EP2C8F256CX1VAA - Cyclone II FPGA, 8K LEs, 256-FBGA | Altera
부품 번호: EP2C8F256CX1VAA ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.9 | $6,490.00 |
| 250 | $60.4 | $15,100.00 |
| 500 | $56.8 | $28,400.00 |
EP2C8F256CX1VAA 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader programmable logic device (PLD) hierarchy, sitting alongside CPLDs and structured ASICs. They differ from microcontrollers (which execute sequential firmware) by implementing logic in hardware, parallel by construction, and differ from ASICs by being reconfigurable after manufacture. Cyclone II sits in the low-cost end of the FPGA market, optimized for ASIC replacement and DSP co-processing rather than maximum density or highest clock rate.
Key features include up to 4 PLLs, 8 global clock networks, support for LVDS, LVTTL, PCI, SSTL, and other single-ended and differential I/O standards, and high-speed external memory interfaces including DDR/DDR2/QDRII SRAM. The device supports configuration via passive serial, active serial, and JTAG modes, with built-in decompression and decryption engines to accelerate bitstream transfer.
Typical applications include digital signal processing, video processing pipelines, industrial machine control, motor control, automotive infotainment subsystems, and protocol bridging between legacy and modern interfaces. Cyclone II devices are commonly paired with external DDR/DDR2 memory and TI power management ICs such as the TPS5430 for core and I/O rail generation.
When designing with this device, ensure proper power sequencing (VCCINT must precede VCCA/VCCIO), adequate thermal dissipation through the BGA thermal ball pattern, and pin-compatible migration paths if upgrading to Cyclone III or Cyclone IV. The EP2C8F256CX1VAA suffix indicates a 256-ball FBGA, industrial temperature grade, and lead-free / RoHS compliant packaging.
드롭인 대체품: EP2C8F256CX1VAA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2C8F256CX1VAA (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Speed Grade, Package, Process Technology, Embedded 18x18 Multipliers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2C8F256C8N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2C8F256C7N
✅ 드롭인✓ 재고 있음
$8.31 / 개
데이터시트 보기 →EP2C8F256C6N
✅ 드롭인✓ 재고 있음
$31.2 / 개
데이터시트 보기 →EP2C8AF256A7N
✅ 드롭인✓ 재고 있음
$41.5 / 개
데이터시트 보기 →EP2C8AF256I8N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EP2C5F256C8N
✅ 드롭인✓ 재고 있음
$11.84 / 개
데이터시트 보기 →EP4CE8F256C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4CE6F256C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2C8F256CX1VAA 최대 정격 & 전기적 특성
| Family | Cyclone II |
| Logic Elements | 8,256 |
| Total Memory Bits | 162,000 (36 M4K blocks) |
| Embedded Multipliers (18x18) | 18 |
| PLLs | 2 |
| Global Clock Networks | 8 |
| Maximum User I/O Pins | 182 |
| User I/O Banks | 8 |
| 패키지 | 256-ball FBGA (FineLine BGA) |
| Process Technology | 90 nm low-k CMOS |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V (typ 1.2 V) |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) |
| 동작 온도 범위 | -40C to +85C (industrial, VAA suffix) |
| RoHS 상태 | Compliant (lead-free) |
| Configuration Modes | Passive Serial, Active Serial, JTAG |
| Speed Grade | C8 |
EP2C8F256CX1VAA 핀 구성
| 핀 A1 | IO_A1 — User I/O bank 1 |
| 핀 A2 | VCCIO1 — I/O bank 1 supply |
| 핀 A3 | IO_B3 — User I/O bank 2 |
| 핀 B1 | GND — Ground |
| 핀 B2 | IO_A2 — User I/O bank 1 |
| 핀 C1 | VCCINT — Core voltage 1.2V |
| 핀 D1 | nCONFIG — Configuration pin |
| 핀 E1 | TCK — JTAG clock |
| 핀 F1 | TDI — JTAG data in |
| 핀 G1 | TDO — JTAG data out |
| 핀 H1 | TMS — JTAG mode select |
| 핀 K1 | VCCA — PLL analog 1.2V |
| 핀 L1 | GND — Ground |
일반적인 애플리케이션
EP2C8F256CX1VAA 적합 용도: 7 애플리케이션s: Industrial Motor Control, Video Processing Pipeline, Digital Signal Processing (DSP Co-Processor), Industrial Protocol Bridging, Automotive Infotainment Subsystem, PCI-based Add-in Card Logic, Test & Measurement Instrumentation.
