EP4CGX75CF23C6N - Cyclone IV GX FPGA, 75K LE, 484-FBGA | Intel
부품 번호: EP4CGX75CF23C6N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $168 | $168.00 |
| 10 | $152 | $1,520.00 |
| 100 | $135 | $13,500.00 |
| 500 | $118 | $59,000.00 |
| 1,000 | $99 | $99,000.00 |
EP4CGX75CF23C6N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP resources. FPGAs sit in the programmable logic family, alongside CPLDs, and are used as glue logic, parallel processors, hardware accelerators, or rapid-prototyping platforms for ASIC designs. Compared with microcontrollers, FPGAs offer deterministic parallelism and far higher I/O throughput; compared with ASICs, FPGAs are reconfigurable in the field and ship with no NRE cost. The Cyclone IV GX family specifically targets low-power, transceiver-rich designs in the 1.0-3.125 Gbps data-rate range.
Key features of the EP4CGX75CF23C6N include 73,920 logic elements (LEs), 4,257,792 bits (approximately 4.27 Mbit) of embedded SRAM, 150 embedded 18x18 multipliers, 4 PLLs, and 8 high-speed transceivers. The device is fabricated on a low-power 60 nm process and supports I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCIe. Designers can configure the FPGA via JTAG, Active Serial (AS), or Passive Serial (PS) configuration modes. The 484-ball FBGA package provides a compact footprint for high-density board designs.
Architecturally, the EP4CGX75CF23C6N uses SRAM-based configuration cells, which means the device is volatile and must be reloaded on every power-up from a configuration memory such as the EPCS or EPCQ serial flash. Logic is organized into Logic Array Blocks (LABs) of 16 LEs each, with each LE containing a 4-input LUT, a register, and a carry chain. The transceiver blocks include physical coding sublayer (PCS) and physical medium attachment (PMA) layers hard-wired for protocols including PCIe, GIGE, and Serial RapidIO.
Typical applications include low-cost PCIe endpoint cards, industrial vision and image processing, motor control and factory automation, protocol bridging (PCIe-to-Local Bus, GIGE-to-Memory), Software Defined Radio (SDR) baseband, and test & measurement equipment. The combination of built-in transceivers and large logic capacity makes this device particularly popular for embedded prototyping and small-volume production runs.
A critical design consideration for the EP4CGX75CF23C6N is power-supply sequencing - the FPGA requires multiple rails (core VCC, VCCPD, VCCA, VCCD_PLL, and transceiver supplies VCCE_GXB and VCCH_GXB) ramped in the correct order to avoid device stress. Decoupling must follow the reference board guideline, with high-frequency decoupling placed as close to each ball as possible. Designers must also allocate sufficient configuration storage (EPCS or EPCQ flash) and select the correct configuration mode via MSEL pins.
This page synthesizes distributor pricing, drop-in same-package alternatives, transceiver-count comparisons, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP4CGX75CF23C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX75CF23C6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Operating Temperature, Embedded Memory, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX75CF23C7N
✅ 드롭인✓ 재고 있음
$71.2 / 개
데이터시트 보기 →EP4CGX75CF23C8N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP4CGX150CF23C6N
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP4CGX75CF23C6
✅ 드롭인✓ 재고 있음
$62.95 / 개
데이터시트 보기 →EP4CGX75CF23I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$165.3 / 개
데이터시트 보기 →EP4CGX75CF23C6N 최대 정격 & 전기적 특성
| Series | Cyclone IV GX |
| Family | EP4CGX75 |
| Logic Elements (LE) | 73,920 |
| Embedded Memory (Bits) | 4,257,792 (approx. 4.27 Mbit) |
| Embedded Memory Blocks | M9K memory blocks |
| Embedded 18x18 Multipliers | 150 |
| User I/O Count | 290 |
| Number of Transceivers | 8 (integrated, up to 3.125 Gbps) |
| PLLs | 4 |
| 패키지 | 484-FBGA (FineLine BGA) |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | 6 |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| Process Technology | 60 nm low-power CMOS |
| Supply Voltage - Core | 1.2 V (typical) |
| RoHS 상태 | Compliant |
| Transceiver Data Rate (max) | 3.125 Gbps |
EP4CGX75CF23C6N 484-fbga (fineline bga) 핀 구성 가이드
EP4CGX75CF23C6N(484-fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX75CF23C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX75CF23C6N 적합 용도: 6 애플리케이션s: PCIe Endpoint Add-In Cards, Industrial Vision and Image Processing, Motor Control and Factory Automation, Protocol Bridging and Interface Conversion, Software Defined Radio (SDR) Baseband, Test and Measurement Equipment.
PCIe Endpoint Add-In Cards
The EP4CGX75CF23C6N's 8 hard PCIe-capable transceivers up to 3.125 Gbps and 290 user I/Os make it ideal for low-cost PCIe Gen1 endpoint cards. The integrated transceivers implement hard PCS and PMA for PCIe, eliminating external PHY ICs and reducing BOM cost and PCB area. Compared to soft PCIe IP cores in competing FPGAs, the hard PCIe blocks deliver deterministic latency and lower power, which is critical for latency-sensitive data-acquisition and industrial-control endpoints.
추천
Industrial Vision and Image Processing
With 73,920 LEs, 150 18x18 multipliers, and 4.27 Mbit embedded SRAM, the EP4CGX75CF23C6N fits mid-resolution image-processing pipelines including Camera Link, GigE Vision, and CoaXPress pre-processing boards. The M9K memory blocks provide line-buffer and frame-buffer storage, while the embedded multipliers accelerate Sobel, convolution, and FFT kernels. The 8 transceivers are valuable for connecting to high-speed image sensors and GigE Vision interfaces.
