EP2S130F1020C4 - Stratix II 132K LE FPGA 1.2V 1020-FBGA | Intel
부품 번호: EP2S130F1020C4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3778.5 | $3,778.50 |
| 10 | $3500 | $35,000.00 |
| 50 | $3250 | $162,500.00 |
| 100 | $3000 | $300,000.00 |
| 500 | $2800 | $1,400,000.00 |
EP2S130F1020C4 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks, embedded memory, DSP blocks, and programmable interconnect, all user-defined through a hardware description language and a vendor toolchain. Stratix II FPGAs sit within the Intel/Altera programmable-logic hierarchy as a high-performance mid-2000s generation, positioned below later Stratix III/IV/V families and above Cyclone II in cost/logic density.
Key specifications include 132,540 logic elements, embedded memory, embedded multipliers for DSP, dedicated clocking PLL resources, and high-speed transceiver interfaces typical of the Stratix II family. The 'C4' speed grade places the device in a moderate-performance operating corner, and the 'F1020' package code indicates the 1020-ball FC-FBGA footprint used across the Stratix II 130K LE family.
Typical applications include high-throughput digital signal processing, telecom baseband processing, networking line cards, ASIC prototyping, and high-speed serial protocol bridging. The 1020-ball BGA gives the board designer 742 usable I/O, supporting parallel LVDS, DDR memory interfaces, and multiple standard I/O voltages from the same die.
When designing with this device, pay close attention to power-rail sequencing because Stratix II requires 1.2 V core and 3.3 V/2.5 V/1.8 V auxiliary rails. The high I/O count mandates a 4-8 layer PCB stack-up with controlled-impedance routing. Decoupling must follow the Intel Stratix II reference design guide.
This page synthesizes distributor pricing, same-package Stratix II family alternatives, and design guidance beyond the manufacturer datasheet to support cross-referencing and lifecycle planning for the EP2S130F1020C4.
드롭인 대체품: EP2S130F1020C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S130F1020C4 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Speed Grade, Package, RoHS Status, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S130F1020C5N
✅ 드롭인✓ 재고 있음
$1320 / 개
데이터시트 보기 →EP2S130F1020C3
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2S130F1020C3N
✅ 드롭인✓ 재고 있음
$1095 / 개
데이터시트 보기 →EP2S130F1020C4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2850 / 개
데이터시트 보기 →EP2S130F1020I4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2S130F1020C5
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4100 / 개
데이터시트 보기 →EP2S130F1020C4 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements | 132,540 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| 패키지 | 1020-ball FC-FBGA |
| User I/O Count | 742 |
| Maximum Internal Frequency | 711.24 MHz |
| 실장 유형 | Surface Mount |
| 동작 온도 | Commercial (0C to +85C) - grade 'C' |
| Speed Grade | C4 |
| 메모리 유형 | Embedded SRAM blocks (Stratix II) |
| DSP Blocks | Embedded multipliers (Stratix II TriMatrix) |
| PLLs | Yes (Stratix II enhanced PLL + fast PLL) |
EP2S130F1020C4 1020-ball fc-fbga 핀 구성 가이드
EP2S130F1020C4(1020-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S130F1020C4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S130F1020C4 적합 용도: 6 애플리케이션s: High-Throughput DSP and Signal Processing, Telecom Baseband and Line-Card Processing, ASIC Prototyping and Verification, Networking and Packet Processing, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation.
High-Throughput DSP and Signal Processing
The EP2S130F1020C4 with 132,540 logic elements and embedded multiplier blocks is well suited to high-throughput DSP workloads such as multi-channel baseband processing, radar signal chains, and software-defined radio front-ends. The 1.2 V core and 90 nm architecture deliver hundreds of MHz of internal fabric performance, while the embedded TriMatrix memory provides distributed and block RAM for FFT scratchpads and sample buffers. Placed on a high-layer-count PCB with controlled-impedance differential routing, this FPGA can replace multiple DSP chips in a single device, reducing BOM cost and board area while meeting tight latency budgets for real-time signal processing applications.
추천
Telecom Baseband and Line-Card Processing
In telecom line cards, the EP2S130F1020C4 implements channel cards, framer/mapper functions, and protocol bridging between OTN, Ethernet, and SONET interfaces. Its 742 user I/O pins support multiple parallel LVDS lanes and external memory interfaces (DDR/DDR2), which are critical for high-bandwidth packet buffers and lookup tables. The 1.2 V core keeps dynamic power within budget for dense line-card deployments, while embedded transceivers in the F1020 package handle multi-gigabit serial links. Quoted price as of 2026-09-09 is around USD 3,778.50 per unit, reflecting legacy inventory status for telecom OEMs with long lifecycle support requirements.
