EP2AGX95EF29I5N - Arria II GX FPGA 89K LE | Intel | 780-FCBGA
부품 번호: EP2AGX95EF29I5N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1320 | $1,320,000.00 |
EP2AGX95EF29I5N 개요
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing programmable logic blocks, configurable I/O, embedded memory, dedicated DSP blocks, and high-speed transceiver channels. FPGAs occupy a unique position in the compute hierarchy - between fixed-function ASICs and software-driven microprocessors - allowing hardware-level parallelism and post-silicon logic updates. Within Intel's programmable solutions portfolio, the Arria II GX family sits in the mid-range, balancing transceiver bandwidth, logic density, and power for applications such as wireless baseband, broadcast video, and high-performance industrial imaging.
Key features of the EP2AGX95EF29I5N include 6.25 Gbps embedded transceivers, dedicated hardware DSP blocks for high-throughput filtering and FFT operations, and on-chip memory blocks supporting 6.8 Mbits of distributed and block RAM. The 780-pin FC-BGA package provides the high-density interconnect required for hundreds of general-purpose and high-speed serial pins, while the industrial temperature range (-40 °C to +100 °C) supports deployment in harsh-environment systems.
Architecturally, the Arria II GX family uses 8-input adaptive logic modules (ALMs), variable-precision DSP blocks, and a hierarchical routing fabric. Hardened PCI Express Gen1 endpoints and external memory interfaces (DDR2/DDR3/QDRII+) reduce soft-logic overhead. Compared with earlier Stratix IV and Cyclone IV devices, the Arria II GX targets mid-bandwidth serial I/O with lower power per channel.
Typical applications include wireless LTE/4G baseband processing, real-time broadcast video encoding, radar and signal-intelligence DSP front-ends, and high-speed data-acquisition systems. The transceiver count and logic density make it well suited for protocols such as Serial RapidIO, 10 GbE backplanes, and CPRI fronthaul.
Designers should plan power-rail sequencing for the 0.9 V core and auxiliary supplies, allocate sufficient PCB layers for FC-BGA breakout, and follow Intel's pin-out guidelines for transceiver reference-clock routing to maintain signal integrity at multi-gigabit data rates.
This page synthesizes real-time distributor pricing, same-package drop-in alternatives, and practical design considerations not consolidated in the manufacturer datasheet.
드롭인 대체품: EP2AGX95EF29I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX95EF29I5N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, Embedded Memory Bits, PLLs.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX95EF29I5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$221 / 개
데이터시트 보기 →EP2AGX95EF29I3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1280 / 개
데이터시트 보기 →EP2AGX95EF29I3G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$899 / 개
데이터시트 보기 →EP2AGX95EF29C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$555.1 / 개
데이터시트 보기 →EP2AGX95EF29C6G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$465 / 개
데이터시트 보기 →EP2AGX95EF29I5N 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Device Type | FPGA |
| Logic Elements | 89,178 |
| Embedded Memory Bits | 6,839,296 |
| Number of 18x18 Multipliers | 372 |
| Maximum Transceiver Data Rate | 6.25 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Operating Temperature Grade | Industrial |
| 패키지 | 780-pin FC-BGA (HBGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP2AGX95EF29I5N 핀 구성
| 핀 AB12 | REFCLK0_n — Transceiver reference clock 0, negative |
| 핀 AB13 | REFCLK0_p — Transceiver reference clock 0, positive |
| 핀 AC14 | GXB_RX0_n — Transceiver channel 0 receive, negative |
| 핀 AC15 | GXB_RX0_p — Transceiver channel 0 receive, positive |
| 핀 AC16 | GXB_TX0_n — Transceiver channel 0 transmit, negative |
| 핀 AC17 | GXB_TX0_p — Transceiver channel 0 transmit, positive |
| 핀 F14 | VCC — Core supply voltage (0.9 V nominal) |
| 핀 F15 | VCC — Core supply voltage (0.9 V nominal) |
| 핀 F16 | GND — Common ground reference |
| 핀 F17 | GND — Common ground reference |
| 핀 G12 | VCCIO8A — I/O bank 8A supply voltage |
| 핀 G13 | VCCIO8B — I/O bank 8B supply voltage |
| 핀 H10 | IO_A8 — General-purpose user I/O, bank 8 |
| 핀 H11 | IO_A9 — General-purpose user I/O, bank 8 |
| 핀 H12 | IO_A10 — General-purpose user I/O, bank 8 |
| 핀 J15 | nCONFIG — Configuration control (active-low) |
| 핀 J16 | nSTATUS — Configuration status (active-low) |
| 핀 K17 | CONFIG_DONE — Configuration complete indicator |
| 핀 K18 | TCK — JTAG test clock |
| 핀 L19 | TMS — JTAG test mode select |
일반적인 애플리케이션
EP2AGX95EF29I5N 적합 용도: 6 애플리케이션s: Wireless LTE/4G Baseband Processing, Broadcast Video Encoding and Processing, Radar and SIGINT DSP Front-End, High-Speed Data Acquisition Systems, Industrial Imaging and Machine Vision, Protocol Bridge and Telecommunications Backplane.
