10M40DCF672C7G - MAX 10 FPGA 40K LE 672-BGA | Intel
부품 번호: 10M40DCF672C7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $119.39 | $119.39 |
| 10 | $113.42 | $1,134.20 |
| 100 | $101.48 | $10,148.00 |
| 500 | $89.54 | $44,770.00 |
| 1,000 | $83.57 | $83,570.00 |
10M40DCF672C7G 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy: programmable logic -> logic device -> integrated circuit -> semiconductor. The MAX 10 family is Intel's (formerly Altera) non-volatile FPGA line that combines LUT-based logic with on-chip flash configuration memory, eliminating the need for external boot PROMs and delivering instant-on behavior at power-up.
Key features of the 10M40DCF672C7G include 40K logic elements, 250 (18x18) hardware multipliers, 1,290 Kbits embedded SRAM, 4 Kbits user flash memory, and up to 500 user I/O pins. The device operates from a 1.2 V core supply with multi-voltage I/O banks supporting LVCMOS, LVDS, SSTL, and other single-ended and differential standards. An integrated 12-bit ADC with up to 17 channels is available for system-monitoring functions.
The MAX 10 architecture pairs a look-up-table (LUT)-based logic fabric with embedded hard IP such as PLLs, memory controllers, and DSP blocks. The 672-ball FBGA package provides the high pin count required for 500 user I/Os and full bank access for DDR3/LPDDR2 external memory interfaces. Built on a 55 nm embedded-flash process, the 10M40 instant-on architecture removes external boot memory while retaining in-field reprogrammability via JTAG.
Typical applications include industrial motor control and factory automation, video bridging and image processing pipelines, automotive driver-assistance modules, I/O expansion and bridging for processors, low-volume ASIC prototyping, and portable instrumentation requiring non-volatile single-chip logic. The integrated ADC and PLL resources are particularly valuable for closed-loop control designs that need deterministic analog monitoring alongside digital logic.
When designing with the 10M40DCF672C7G, ensure all VCCIO bank supplies match the I/O standard of connected devices, and provide adequate decoupling per the Quartus Prime power-tree guidelines. Note that the C7 speed grade (commercial, -7) targets commercial-temperature designs; for industrial or automotive temperature ranges, select the I7 or A7 speed-grade variants from the same family.
드롭인 대체품: 10M40DCF672C7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M40DCF672C7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Process Technology, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M40DCF672I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$72.65 / 개
데이터시트 보기 →10M40DAF672C7G
✅ 드롭인✓ 재고 있음
$67.2 / 개
데이터시트 보기 →10M40DAF672C8G
✅ 드롭인✓ 재고 있음
$86.1 / 개
데이터시트 보기 →10M40DAF672I7G
✅ 드롭인✓ 재고 있음
$65.85 / 개
데이터시트 보기 →10M40DCF484C7G
✅ 드롭인✓ 재고 있음
$124.2 / 개
데이터시트 보기 →10M40DCF672C7G 최대 정격 & 전기적 특성
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements | 40,000 |
| Embedded Memory (Bits) | 1,290,240 |
| User Flash (Bits) | 4,096 |
| Maximum User I/O | 500 |
| 18x18 Hardware Multipliers | 250 |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| 패키지 | 672-BGA (FBGA) |
| 실장 유형 | Surface Mount |
| Speed Grade | C7 (commercial, -7) |
| 동작 온도 | 0C to +85C (commercial) |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
10M40DCF672C7G 672-bga (fbga) 핀 구성 가이드
10M40DCF672C7G(672-bga (fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M40DCF672C7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M40DCF672C7G 적합 용도: 6 애플리케이션s: Industrial Motor Control and Factory Automation, Video Bridging and Image Processing, I/O Expansion and Processor Bridging, Low-Volume ASIC Prototyping, Portable Test and Measurement Instrumentation, Automotive Driver-Assistance Modules (ADAS).
Industrial Motor Control and Factory Automation
The 10M40DCF672C7G's 40,000 logic elements and 250 hardware 18x18 multipliers make it well-suited for industrial motor control and factory automation. The integrated 12-bit ADC with up to 17 analog input channels allows closed-loop current sensing and voltage monitoring directly inside the FPGA, eliminating external ADC components. The 500 user I/Os in the 672-BGA package provide enough headroom for multi-axis stepper/servo interfaces, encoder feedback (QEI/Halls), and EtherCAT or PROFINET link-layer glue. Compared with discrete MCU plus CPLD designs, the MAX 10 consolidates boot, control, and I/O expansion into one non-volatile instant-on device, reducing BOM cost and PCB area by an estimated 30%.
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Video Bridging and Image Processing
For video bridging and image-processing pipelines, the 10M40DCF672C7G delivers 40K LE plus 1,290 Kbits of embedded SRAM, enough for parallel pixel processing, color-space conversion, and frame-rate conversion at 1080p60. The 250 dedicated 18x18 multipliers accelerate FIR filters and deinterlacing kernels without consuming general-purpose logic. The 672-BGA package supports DDR3/LPDDR2 external memory interfaces, which are critical for line buffers in scaling engines. Designers building multi-display aggregation or HDMI-to-MIPI bridges frequently choose the MAX 10 family over Cyclone 10 LP because of its on-chip flash, which simplifies board layout and eliminates an external boot memory footprint.
