EP2C50F672C7N - Cyclone II FPGA 50K LE 672-FBGA | Intel / Altera
부품 번호: EP2C50F672C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $250.17 | $250.17 |
| 10 | $232.5 | $2,325.00 |
| 100 | $198.4 | $19,840.00 |
| 500 | $175.25 | $87,625.00 |
| 1,000 | $162.8 | $162,800.00 |
EP2C50F672C7N 개요
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and dedicated I/O cells. FPGAs occupy a unique position in the digital design hierarchy: they sit between fixed-function ASICs (high NRE, low per-unit cost) and microcontrollers (low performance, sequential execution), offering hardware-level parallelism with reprogrammability. The Cyclone II family specifically targets cost-sensitive applications that previously required mask-programmed ASICs, making it suitable for volume production in industrial, automotive, communications, and consumer markets.
Key features include 450 dedicated user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards; embedded 18x18 multipliers for DSP arithmetic; up to 594 Kbits of embedded M4K memory blocks (configurable as RAM, ROM, or FIFO); and a flexible clock management infrastructure with PLLs. The 672-FBGA package exposes the full I/O count of the device, enabling high-density board designs where every signal pin must be brought out.
Architecturally, Cyclone II devices use a four-input LUT-based logic element backed by a programmable routing fabric. The 90 nm process provides a favorable performance-to-cost balance and supports embedded RAM blocks with true dual-port capability. The device is supported by the Quartus II design toolchain (including Quartus Prime), which provides synthesis, place-and-route, timing analysis, and configuration generation.
Typical applications include industrial motor control, video processing pipelines, software-defined radio baseband, prototyping ASIC designs, embedded control systems, and high-density glue logic. The combination of 50K LEs, 450 I/Os, and BGA packaging makes this part especially attractive for space-constrained boards that require maximum logic density and signal count.
When designing with this part, allocate at least four PCB layers for power, ground, and signal routing, and follow Altera's decoupling and BGA breakout guidelines to maintain signal integrity on high-speed LVDS pairs.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in alternative MPNs across Intel/Altera Cyclone families, and practical design notes not found in the standalone manufacturer datasheet PDF.
드롭인 대체품: EP2C50F672C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2C50F672C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2C50F672C6N
✅ 드롭인✓ 재고 있음
$119 / 개
데이터시트 보기 →EP2C50F672C8N
✅ 드롭인✓ 재고 있음
$148.75 / 개
데이터시트 보기 →EP2C35F672C7N
✅ 드롭인✓ 재고 있음
$98 / 개
데이터시트 보기 →EP2C50F672C7
✅ 드롭인✓ 재고 있음
$184.59 / 개
데이터시트 보기 →EP2C35F672C8N
✅ 드롭인✓ 재고 있음
$77.14 / 개
데이터시트 보기 →EP2C35F672C6N
✅ 드롭인✓ 재고 있음
$122.5 / 개
데이터시트 보기 →EP2C50F672C7N 최대 정격 & 전기적 특성
| Family | Cyclone II |
| Logic Elements | 50,528 |
| Total RAM Bits | 594,432 |
| Embedded Memory | 594 Kbit (M4K blocks) |
| Number of I/O Pins | 450 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Maximum Internal Frequency | 402.58 MHz |
| 패키지 | 672-BGA (FBGA) |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 7 |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Programming Toolchain | Quartus II / Quartus Prime |
EP2C50F672C7N 672-bga (fbga) 핀 구성 가이드
EP2C50F672C7N(672-bga (fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2C50F672C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2C50F672C7N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Processing Pipeline, ASIC Prototyping Platform, Software Defined Radio Baseband, Embedded Control Systems, High-Density Glue Logic Replacement.
Industrial Motor Control
The EP2C50F672C7N fits industrial motor control applications because its 50,528 logic elements can host multiple PID control loops, encoder feedback handlers, and PWM generation blocks simultaneously. The 450 user I/Os in the 672-FBGA package support direct connection to multi-axis drive stages, optocoupler-isolated gate drivers, and incremental encoder inputs, eliminating external multiplexer ICs. The M4K memory blocks provide deterministic capture buffers for high-speed current sensing at typical PWM frequencies of 10-20 kHz. Industrial-grade Cyclone II variants (EP2C50F672I7N) are also available for harsher environments, but the commercial C-grade part is suitable for enclosed cabinet installations.
추천
Video Processing Pipeline
The EP2C50F672C7N supports video processing pipelines with native LVDS I/O for direct camera or display interfacing, eliminating external serializer/deserializer ICs. The 50K logic elements accommodate real-time image processing functions like color space conversion, edge detection, and histogram equalization at common resolutions up to 720p at 60 fps. The 594,432 bits of M4K RAM provide line buffers and frame buffers sufficient for several scan lines of video at typical pixel widths. Designers pair this part with external DDR memory for full frame buffering using the FPGA's soft memory controller, leveraging the high I/O count for wide memory bus connections.
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ASIC Prototyping Platform
The EP2C50F672C7N serves as an ideal ASIC prototyping platform because the Quartus II toolchain provides direct migration paths from FPGA prototype to ASIC tape-out. With 50,528 logic elements, the EP2C50 can host medium-complexity ASIC designs including control logic, glue logic, and moderate DSP blocks at near-real-time operating speeds. The 450 user I/Os expose every ASIC pin through the 672-FBGA package, enabling prototype verification of pin-by-pin ASIC behavior. The mature 90 nm silicon provides well-characterized timing closure and predictable performance for ASIC customer demonstrations.
