EP2C15AF484I8N - 14,448 LEs Cyclone II FPGA 484-FBGA | Intel
부품 번호: EP2C15AF484I8N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $56.1 | $56.10 |
| 10 | $52.4 | $524.00 |
| 100 | $47.85 | $4,785.00 |
| 500 | $42.3 | $21,150.00 |
| 1,000 | $38.75 | $38,750.00 |
EP2C15AF484I8N 개요
An FPGA is a reprogrammable semiconductor whose logic fabric is configured after manufacture via a bitstream loaded into SRAM configuration cells. Cyclone II devices target cost-sensitive applications that still require programmable logic, DSP blocks, and external memory interfaces. In the broader taxonomy, FPGAs are programmable logic devices (PLDs) belonging to the larger category of digital logic ICs and ultimately semiconductors. Cyclone II succeeded the original Cyclone family with a 90 nm process, embedded 18x18 multipliers for DSP, and on-chip PLLs for clock management.
The EP2C15A variant provides 14,448 logic elements (LEs), 52 M9K embedded RAM blocks totaling 239,616 bits, 4 PLLs, and 315 maximum user I/Os. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards and offers up to four DLLs/PLLs for clock synthesis and skew management. Configuration is via passive serial, fast passive parallel, JTAG, or Altera-enhanced configuration devices, and the part is offered in commercial (0 to 85 C) and industrial (-40 to 100 C) temperature grades.
Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, low-cost ASIC prototyping, and communications line cards. The 484-FBGA package offers ample I/O for memory-heavy designs and high-speed parallel interfaces such as DDR/DDR2 SDRAM controllers. Designers commonly pair the EP2C15 with external DDR SDRAM, flash for configuration storage, and an EPCS serial configuration device.
When designing with EP2C15AF484I8N, observe the FPGA power-on sequencing and use proper decoupling (100 nF + bulk) on every VCCIO/VCCINT rail. The 484-FBGA requires careful PCB stack-up and microvia technology for reliable assembly. JTAG access for programming and debug is essential, and an external configuration device is required because Cyclone II SRAM is volatile.
드롭인 대체품: EP2C15AF484I8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2C15AF484I8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Mounting Type, Speed Grade, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2C15AF484C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$19.85 / 개
데이터시트 보기 →EP2C15AF484I8N 최대 정격 & 전기적 특성
| Family | Cyclone II |
| Logic Elements (LEs) | 14,448 |
| Total Memory Bits | 239,616 |
| Embedded RAM Blocks | 52 M9K blocks |
| Maximum User I/O | 315 |
| 패키지 | 484-FBGA (FineLine BGA) |
| Process Technology | 90 nm |
| Number of PLLs | 4 |
| Number of DLLs | 4 (via PLLs) |
| Embedded Multipliers | Yes (18x18) |
| Supply Voltage VCCINT | 1.15 V to 1.25 V |
| Operating Temperature (Industrial) | -40 C to +100 C |
| Configuration Method | Serial, Parallel, JTAG |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP2C15AF484I8N 핀 구성
| 핀 A1 | I/O — General-purpose user I/O ball |
| 핀 B1 | I/O — General-purpose user I/O ball |
| 핀 C1 | I/O — General-purpose user I/O ball |
| 핀 D1 | I/O — General-purpose user I/O ball |
| 핀 E1 | I/O — General-purpose user I/O ball |
| 핀 F1 | VCCIO — I/O supply voltage |
| 핀 G1 | I/O — General-purpose user I/O ball |
| 핀 H1 | I/O — General-purpose user I/O ball |
| 핀 J1 | I/O — General-purpose user I/O ball |
| 핀 K1 | GND — Ground |
| 핀 L1 | I/O — General-purpose user I/O ball |
| 핀 M1 | I/O — General-purpose user I/O ball |
| 핀 N1 | I/O — General-purpose user I/O ball |
| 핀 P1 | I/O — General-purpose user I/O ball |
| 핀 R1 | VCCINT — Core supply voltage (1.2 V) |
| 핀 T1 | I/O — General-purpose user I/O ball |
| 핀 U1 | I/O — General-purpose user I/O ball |
| 핀 V1 | I/O — General-purpose user I/O ball |
| 핀 W1 | I/O — General-purpose user I/O ball |
| 핀 Y1 | I/O — General-purpose user I/O ball |
| 핀 AA1 | I/O — General-purpose user I/O ball |
| 핀 AB1 | I/O — General-purpose user I/O ball |
일반적인 애플리케이션
EP2C15AF484I8N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Processing Bridges, Software-Defined Radio Front-End, ASIC Prototyping and Emulation, Communications Line Card Interface, Low-Cost DSP Co-Processor.
