EP2S130F1508C5NRB - Stratix II FPGA 132K LE 1508-FBGA | Intel
부품 번호: EP2S130F1508C5NRB ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2410 | $241,000.00 |
| 500 | $2180 | $1,090,000.00 |
| 1,000 | $1990 | $1,990,000.00 |
EP2S130F1508C5NRB 개요
An FPGA (field-programmable gate array) is a semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured after manufacturing by loading a user bitstream. Within the digital-IC taxonomy, FPGAs sit beside ASICs, CPLDs, and microcontrollers as the principal class of user-programmable logic. Stratix II was Intel FPGA's (formerly Altera's) mid-2000s high-end family, positioned between the Cyclone low-cost family and the Stratix III successor, and was widely adopted for ASIC prototyping, DSP co-processing, and high-speed serial bridging.
Key features include 1,126 user I/O organized across multiple I/O banks with support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), 12 dedicated high-speed transceivers in selected package variants, and up to 96 DSP blocks (192 18x18 multipliers) for fixed- and floating-point arithmetic. The -C5 speed grade, together with the -NRB suffix, indicates the 1508-FBGA package, lead-free / RoHS-compliant termination finish, and Intel's tray packaging option.
Typical applications include high-speed DSP co-processors for wireless baseband, military/aerospace signal processing, ASIC prototyping and emulation platforms, and high-performance industrial imaging pipelines. Designers migrating from Stratix to Stratix II typically reuse Quartus II design flows and the same set of IP cores.
A critical design consideration is power-distribution network design: 1,126 I/O plus a 130K-LE core can exceed 20 W, so a multi-layer PCB with dedicated power/ground planes and bulk decoupling adjacent to every BGA quadrant is mandatory. Decoupling strategy must follow the Stratix II Hardware Reference guidance; sub-optimal decoupling will produce brown-out resets under heavy I/O switching.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Stratix II design notes that are not present in any single manufacturer datasheet revision. Lifecycle status and lead-time references are accurate as of 2026-09-09.
드롭인 대체품: EP2S130F1508C5NRB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S130F1508C5NRB (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, RoHS Status, Mounting Type, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S130F1508C5N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S130F1508C5
✅ 드롭인✓ 재고 있음
$345 / 개
데이터시트 보기 →EP2S130F1508C4N
✅ 드롭인✓ 재고 있음
$4435.83 / 개
데이터시트 보기 →EP2S130F1508C4RB
✅ 드롭인✓ 재고 있음
$1245 / 개
데이터시트 보기 →EP2S130F1508C4
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2S130F1508C3N
✅ 드롭인✓ 재고 있음
$270 / 개
데이터시트 보기 →EP2S130F1508C5NRB 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements | 132,540 |
| Adaptive Logic Modules (ALMs) | 53,016 |
| Embedded Memory Bits | 6,747,000 (6.747 Mbit) |
| Embedded Memory Blocks (M512/M4K/M-RAM) | 530 / 4096 / 4 (typical Stratix II EP2S130 configuration) |
| DSP Blocks (18x18 multipliers) | 96 (192 multipliers) |
| PLLs | 4 enhanced + 8 fast |
| Maximum User I/O | 1,126 |
| 패키지 | 1508-ball FCBGA (fine-pitch BGA), 40x40 mm |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V (nominal) |
| Speed Grade | C5 (commercial, 5th tier - moderate performance) |
| 동작 온도 | 0C to +85C (commercial) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (lead-free finish per -NRB suffix) |
| Configuration Technology | SRAM-based, supports passive serial, fast passive parallel, active serial, JTAG |
EP2S130F1508C5NRB 1508-ball fcbga (fine-pitch bga), 40x40 mm 핀 구성 가이드
EP2S130F1508C5NRB(1508-ball fcbga (fine-pitch bga), 40x40 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S130F1508C5NRB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S130F1508C5NRB 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Wireless Baseband DSP Co-Processing, Military/Aerospace Signal Processing, High-Speed Serial Bridging and Protocol Conversion, High-Performance Industrial Imaging, Medical Imaging Accelerator.
ASIC Prototyping and Emulation
The EP2S130F1508C5NRB's 132,540 logic elements, 96 DSP blocks (192 18x18 multipliers), and 6.747 Mbit embedded memory make it well suited for ASIC prototyping where design RTL must be validated on real silicon before tapeout. In a typical multi-FPGA partition flow, the 1,126 user I/O of the 1508-FBGA package provides ample inter-chip connectivity for time-division multiplexed signal traces between FPGAs. The Stratix II fabric supports clock frequencies of 200-300 MHz post-place-and-route, sufficient for verifying microarchitectural correctness, bus protocols, and firmware/driver integration. Designers port Verilog/VHDL from the ASIC target via tools such as Synopsys Certify or Mentor Precision, with Quartus II 13.1 being the last officially supported IDE.
추천
Wireless Baseband DSP Co-Processing
The 192 18x18 multipliers distributed across 96 DSP blocks enable the EP2S130F1508C5NRB to perform high-throughput channel filtering, FFT, and turbo-decoding operations in wireless baseband designs. Typical LTE or WiMAX PHY implementations partition baseband across multiple Stratix II FPGAs with shared memory interfaces via the embedded M-RAM blocks (4 blocks total) running at 300+ MHz. The 1.2 V core supply keeps per-FPGA power around 15-20 W, manageable for telecom line-card thermal envelopes. The 1508-FBGA package's high I/O count supports multi-gigabit LVDS links to ADCs/DACs and CPRI/OBSAI framer ASICs.