Wireless LTE/4G Baseband Processing
The EP2AGX95EF29I5N fits LTE/4G baseband designs because its 89,178 logic elements, 372 dedicated 18x18 hardware multipliers, and 6.8 Mbits of embedded block RAM directly support the channel-card FFT, turbo-decoder, and uplink/downlink datapath requirements of a single-sector baseband. Its 6.25 Gbps transceivers carry CPRI fronthaul links between the baseband unit and remote radio heads at up to 4.915 Gbps. Placed on the baseband timing card with two DDR3 banks of external memory, the device delivers deterministic latency while leaving enough logic headroom for MAC-layer processing and per-UE reference-signal generation.
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Broadcast Video Encoding and Processing
Broadcast encoders benefit from the EP2AGX95EF29I5N's combination of 372 hardware multipliers for motion-estimation and 6.8 Mbits of block RAM for line/frame buffers. The industrial temperature grade supports outdoor encoder head-ends and mobile broadcast trucks. The embedded transceivers handle SDI over coax (using external adaptive cable equalisers) and SMPTE 2022 video-over-IP streams up to 3 Gbps. The 780-ball FC-BGA provides the hundreds of I/O needed to drive parallel video buses while keeping the BOM low for a single-chip encoder solution.
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Radar and SIGINT DSP Front-End
In radar and signal-intelligence front-ends, the EP2AGX95EF29I5N's 372 hardware multipliers execute pulse-compression, MTI filtering, and FFTs in real time at multi-hundred-MHz sample rates. The 6.8 Mbits of embedded memory hold window coefficients and overlap-save buffers, reducing the number of external memory accesses per cycle. Transceiver rates up to 6.25 Gbps accept raw ADC data from GHz-class converters. Industrial temperature grade and the ruggedised 780-ball FC-BGA package qualify the device for ground-vehicle and shipboard installations.
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High-Speed Data Acquisition Systems
High-speed DAQ platforms leverage the EP2AGX95EF29I5N to capture ADC data at multi-GSPS rates through the 6.25 Gbps transceivers and pre-process the stream in real time. Block RAM acts as a circular sample buffer, while logic elements implement triggering, decimation, and channel aggregation. Industrial temperature support enables factory-floor and outdoor test-rig deployment. The 780-ball FC-BGA provides the hundreds of LVDS pairs required for parallel low-speed ADC channels plus high-speed serial links to the host CPU.
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Industrial Imaging and Machine Vision
The EP2AGX95EF29I5N is well suited to high-resolution line-scan and area-scan camera processing where the 372 hardware multipliers accelerate Bayer demosaicing, color-matrix conversion, and JPEG2000 compression. The 6.8 Mbits of embedded memory act as line buffers, while the transceivers push GigE Vision, CoaXPress, or 10 GigE frame data off-board at line rate. Industrial temperature grade plus the robust FC-BGA package allow deployment in factory-floor vision systems and outdoor traffic-monitoring cameras.