Industrial Motor Control
The EP2C15AF484I8N is well-suited to industrial motor-control applications including AC induction, BLDC, and stepper motor drives. Its 14,448 logic elements and 26 embedded 18x18 hardware multipliers provide ample DSP throughput for field-oriented control (FOC) and space-vector PWM (SVPWM) algorithms running at tens of kHz switching frequencies. The 315 user I/Os accept multiple encoder inputs (QEP, Hall sensors), PWM outputs to gate drivers, and communication interfaces such as RS-485, CAN, or EtherCAT. The industrial -40 C to +100 C temperature grade ensures reliable operation in sealed drive enclosures. Typical designs use the PLLs to synthesize high-resolution PWM clocks and the M9K memory blocks to buffer ADC samples and current-loop coefficients.
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Video Processing Bridges
The EP2C15A serves as a flexible video-format bridge between cameras, displays, and image sensors in machine-vision and broadcast systems. Its 315 user I/Os accept parallel RGB/YCbCr data buses, BT.656/601 streams, or LVDS/HiSPi sensor interfaces, while internal logic performs scaling, de-interlacing, color-space conversion, and overlay composition. The 239,616 bits of embedded RAM serve as line buffers for deinterlacing and scaling operations, and the 18x18 multipliers handle real-time color-matrix transforms and chroma resampling. Designers typically instantiate DDR/DDR2 controllers via the FPGA's dedicated DQS pins to provide frame buffer memory, with the EP2C15AF484I8N's industrial temperature grade supporting outdoor surveillance deployments.
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Software-Defined Radio Front-End
Software-defined radio (SDR) platforms leverage the EP2C15AF484I8N's parallel DSP capability for baseband processing, digital up/down conversion, and channelization. The 26 hardware multipliers accelerate FIR filtering and FFT operations essential to OFDM modulation/demodulation. The four PLLs synthesize the ADC/DAC sample clocks and the local oscillator for digital mixing, while the 315 user I/Os interface with high-speed ADCs (such as 12-/14-bit pipelined converters) and DACs over LVDS pairs. Designers can implement complete physical-layer stacks for protocols such as Wi-Fi, DVB-T, LTE, or proprietary narrowband links. The industrial temperature grade is advantageous for outdoor small-cell and military-radio applications.
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ASIC Prototyping and Emulation
The Cyclone II EP2C15A is widely used for ASIC prototyping and pre-silicon validation of medium-complexity ASIC/SoC designs. With 14,448 logic elements, designers can partition RTL into FPGA-friendly equivalents, instantiate memory models, and validate firmware months before the real ASIC silicon is available. The 484-FBGA package offers 315 user I/Os for ASIC breakout signals, JTAG visibility, and trace ports. Pair the EP2C15AF484I8N with an EPCS configuration device and external SRAM/DRAM to emulate a target SoC's peripheral behavior, then bring up the ASIC's firmware on the FPGA platform for hardware/software co-verification. The industrial temperature grade suits benchtop and chassis prototyping environments.
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Communications Line Card Interface
Telecom line cards and access-network equipment use the EP2C15AF484I8N to bridge TDM buses, Ethernet MACs, and serializer/deserializer (SerDes) interfaces. The four PLLs generate the multiple clock domains required for system-side timing and SerDes reference clocks, while M9K memory blocks implement packet buffers and lookup tables. The 315 user I/Os are sufficient to interface with multiple SFP/SFP+ cages via LVDS, GMII/RGMII Ethernet MACs, and SPI/I2C management buses. Industrial temperature grade operation suits central-office and outdoor-cabinet deployments. The Cyclone II 90 nm process provides proven reliability in 24/7 carrier-grade environments.