추천
ASIC Prototyping and Verification
The 132K logic-element capacity and rich memory/DSP resources make the EP2S130F1020C4 a strong target for ASIC prototyping of multi-million-gate designs in the 90 nm era. Engineers map ASIC RTL into Quartus II, partition the design across multiple FPGAs if needed, and use the 742 user I/O as prototyping interconnect for chip-to-chip emulation. The 1020-ball FC-FBGA package supports high-speed LVDS prototyping connections between multiple FPGA boards in stackable prototyping cages. This application benefits from the mature Quartus II toolchain (free Web Edition supports this device fully) and from extensive Stratix II reference designs in the Intel/Altera legacy IP catalog.
추천
Networking and Packet Processing
The EP2S130F1020C4 is used in core and edge routers for traffic management, deep-packet inspection, and queue scheduling. With 132K LEs, embedded memory, and 742 I/O, the FPGA can implement multi-million-entry TCAMs alongside forwarding logic and cryptographic accelerators. The 1020-ball BGA enables multiple external memory channels (DDR2/QDR) for packet buffering at line rate. Power consumption at 1.2 V core scales with toggle rate, so designers use clock gating and aggressive design partitioning; legacy Stratix II designs in production networks benefit from long-term supply via authorized distributors stocking obsolete inventory.
추천
Industrial Imaging and Machine Vision
In high-speed machine vision systems, the EP2S130F1020C4 receives pixel data from multiple image sensors over LVDS, performs Bayer-to-RGB conversion, edge detection, and compression, and outputs results over Gigabit Ethernet or Camera Link. The 132K LE budget supports multi-pipeline processing at full sensor frame rates (hundreds of fps), and embedded multipliers accelerate filter kernels. Industrial users benefit from the commercial 0-85C operating range and from stable long-term supply via the secondary market for end-of-life parts. Combined with external DDR2 memory, the FPGA enables complete image-processing pipelines on a single chip.
추천
Test and Measurement Instrumentation
Test equipment manufacturers use the EP2S130F1020C4 to implement arbitrary waveform generators, real-time spectrum analyzers, and protocol analyzers where 742 user I/O and embedded DSP blocks provide the channel density and processing bandwidth required. The 1.2 V core enables dense DSP while the F1020 FC-FBGA package supports fine-pitch PCB assembly used in compact benchtop form factors. Designers often pair the device with high-speed ADCs/DACs via LVDS interfaces and use the TriMatrix memory as deep sample storage; the Quartus II toolchain offers mature IP cores for FFT, FIR, and DDS functions required in this application space.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S130F1020C4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S130F1020C5N | EP2S130F1020C3 | EP2S130F1020C3N | EP2S130F1020I4 | EP2S130F1020C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Speed Grade | C4 | C5N | C3 | C3N | I4 (industrial) | C5 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Commercial |
| User I/O | 742 | 742 | 742 | 742 | 742 | 742 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Largest Stratix II family logic density (vs EP2S130F1020C3N)
- C4 commercial temperature speed grade (vs EP2S130F1020I4)
- Mature Quartus II toolchain support (vs EP2C70F896C8N)
설계 노트
Estimated: At 100% toggle rate and 200 MHz core, the EP2S130F1020C4 can dissipate 10-15 W from the 1.2 V core rail. Designers must provision a buck regulator with at least 12 A capability on VCCINT and follow the Stratix II PowerPlay Early Power Estimator (EPE) spreadsheet before PCB layout. Power-rail sequencing requires VCCINT to ramp before VCCIO to avoid latch-up; reference the Stratix II handbook chapter 7 for the power tree reference design.
The 1020-ball FC-FBGA package with 1.0 mm ball pitch requires a 6-8 layer PCB stack-up with microvia (laser-drilled) technology to fan out from the BGA to inner signal layers. Use the Stratix II F1020 BGA breakout reference in the Altera pin connection guidelines to plan layer assignment. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS pairs; add stitching vias around the BGA perimeter to provide a robust ground-return path for high-speed signals.
Estimated: Confusing the Stratix II 90 nm FPGAs with the earlier Stratix 130 nm family is a common pitfall - they use different configuration schemes (Fast Passive Parallel for Stratix II), different JTAG IDCODEs, and different Quartus II version support windows. Also, the EP2S130F1020C4 is obsolete; do not use it for new designs unless you have validated long-term supply via franchised distributors. For new designs, target Cyclone V or Stratix V with the Quartus Prime toolchain.
규정 준수 정보
Stratix II family is older 90 nm technology. RoHS and lead-free status were not present in the Verified Web Data snippets - flagged as [DATA_NEEDED]. Part is obsolete; new compliance certifications are unlikely to be issued.