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Protocol Bridge and Telecommunications Backplane
As a protocol bridge, the EP2AGX95EF29I5N converts between Serial RapidIO, 10 GbE backplanes, and legacy telecom interfaces, using its 6.25 Gbps transceivers and PCI Express Gen1 hard IP. The 89K logic elements implement protocol stacks, queue managers, and packet-classification engines. Industrial temperature grade and 0.9 V core operation fit into ATCA and MicroTCA shelves. The 780-ball FC-BGA (EF29) footprint provides ample I/O for both serial channels and parallel management-plane interfaces.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX95EF29I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX95EF29I5G | EP2AGX95EF29I3N | EP2AGX95EF29I3G | EP2AGX95EF29C6N | EP2AGX95EF29C6G |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-BGA (EF29) | 780-ball FC-BGA (EF29) - same | 780-ball FC-BGA (EF29) - same | 780-ball FC-BGA (EF29) - same | 780-ball FC-BGA (EF29) - same | 780-ball FC-BGA (EF29) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 |
| Embedded Memory (bits) | 6,839,296 | 6,839,296 | 6,839,296 | 6,839,296 | 6,839,296 | 6,839,296 |
| 18x18 Multipliers | 372 | 372 | 372 | 372 | 372 | 372 |
| Max Transceiver Data Rate | 6.25 Gbps | 6.25 Gbps | 6.25 Gbps | 6.25 Gbps | 6.25 Gbps | 6.25 Gbps |
| Speed Grade | -5 (mid) | -5 | -3 (slower) | -3 (slower) | -6 (fastest) | -6 (fastest) |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Commercial | Commercial |
주요 차별점
- Lead-free finish matches RoHS mainstream design rules (vs EP2AGX95EF29I5G)
- Balanced -5 speed grade for most designs (vs EP2AGX95EF29I3N)
- Industrial temperature grade extends deployment range (vs EP2AGX95EF29C6N)
설계 노트
EP2AGX95EF29I5N requires multiple regulated rails: 0.9 V core, 1.1 V PLL analog, 1.8 V/2.5 V/3.3 V VCCIO per bank, and a 2.5 V VCCPD for configuration. Sequence the core supply before VCCIO and VCCPD per Intel's power-on sequencing guidelines; failure to sequence may trigger inrush currents that brown-out adjacent rails. Use decoupling of at least 1 µF + 0.1 µF per VCC pin and bulk capacitors at each regulator. Estimated: at 500 MHz logic activity the core current can exceed 3 A, so the 0.9 V regulator must deliver at least 5 A with headroom.
The 780-ball FC-BGA package has a 1.0 mm ball pitch per the Arria II GX handbook. Route the top layer as a fan-out with micro-vias-in-pad (VIP) if escape is required on high-density ball rows. Use 8-12 PCB layers with continuous reference planes for the transceiver and memory interfaces. Match differential pair lengths to within 150 µm for the 6.25 Gbps transceiver channels and within 25 ps for the external memory interface. Estimated: the FC-BGA ball map for EF29 occupies roughly 29 mm x 29 mm with 0.4 mm diameter solder balls.
Common pitfalls include leaving JTAG pins floating, ignoring nCONFIG reset timing, and confusing the EF29 and DF25 pin-outs which are not pin-compatible. Do not assume the silicon-default temperature sensor calibration is valid in industrial grade - re-run the calibration routine at first FPGA configuration. When migrating between -3, -5, and -6 speed grades, re-run place-and-route in Quartus; do not rely on timing closure from the previous speed grade.
규정 준수 정보
RoHS compliant per the 'N' suffix on the part number. Not AEC-Q100 qualified because this is an FPGA in a 780-ball FC-BGA package - AEC-Q100 is typically applied to discrete power and analog ICs. Halogen-free status was not stated in the verified web data and is marked unknown. Conflict-minerals compliance per Intel's published policy.
