 348,500 |
| Adaptive Logic Modules (ALMs) | 139,400 |
| Embedded Memory Bits | 21,270,528 bits |
| Embedded Memory Blocks | 950 M20K blocks |
| DSP Blocks | 768 (18x18 multipliers) |
| User I/O Pins | 13,940 |
| Transceivers | 24 channels up to 6.375 Gbps |
| Hard PCIe Controllers | 4 x Gen2 |
| Hard Memory Controllers | 8 DDR3 controllers up to 800 MHz |
| PLLs | 16 (8 fPLL + 8 GPLL) |
| Process Technology | 40 nm TSMC |
| Core Voltage | 0.9 V |
| 패키지 | 1517-BBGA, FCBGA (HF40) 40 x 40 mm |
| 동작 온도 | -40C to +100C (Industrial) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG, AES-256 |
| RoHS 상태 | Compliant |
EP2AGZ350HF40I3 1517-bbga, fcbga (hf40) 40 x 40 mm 핀 구성 가이드
EP2AGZ350HF40I3(1517-bbga, fcbga (hf40) 40 x 40 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGZ350HF40I3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGZ350HF40I3 적합 용도: 7 애플리케이션s: High-Performance Test & Measurement Equipment, Medical Imaging Systems (CT, MRI, Ultrasound), Military Radar and Signal Processing, Broadcast Video Infrastructure, ASIC Prototyping and Emulation, High-Performance Computing Accelerators, Network Interface Cards and Packet Processing.
High-Performance Test & Measurement Equipment
The EP2AGZ350HF40I3 fits high-end test equipment thanks to its 348,500 logic elements and 24 transceivers capable of 6.375 Gbps. The device supports wide parallel data acquisition and real-time DSP processing of multi-Gbps sample streams. The 768 18x18 multipliers enable FFT pipelines up to 4096 points at hundreds of MSPS, while the 8 hard DDR3 controllers (up to 800 MHz) provide ample buffering for long capture windows. Place the FPGA between the ADC array and the host PCIe Gen2 link, and use the hard PCIe controllers to stream data at maximum throughput without consuming fabric resources.
추천
Medical Imaging Systems (CT, MRI, Ultrasound)
The EP2AGZ350HF40I3 supports medical imaging by delivering real-time beamforming, image reconstruction, and video processing at deterministic latency. The 24 transceivers aggregate multi-channel ultrasound data at 6.375 Gbps per lane, while 768 DSP blocks accelerate back-projection and FFT reconstruction in CT/MRI systems. The 40 nm low-power process and 0.9 V core keep thermal design within practical limits for benchtop and portable carts. The industrial -40C to +100C rating also supports operating-room environmental compliance and reliability targets.
추천
Military Radar and Signal Processing
Radar signal processing benefits from the EP2AGZ350HF40I3's 6.375 Gbps transceivers (24 channels) which aggregate phased-array antenna data, plus 768 DSP blocks that compute pulse-Doppler, MTI, and SAR algorithms in real time. The industrial temperature range (-40C to +100C) is mandatory for outdoor military deployments. The hard PCI Express Gen2 controllers enable rapid data offload to host processors for downstream processing and display. Position the FPGA between the RF front-end ADCs and the host SoC, with multi-port DDR3 buffers for latency-tolerant capture-and-process workflows.
추천
Broadcast Video Infrastructure
The EP2AGZ350HF40I3 supports broadcast video routers, contribution encoders, and studio infrastructure handling uncompressed SDI, HD-SDI, 3G-SDI, and emerging 4K/UHD formats. The 24 transceivers at 6.375 Gbps comfortably aggregate 12 simultaneous 3G-SDI streams with on-the-fly color-space conversion. The hard memory controllers feed large frame buffers for synchronized playback and slow-motion replay. The 348,500 logic elements also enable on-chip implementation of light compression and watermarking, reducing bill-of-materials for production switchers.
추천
ASIC Prototyping and Emulation
ASIC prototyping is a flagship use case for the EP2AGZ350HF40I3 because its 348,500 logic elements can map complex SoC designs across multiple FPGAs using the high-speed transceivers as chip-to-chip interconnect. The 24 transceivers at 6.375 Gbps provide bandwidth sufficient for emulating DDR-like multi-port memory subsystems at slower rates. The industrial temperature grade and RoHS-compliant HF40 package also suit long prototype lifecycle and reflow soldering. Use the hard PCI Express controllers for host-side bring-up of the emulated SoC.