추천
Motor Control and Factory Automation
The EP4CGX75CF23C6N provides 4 PLLs, 150 DSP multipliers, and 290 user I/Os that map well to multi-axis motor control, encoder feedback, and EtherCAT/Ethernet/IP industrial protocol bridging. The 60 nm low-power process keeps junction temperature low even in sealed industrial enclosures, and the commercial temperature grade (0C to +85C) is suitable for most factory-floor applications. The integrated transceivers enable native Ethernet without external PHYs, reducing BOM cost for industrial Ethernet bridges.
추천
Protocol Bridging and Interface Conversion
The EP4CGX75CF23C6N is widely used to bridge PCIe, Gigabit Ethernet, Serial RapidIO, and legacy parallel buses in embedded telecom and storage systems. Its 8 transceivers simultaneously support multiple protocols, while the 290 user I/Os accommodate wide parallel interfaces such as DDR2/DDR3 memory controllers and LVDS buses. Designers use the embedded M9K memory as ping-pong buffers between domains, achieving line-rate throughput without external FIFOs in most bridging topologies.
추천
Software Defined Radio (SDR) Baseband
The EP4CGX75CF23C6N's 150 embedded 18x18 multipliers, 8 transceivers, and 4.27 Mbit memory support digital-down-conversion (DDC), digital-up-conversion (DUC), and FIR filter banks for narrowband SDR baseband designs below 100 MHz of instantaneous bandwidth. The hard transceivers interface directly to ADC/DAC companion chips, while the DSP blocks handle modulation, demodulation, and channelization at sample rates up to ~150 MSPS. This device is widely used in low-cost SDR prototyping platforms.
추천
Test and Measurement Equipment
The EP4CGX75CF23C6N's high transceiver count, programmable I/O standards (LVDS, LVCMOS, SSTL), and 4 PLLs make it a flexible platform for logic analyzers, protocol exercisers, and bit-error-rate testers. The 290 user I/Os accommodate high-channel-count probing, while the embedded M9K memory captures protocol frames for offline analysis. Its deterministic timing and reconfigurability allow rapid iteration when developing new test methodologies.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX75CF23C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX75CF23C7N | EP4CGX75CF23C8N | EP4CGX150CF23C6N | EP4CGX75CF23C6 | EP4CGX75CF23I7N |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 73,920 | 73,920 - same | 73,920 - same | 150,000 (+103%) | 73,920 - same | 73,920 - same |
| Embedded Memory | 4.27 Mbit | 4.27 Mbit - same | 4.27 Mbit - same | 6.5 Mbit (+52%) | 4.27 Mbit - same | 4.27 Mbit - same |
| Transceivers | 8 (up to 3.125 Gbps) | 8 (3.125 Gbps) - same | 8 (3.125 Gbps) - same | 8 (3.125 Gbps) - same | 8 (3.125 Gbps) - same | 8 (3.125 Gbps) - same |
| Speed Grade | 6 | 7 (faster Fmax) | 8 (fastest Fmax) | 6 - same | 6 - same | 7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial - same | Commercial - same | Commercial - same | Commercial - same | Industrial (-40C to +100C) |
| Embedded 18x18 Multipliers | 150 | 150 - same | 150 - same | 240 (+60%) | 150 - same | 150 - same |
주요 차별점
- Integrated 8-channel 3.125 Gbps transceivers in a low-cost FPGA (vs EP4CGX50CF23C6N)
- Speed grade 6 vs speed grade 7 cost optimization (vs EP4CGX75CF23C7N)
- Drop-in upgrade path to higher-density EP4CGX150 family (vs EP4CGX150CF23C6N)
설계 노트
The EP4CGX75CF23C6N requires multiple power rails ramped in a specific order: VCC (1.2 V core), VCCPD (I/O pre-driver), VCCA (PLL analog), VCCD_PLL (PLL digital), and the transceiver supplies VCCE_GXB and VCCH_GXB. Per Intel's Cyclone IV GX power-up sequencing guideline, ramp VCC first, then VCCPD, and bring up transceiver supplies last. Adding 100 uF bulk and 0.1 uF / 1 nF high-frequency decoupling per pin group is recommended. Failing to sequence correctly can cause latch-up or long-term reliability degradation.
The 484-FBGA package has a typical theta_JA of approximately 14 C/W with a properly designed 12-layer PCB (per the Cyclone IV GX thermal model). At full transceiver utilization (8 channels at 3.125 Gbps) the device can dissipate 4-5 W; ensure at least 4 thermal vias in the BGA thermal pad array and a continuous ground plane on inner layers for heat spreading. Industrial enclosures should size for 60C ambient maximum at the device case.
Route all 8 transceiver differential pairs with 100 ohm differential impedance and length-matched to within 5 mils. Place the transceiver AC-coupling capacitors (typically 100 nF) within 250 mils of the FPGA transmit ball. JTAG and configuration pins (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) must be pulled to the correct idle state with 10 kohm resistors. Decoupling must follow the reference board BGA breakout pattern with via-in-pad recommended on inner balls.
Do not leave the MSEL[3:0] pins floating - they select the configuration mode (AS, PS, JTAG) and must be pulled high or low per the configuration scheme. Do not omit the configuration flash (EPCS or EPCQ) on production boards - the device is volatile. Ensure CONF_DONE is properly buffered - if held low after configuration, the device will not enter user mode. Lastly, verify the configuration flash timing at production temperature corners; a flash that meets timing at room may fail in industrial (-40C to +100C) operation.
규정 준수 정보
RoHS and REACH compliant per Altera/Intel product declaration. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For automotive applications, evaluate Cyclone IV GX automotive-grade variants or Cyclone V family.