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I/O Expansion and Processor Bridging
The 10M40DCF672C7G is widely used as a glue-logic and I/O-expansion companion to application processors. The 500 available user I/Os allow the FPGA to expose UART, SPI, I2C, GPIO, and PWM to a host CPU while performing format translation or real-time response. With multi-voltage I/O banks, the MAX 10 can interface 1.8 V host buses and 3.3 V peripheral buses simultaneously, eliminating level shifters. The on-chip dual-configuration flash enables secure field updates and lets designers A/B between two firmware images for fail-safe OTA deployment. Compared to CPLD alternatives, the 10M40DCF672C7G offers 4-6x more logic and embedded memory at similar unit cost.
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Low-Volume ASIC Prototyping
Engineers use the 10M40DCF672C7G as a low-volume ASIC or ASSP prototype when mask costs for a sub-100 nm ASIC run cannot be justified. The 40K LE density covers mid-complexity state machines, bus interfaces, and custom peripherals. The MAX 10's instant-on behavior also lets designers validate boot ROM code before tape-out. With the 672-BGA package supporting JTAG, AS, and PS configuration modes, the same board design can transition between MAX 10 silicon and a downstream structured-ASIC or ASIC implementation, shortening the validation loop by several months.
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Portable Test and Measurement Instrumentation
For portable test and measurement instruments, the 10M40DCF672C7G delivers 40K LE plus dedicated DSP blocks in a package that supports 500 mixed-voltage I/Os for sensor front-ends. The integrated 12-bit ADC simplifies temperature, current, and voltage telemetry without external analog components. The non-volatile configuration means the instrument is ready within microseconds of power-up, an important requirement for handheld oscilloscopes and data loggers. Compared with discrete MCU plus external ADC architectures, the MAX 10 cuts PCB area by approximately 25% and reduces standby-mode power by skipping boot-loader initialization.
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Automotive Driver-Assistance Modules (ADAS)
Within ADAS sensor-fusion modules, the 10M40DCF672C7G serves as a flexible pre-processor for camera, radar, or LiDAR data, offloading time-critical logic from the main SoC. The 40K LE plus 250 multipliers handle simple object-detection kernels and CAN/LIN gateway functions. Designers select the A7 (automotive) speed-grade variant, e.g. 10M40DAF672A7G, for -40C to +125C operation; the C7 part evaluated here is suitable for cabin or laboratory ADAS prototyping. Compared with ASIC-based ADAS pre-processors, the MAX 10 supports in-field firmware updates via JTAG, enabling late-stage feature rollouts.
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추천 제품 요약
엔지니어링 참조 데이터: 10M40DCF672C7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M40DCF672I7G | 10M40DAF672C7G | 10M40DAF672C8G | 10M40DCF484C7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA (FBGA) | 672-BGA (FBGA) - same | 672-BGA (FBGA) - same | 672-BGA (FBGA) - same | 484-BGA (FBGA) - different package |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 |
| Maximum User I/O | 500 | 500 | 500 | 500 | 360 |
| Embedded Memory (Kbits) | 1,290 | 1,290 | 1,290 | 1,290 | 1,290 |
| 18x18 Multipliers | 250 | 250 | 250 | 250 | 250 |
| Speed Grade | C7 (commercial) | I7 (industrial) | C7 (commercial) | C8 (commercial) | C7 (commercial) |
| Operating Temperature | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| On-chip Configuration Flash | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) |
주요 차별점
- On-chip dual-configuration flash eliminates external boot PROM (vs 10CL040YF484C8G (Cyclone 10 LP, 40K LE))
- Highest user I/O count in MAX 10 family at 672-BGA (vs 10M40DCF484C7G (40K LE, 484-BGA))
- Integrated 12-bit ADC with up to 17 analog channels (vs 10M16DAF484A7G (16K LE))
설계 노트
MAX 10 FPGAs require multiple supply rails: 1.2 V core (VCC), 1.2 V/1.5 V/1.8 V/2.5 V/3.0 V/3.3 V VCCIO for I/O banks, VCCA (analog supply for ADC/PLL), and VCCPD (configuration I/O). Use a sequencer or simple RC network to enforce VCC before VCCIO/VCCPD ramp-up; reverse sequencing can latch up I/O cells. Decouple each VCC pin with 0.1 uF and bulk-decouple each bank with 10-22 uF ceramic per the MAX 10 device datasheet pin connection guidelines.
Estimated: at full 40K LE utilization with 500 I/O toggling at 100 MHz and 1.2 V core, the 10M40DCF672C7G typically dissipates 1.0-1.8 W. The 672-BGA's theta_JA is approximately 15-20 C/W on a standard 4-layer JEDEC test board, giving a 15-35 C junction rise above ambient. Ensure the PCB thermal relief pad array is soldered to the inner ground plane and that adequate airflow is provided for >2 W dissipation.
The 672-BGA package uses a 1.0 mm ball pitch with full-array layout. Use via-in-pad (VIPPO) or microvia technology with 0.4 mm finished via diameter for breakout; dog-bone fanout is possible but consumes 4 routing layers for the inner rows. Match the BGA land pattern exactly to Intel's package specification - non-solder-mask-defined (NSMD) pads improve joint reliability over SMD pads. Reference the MAX 10 hardware design guidelines document for stack-up recommendations.
Do not confuse the C7 speed grade (commercial, -7) with the I7 (industrial, -7) - both share -7 timing but differ only in temperature range. Always check the order code prefix: DCF denotes commercial, DAF denotes analog-feature variants in the same family. The MAX 10 device overview datasheet contains the full ordering-code decoder; verify with the latest revision before committing to a BOM.
규정 준수 정보
RoHS and REACH compliant per Intel product declaration. Standard C7 commercial variant is NOT AEC-Q100 qualified; select A7 (automotive) speed-grade variant for -40C to +125C automotive applications.