추천
High-Performance Computing Accelerators
The EP2AGZ350HF40I3 enables co-processing acceleration for HPC workloads such as genomic alignment, financial Monte Carlo simulation, and deep learning inference. The 768 18x18 multipliers map large dot-product engines, while 24 transceivers at 6.375 Gbps aggregate PCIe Gen2 x8 host links for sub-microsecond latency. The 8 DDR3 controllers feed large data structures between host memory and accelerator SRAM, achieving streaming bandwidth above 25 GB/s. The 40 nm low-power process and 0.9 V core keep TDP acceptable for dense accelerator blades.
추천
Network Interface Cards and Packet Processing
The EP2AGZ350HF40I3 suits 10G/40G NIC and packet processing applications thanks to 24 transceivers at 6.375 Gbps, which can map 4x 10 Gigabit Ethernet or 1x 40 Gigabit Ethernet (across 4 lanes) plus 8 PCIe Gen2 lanes to the host. The 8 DDR3 controllers support large flow tables and lookup databases. The 348,500 logic elements implement line-rate classification, deep-packet inspection, and encryption offload. The 40 nm low-power process and 0.9 V core keep TDP within NIC thermal envelopes (typically 15-25 W).
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGZ350HF40I3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGZ350HF40I4N | EP2AGZ350HF40I2N | EP2AGZ350HF40C4N | EP2AGZ350HF40C3N | EP2AGZ300HF40I3N | EP2AGZ225HF40I3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm |
| Logic Elements | 348,500 | 348,500 | 348,500 | 348,500 | 348,500 | 298,500 | 225,000 |
| Embedded Memory (bits) | 21,270,528 | 21,270,528 | 21,270,528 | 21,270,528 | 21,270,528 | 17,756,544 | 13,651,968 |
| DSP Blocks (18x18) | 768 | 768 | 768 | 768 | 768 | 596 | 450 |
| Transceivers / Max Data Rate | 24 / 6.375 Gbps | 24 / 6.375 Gbps | 24 / 6.375 Gbps | 24 / 6.375 Gbps | 24 / 6.375 Gbps | 24 / 6.375 Gbps | 24 / 6.375 Gbps |
| User I/O Pins | 13,940 | 13,940 | 13,940 | 13,940 | 13,940 | 13,940 | 13,940 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| RoHS / Pb-free | Yes | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Speed Grade | I3 (3rd fastest industrial) | I4 | I2 | C4 | C3 | I3 | I3 |
주요 차별점
- Mid-range Arria II GZ with 24 transceivers at 6.375 Gbps (vs EP2AGZ300HF40I3N)
- Industrial temperature grade -40C to +100C (vs EP2AGZ350HF40C4N)
- 15% more logic density than 300K alternative (vs EP2AGZ300HF40I3N)
설계 노트
Estimated: The EP2AGZ350HF40I3 in the HF40 FCBGA package has a typical theta-JA of approximately 1.5 C/W with a 36-layer PCB and a top-side heatsink. At full utilization (around 30 W dynamic power plus transceivers operating), junction temperature may rise 45 C above ambient. Implement a heatsink with at least 200 CFM forced-air cooling or a cold-plate for industrial-grade designs operating above 60 C ambient.
The HF40 FCBGA uses a 1.0 mm ball pitch. Use 12 layers minimum with 4 dedicated power/ground planes, vias-in-pad for BGA breakout, and microvia/stacked-via technology for fanout. Reference the Altera Arria II GZ PCB Design Guide for impedance-controlled routing rules for transceivers (100 ohm differential) and DDR3 (50 ohm single-ended). De-coupling: place 100 nF X7R caps on every power pin within 5 mm trace length.
Transceiver channel placement is critical: 24 channels are distributed across four transceiver banks (six channels per bank) on the HF40 package. Bank skew across six channels must not exceed 40 ps to meet PCIe Gen2 and 10GBASE-R specs. Use matched-length routing and tight impedance control. The hard PCIe controllers are anchored to specific transceiver banks; consult the device handbook for fixed pin assignments before PCB layout.
Estimated: The EP2AGZ350HF40I3 maximum core power of 38 W (combined VCC + VCCPD + transceiver VCCH) requires a dedicated 0.9 V regulator capable of at least 45 A peak load. Using a generic buck converter will cause thermal shutdown at high toggle rates. Power sequencing must satisfy Arria II GZ specification: 1.0 V core must ramp before VCCAUX (2.5 V) and VCCPD (2.5/3.0 V); failure to sequence correctly latches configuration failure.
규정 준수 정보
RoHS and REACH compliant per Intel/Altera product page. Halogen-free status not explicitly stated in available web data. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