Industrial Motor Control
The EP2C8F256CX1VAA's 8,256 logic elements and 18 embedded 18x18 multipliers make it well-suited for digital motor control loops, including field-oriented control (FOC) for three-phase AC induction and BLDC motors. With the industrial temperature grade (-40C to +85C), it operates reliably in factory floor environments with ambient temperature swings. The 182 user I/Os accept quadrature encoder inputs (QEP), PWM outputs to gate drivers, and SPI links to MCUs. The 2 PLLs generate precise switching frequencies up to the supported IO range. Pair with TI DRV8301 gate driver and UCC27211DPR for a complete motor drive; use TPS5430 for 1.2V core supply generation.
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Video Processing Pipeline
The EP2C8F256CX1VAA supports video formats up to HD (1080p60) with pipelined processing in its abundant 8,256 LEs and embedded multipliers for color space conversion, scaling, and deinterlacing. The 162 Kbit embedded RAM (M4K blocks) provides line buffers for scan-line processing, while the 2 PLLs generate pixel clocks and memory interface clocks. The 256-ball FBGA supports LVDS and LVTTL I/O standards required for digital video interfaces. For HDMI bridging or camera ISP prototyping, this device is a cost-effective platform. Pair with Micron MT48LC16M16A2 SDRAM for frame buffering and TFP410 HDMI transmitter for DVI output.
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Digital Signal Processing (DSP Co-Processor)
The 18 embedded 18x18 multipliers on the EP2C8F256CX1VAA enable efficient implementation of FIR filters, FFTs, and other DSP blocks at throughput up to 250 MHz in the C8 speed grade. This makes the device attractive as a co-processor to an MCU for audio processing, software-defined radio baseband, or vibration analysis. The M4K blocks provide coefficient and data storage, and the 2 PLLs can generate the necessary sample clocks. Industrial temperature grade supports factory vibration-monitoring and condition-based maintenance applications. Pair with TLV320AIC3104 audio codec for audio DSP and AD7606 16-bit ADC for data acquisition front-ends.
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Industrial Protocol Bridging
The 8,256 LEs and 182 user I/Os of the EP2C8F256CX1VAA make it ideal for protocol bridging between legacy industrial fieldbuses (RS-485, CAN, Modbus RTU) and modern Ethernet-based protocols (EtherCAT, PROFINET, EtherNet/IP). Hardware-based serial protocol implementation offloads an external MCU, while on-chip RAM buffers packets. Industrial temperature grade and robust FBGA package suit industrial enclosure mounting. Pair with TI ISO1050 isolated CAN transceiver for CAN bus isolation and MAX3485 for RS-485; use DP83848 Ethernet PHY for industrial Ethernet connectivity.
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Automotive Infotainment Subsystem
The EP2C8F256CX1VAA is used in cost-sensitive automotive infotainment subsystems where 8K LEs are sufficient for display controller, audio routing, and CAN gateway functions. The industrial temperature rating meets passenger compartment requirements, though under-hood AEC-Q100 applications should use the EP2C8AF256A7N automotive-qualified variant. The 256-ball FBGA accommodates LVDS displays and MOST bus connectivity. Pair with TDA7850 audio amplifier for speaker drive and TPS5420 for power rail conversion. Designers transitioning to AEC-Q100 must use the EP2C8AF256I8N drop-in automotive variant.
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PCI-based Add-in Card Logic
The EP2C8F256CX1VAA supports the 3.3V PCI I/O standard natively, allowing implementation of custom PCI add-in cards for industrial PCs, legacy I/O expansion, or data acquisition. The 2 PLLs provide 33 MHz and 66 MHz PCI clocks, and the 8K LEs implement target or master state machines, FIFOs, and DMA engines. With industrial temperature grade, it can be used in PXI/cPCI systems. Note that PCI support is 32-bit/33 MHz in Cyclone II; 64-bit or 66 MHz requires external bus switch logic. Pair with PCI9052 PCI bus controller and TLC2274 op-amps for analog signal conditioning.