추천
Software Defined Radio Baseband
The EP2C50F672C7N handles software defined radio baseband processing where its 18x18 hardware multipliers support real-time channel filtering, modulation, and demodulation algorithms. With a typical utilization of 30-50% of available LEs, designers can implement complete PHY-layer processing for narrowband protocols like LoRa, Sigfox, or proprietary ISM-band schemes operating below 500 MHz. The high I/O count enables direct connection to RF front-end ICs, ADCs, and DACs without external buffering. M4K memory blocks provide sample-rate buffering for symbol synchronization loops.
추천
Embedded Control Systems
The EP2C50F672C7N enables embedded control systems with custom soft-core CPUs (Nios II/e or Nios II/f) plus dedicated peripherals, all within a single FPGA. The 50K LEs can host a Nios II/f processor with cache, interrupt controller, timer blocks, and custom instruction accelerators - replacing discrete microcontroller plus glue logic in space-constrained designs. The 594 Kbit embedded RAM provides deterministic scratchpad memory for real-time control loops. With 450 user I/Os, the EP2C50 supports multi-bus architectures like SPI, I2C, UART, and CAN simultaneously without external bridging.
추천
High-Density Glue Logic Replacement
The EP2C50F672C7N replaces multiple discrete logic ICs (CPLDs, bus transceivers, AND/OR gates, FIFOs) by integrating all functions into a single programmable device. With 450 user I/Os, the EP2C50 can replace entire discrete logic sections containing 20-30 separate ICs, simplifying PCB layout, reducing BOM cost, and improving reliability by eliminating chip-to-chip interconnect. Designers often migrate existing discrete-logic designs to the Cyclone II family to handle end-of-life notifications on legacy logic families. The Quartus toolchain provides direct conversion paths from schematic-based designs to HDL.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2C50F672C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2C50F672C6N | EP2C50F672C8N | EP2C35F672C7N | EP2C50F672C7 | EP2C35F672C8N |
|---|---|---|---|---|---|---|
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 50,528 | 50,528 (same) | 50,528 (same) | 33,216 (-34%) | 50,528 (same) | 33,216 (-34%) |
| Total RAM Bits | 594,432 | 594,432 (same) | 594,432 (same) | 483,840 (-19%) | 594,432 (same) | 483,840 (-19%) |
| User I/Os | 450 | 450 (same) | 450 (same) | 450 (same) | 450 (same) | 450 (same) |
| Speed Grade | 7 | 6 (slower) | 8 (faster) | 7 (same) | 7 (same) | 8 (faster) |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
주요 차별점
- Maximum logic density in Cyclone II family with 450 user I/Os (vs EP2C35F672C7N)
- Speed grade 7 offers balanced timing closure (vs EP2C50F672C8N)
- Same die as EP2C50 family variants - design portability (vs EP2C20F256C8N)
- Highest I/O count available for Cyclone II (vs EP2C50F484I8N)
설계 노트
The EP2C50F672C7N requires at least three power rails: VCCINT (1.2 V core), VCCIO (3.3 V, 2.5 V, 1.8 V, or 1.5 V per bank), and VCCA_PLL (2.5 V for PLL analog supply). Estimated: at typical utilization with VCCINT drawing 300 mA, the core power is approximately 0.36 W, plus VCCIO power which scales with toggle rate. Place 0.1 uF decoupling capacitors within 100 mils of every VCCINT/VCCIO pin pair and bulk capacitors (10-22 uF) at each supply plane transition. A ferrite bead isolating the PLL supply is recommended per the Cyclone II handbook pin connection guidelines.
The 672-FBGA package requires at minimum a 4-layer PCB with microvia or via-in-pad technology for clean signal breakout. Estimate: at 1.0 mm pitch, the BGA ball diameter is 0.5 mm requiring 0.6-0.8 mm via pads and 0.1 mm trace/spacing rules. Route all signals on outer layers with a continuous ground plane on layer 2 for return path integrity. Multiple GND balls in the center of the BGA should be stitched directly to the inner ground plane with thermal vias. The Cyclone II hardware reference designs from Intel provide exact stackup recommendations.
LVDS pairs on the EP2C50F672C7N require matched-length routing - the differential pair length mismatch should not exceed 150 mils according to the Cyclone II device handbook. Each LVDS pair must stay within the same I/O bank, with both signals on the same layer and no more than two vias per signal. Series termination resistors (100 ohm differential) are required near the transmitter for proper LVDS swing. For high-speed LVDS at 840 Mbps, use 50 ohm controlled-impedance stripline or microstrip routing with reference planes intact beneath the trace path.
Do not leave JTAG pins (TCK, TMS, TDI, TDO) floating - they require external 10 kohm pull-up resistors on TMS and TDI per the Cyclone II handbook. Configuration mode pins MSEL[2:0] must be tied to specific logic levels for the desired configuration mode (AS, PS, JTAG) - floating MSEL pins cause configuration failure. Do not confuse VCCIO bank voltages - each I/O bank can support a different VCCIO voltage, but mixing 3.3 V and 1.5 V signaling in the same bank without proper level shifting damages the I/O cells.
Estimated: the 672-FBGA package thermal resistance (theta JA) is approximately 12 C/W with proper PCB layout. At a typical mid-utilization design consuming 2 W total power, junction temperature rise is 24 C above ambient. The commercial C-grade part is rated to 0 to +85 C junction temperature, leaving significant thermal margin. For full-utilization designs approaching 5 W, forced airflow at 200 LFM is recommended. The center GND balls act as the primary thermal path - sufficient ground-plane stitching prevents thermal runaway.
규정 준수 정보
RoHS compliant per distributor listing. Not AEC-Q100 qualified - this is a commercial-grade FPGA. Industrial temperature grade variant EP2C50F672I7N is available for harsh-environment applications but is not AEC-Q100 qualified either.