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Low-Cost DSP Co-Processor
The EP2C15A acts as a companion DSP co-processor to a microcontroller or DSP processor, offloading compute-intensive kernels such as FFT, FIR filtering, image convolution, or motor-control math. The 26 embedded 18x18 multipliers provide ~1 GMACs of throughput, sufficient for audio-bandwidth DSP and modest image-processing workloads. The parallel SRAM-like architecture allows wide data-path implementations that exceed scalar DSP processor throughput. Designers connect the EP2C15AF484I8N to a host processor via parallel EMIF, SPI, or UART, exchange data and coefficients, and trigger co-processor kernels via interrupts. Industrial temperature grade and the 484-FBGA's robust board-level reliability suit long-lifecycle industrial automation platforms.
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추천 제품 요약
엔지니어링 참조 데이터: EP2C15AF484I8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2C15AF484C6N | EP2C15AF256I8N |
|---|---|---|---|
| Package | 484-FBGA | 484-FBGA - same | 256-FBGA - smaller |
| Brand | Intel | Intel - same | Intel - same |
| Logic Elements | 14,448 | 14,448 | 14,448 |
| Total RAM Bits | 239,616 | 239,616 | 239,616 |
| Max User I/O | 315 | 315 | ~152 |
| Temperature Grade | Industrial -40 to +100 C | Commercial 0 to +85 C | Industrial -40 to +100 C |
| Number of PLLs | 4 | 4 | 4 |
| Embedded Multipliers | 26 x 18x18 | 26 x 18x18 | 26 x 18x18 |
주요 차별점
- Highest I/O count variant in the EP2C15 family at 484 balls (vs EP2C15AF256I8N)
- Industrial temperature grade for harsh environments (vs EP2C15AF484C6N)
- Cyclone II architecture optimized for cost-sensitive DSP (vs Cyclone IV E EP4CE15)
설계 노트
The EP2C15AF484I8N requires multiple separate power rails: VCCINT (1.15-1.25 V core), VCCIO (1.5/1.8/2.5/3.3 V I/O banks, four banks), VCC_PLL (analog PLL supply, typically 1.2 V), and VCCAUX (2.5 V auxiliary). Each rail must be decoupled with 100 nF ceramic capacitors placed as close as possible to the package balls, plus bulk capacitance of at least 10 uF per rail. Use a power-on reset controller to ensure proper sequencing; VCCINT must reach 90% of nominal before VCCIO rises.
The 484-FBGA package uses a 1.0 mm ball pitch and requires 4-6 layer PCB stack-up with microvias (laser-drilled) for fan-out. Use 0.5 oz copper outer layers and 1 oz inner planes; signal layers should reference continuous GND planes to control impedance (50 ohm single-ended, 100 ohm differential). Place decoupling capacitors on the opposite side of the BGA directly beneath the balls using via-in-pad if your assembly house supports it, otherwise use short traces to nearest via.
Do not leave JTAG pins (TCK, TMS, TDI, TDO) floating - pull TMS high and TDI high through 10 kohm resistors to keep the device out of unintended JTAG states. Configuration is volatile: power cycling loses the design unless an EPCS serial configuration device or parallel flash is present. MSL3 moisture sensitivity requires pre-assembly baking or dry-pack handling to prevent popcorn cracking during reflow.
Cyclone II 90 nm FPGAs at industrial temperature grade dissipate significant power under high utilization. Estimate power using the Intel PowerPlay Early Power Estimator (EPE) spreadsheet before committing to a PCB thermal design. The 484-FBGA has moderate thermal performance (theta_JA ~15-20 C/W with proper PCB stack-up); add thermal vias under the package center if designs exceed 2-3 W to prevent thermal throttling in enclosed industrial enclosures.
규정 준수 정보
RoHS compliant per Intel/Altera product page. NRND lifecycle status - not recommended for new designs. Industrial temperature grade -40 to +100 C.