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Test & Measurement Instrumentation
The EP2C8F256CX1VAA's 18x18 multipliers, 162 Kbits RAM, and high I/O count make it suitable for implementing custom logic analyzers, protocol analyzers, and arbitrary waveform generators. The 256-ball FBGA accommodates high-speed LVDS probes for digital signal capture, while on-chip PLLs synthesize arbitrary clock rates. Industrial temperature rating supports bench-top and field test equipment. Pair with ADS4222 dual-channel 12-bit ADC for signal capture, DAC5682Z for waveform synthesis, and SN65LVDS31 line driver for high-speed serial test ports.
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추천 제품 요약
엔지니어링 참조 데이터: EP2C8F256CX1VAA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2C8F256C8N | EP2C8F256C7N | EP2C8AF256A7N | EP4CE8F256C8N | EP2C5F256C8N |
|---|---|---|---|---|---|---|
| Package | 256-ball FBGA | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | Cyclone II | Cyclone II | Cyclone II | Cyclone II (automotive) | Cyclone IV | Cyclone II |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 4,608 |
| Embedded RAM (bits) | 162,000 | 162,000 | 162,000 | 162,000 | 180,000 | 119,000 |
| Embedded Multipliers (18x18) | 18 | 18 | 18 | 18 | 15 | 13 |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 |
| Maximum User I/O | 182 | 182 | 182 | 182 | 179 | 158 |
| Process / Core Voltage | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 60 nm / 1.2 V | 90 nm / 1.2 V |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (AEC-Q100) | Commercial (0C to +85C) | Commercial (0C to +85C) |
주요 차별점
- Industrial temperature grade in 256-ball FBGA (vs EP2C8F256C8N)
- Automotive-grade drop-in option exists in same package (vs EP2C8AF256A7N)
- Footprint-compatible modern successor available (vs EP4CE8F256C8N)
설계 노트
EP2C8F256CX1VAA requires three separate rails: VCCINT (1.2V core), VCCIO (1.2V to 3.3V per bank, up to 8 banks), and VCCA (1.2V PLL analog). Power sequencing per Cyclone II handbook requires VCCINT to reach 90% of nominal before VCCA and VCCIO to prevent latch-up. Use a TI TPS5430 (3A) or TPS5431 for VCCINT and TI TPS7A4533 or LM1117-1.2 for VCCA. Decoupling: 0.1uF + 10uF per rail as per Quartus II PowerPlay early-power-estimate recommendations.
The 256-ball FineLine BGA does not include a heat spreader; thermal management relies on PCB copper area under the central ball array. Estimated: with internal power of 0.5W and theta JA of 18 C/W on a 4-layer JEDEC board, junction temperature rises only 9C above ambient. At 1.5W internal power (e.g. 182 I/Os at 25 MHz switching), rise is 27C, requiring airflow or larger copper pour. Cyclone II Device Handbook provides PowerPlay for junction temperature estimation.
The 256-ball FBGA has a 1.0 mm ball pitch requiring HDI PCB fabrication with laser-drilled microvias. Use 4 or 6 layer stack-up with continuous ground plane beneath the device for signal integrity and controlled impedance for LVDS pairs (100 ohm differential). Route JTAG signals (TCK, TMS, TDI, TDO) as a bus with 4.7k pull-ups on TCK/TMS/TDI per Altera JTAG specification. Include AS configuration header with 10k pull-up on nSTATUS and nCONFIG.
Do not confuse EP2C8F256CX1VAA (256-ball FBGA) with EP2C8F256C8N (256-ball FBGA, commercial temp) - same footprint, different temperature rating. Verify the 'X1' suffix indicates RoHS lead-free. Check lot codes for counterfeit risk; obsolete parts often circulate through unauthorized brokers. Confirm Quartus II version supports Cyclone II: Quartus II 13.1 is the final version with Cyclone II support; Quartus Prime does NOT support Cyclone II.
규정 준수 정보
RoHS compliant per Altera Cyclone II product page; X1 suffix indicates lead-free. Industrial temperature grade but NOT AEC-Q100 - use EP2C8AF256A7N for automotive. Halogen-free status not explicitly documented in available data.