추천
Military/Aerospace Signal Processing
Although EP2S130F1508C5NRB itself is a commercial-temperature (0C to +85C) part, the same 1508-FBGA ball pattern is shared with industrial- and military-grade Stratix II variants, enabling common PCB layout across temperature grades. Defense signal-processing applications - radar pulse compression, electronic-warfare receivers, satellite modem baseband - benefit from the EP2S130's high DSP density, embedded memory bandwidth, and abundant LVDS for multi-channel ADC interfaces. Customers needing MIL-PRF-38535 or -55C to +125C operation should order the EP2S130F1508I4N or military-screened variant instead, which remains pin-compatible on the same PCB footprint.
추천
High-Speed Serial Bridging and Protocol Conversion
The EP2S130F1508C5NRB supports multiple high-speed serial protocols through its I/O banks - LVDS up to 1 Gbps per pair, plus SERDES blocks in selected speed grades for PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. A common application is bridging legacy parallel buses (e.g. VME, PMC, legacy ASIC interfaces) to modern serial fabrics inside telecom switches or industrial controllers. The 1,126 user I/O allow simultaneous operation of multiple parallel bus interfaces plus 8-12 serial links, all operating concurrently without contention. Quartus II IP catalog provides pre-verified cores for PCIe Gen1, GbE MAC, and Aurora.
추천
High-Performance Industrial Imaging
Machine-vision and high-speed line-scan cameras leverage the EP2S130F1508C5NRB's 6.747 Mbit embedded memory (M512, M4K, and M-RAM blocks) to buffer multi-megapixel image frames before DMA transfer to host processors. The DSP blocks accelerate Bayer demosaicing, color correction, and pre-PCIe compression in real time. A typical 4K-line-scan camera using 16 Camera Link channels runs each channel at 85 MHz, fitting comfortably within the FPGA's 1,126 I/O budget with margin for GPIO and synchronization. The commercial C5 speed grade's 300 MHz fabric enables 4K@60 fps processing for printed-circuit-board inspection systems.
추천
Medical Imaging Accelerator
CT, MRI, and ultrasound pre-processing systems use the EP2S130F1508C5NRB to accelerate back-projection, beam-forming, and image reconstruction algorithms in real time. The 192 multipliers enable dense parallel convolution engines that, combined with the 6.747 Mbit embedded memory, support full image-frame buffering and intermediate-tile storage without external SRAM access stalls. The 1508-FBGA's high I/O count accommodates multiple LVDS links to front-end ADCs and DDR2 memory controllers, while Quartus II's medical-imaging reference designs accelerate development. Designers should follow IEC 60601-1 isolation and EMI guidelines at the system level.
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추천 제품 요약
엔지니어링 참조 데이터: EP2S130F1508C5NRB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S130F1508C5N | EP2S130F1508C5 | EP2S130F1508C4N | EP2S130F1508C4RB | EP2S130F1508C4 | EP2S130F1508C3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel (Altera legacy) | Intel | Intel | Intel | Intel |
| Package | 1508-ball FCBGA (40x40 mm) | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same |
| Speed Grade | C5 | C5 - identical | C5 - identical | C4 (~10-15% slower) | C4 (~10-15% slower) | C4 (~10-15% slower) | C3 (~20-25% slower) |
| Logic Elements | 132,540 | 132,540 - identical | 132,540 - identical | 132,540 - identical | 132,540 - identical | 132,540 - identical | 132,540 - identical |
| Embedded Memory | 6.747 Mbit | 6.747 Mbit - identical | 6.747 Mbit - identical | 6.747 Mbit - identical | 6.747 Mbit - identical | 6.747 Mbit - identical | 6.747 Mbit - identical |
| DSP Blocks | 96 (192 18x18 mult) | 96 - identical | 96 - identical | 96 - identical | 96 - identical | 96 - identical | 96 - identical |
| Maximum User I/O | 1,126 | 1,126 - identical | 1,126 - identical | 1,126 - identical | 1,126 - identical | 1,126 - identical | 1,126 - identical |
| Lead-Free / RoHS | Yes (NRB suffix) | Yes (N suffix) | No (legacy SnPb possible) | Yes (N suffix) | Yes (RB suffix) | No (legacy) | Yes (N suffix) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
주요 차별점
- Largest density in the Stratix II family (vs EP2S130F1508C4N)
- Lead-free / RoHS-compliant packaging code (-NRB) (vs EP2S130F1508C5)
- 1,126 user I/O supporting multiple simultaneous high-speed interfaces (vs EP2S130F1020C5 (same die, 1020-pin BGA))
설계 노트
Estimated: For a 1,508-ball FCBGA package at 40x40 mm body size with 1.0 mm pitch, a 12-layer PCB stack-up is mandatory for the 1508-FBGA, with at least 4 dedicated ground planes and 2 power planes to deliver up to 25 W to the core and I/O simultaneously. Use microvia (laser-drilled) stack-ups for inner-layer escape, and follow the Stratix II Hardware Reference pin connection guidelines for VCCINT/VCCPD decoupling ball groupings. Failing to provide sufficient decoupling in each BGA quadrant can result in brown-out resets during heavy I/O switching events. Solid power islands should be stitched with 0402 ceramic capacitors every 5 mm around the BGA perimeter and on inner planes.
Estimated: At typical 20 W device dissipation and a junction-to-ambient thermal resistance of approximately 8 C/W with adequate PCB copper, the EP2S130F1508C5NRB will see a 60C temperature rise above ambient, requiring either forced-air cooling (200 LFM minimum) or a heatsink attached via thermal interface material to the package lid. Without airflow, the junction temperature will exceed the 125C reliability limit in <2 minutes at full utilization. Designers should perform thermal simulation using the Stratix II PowerPlay Early Power Estimator (EPE) plus a CFD tool such as FloTHERM, and validate on prototype boards with thermocouples attached to the package top.
Three common Stratix II design mistakes are worth flagging: (1) Forgetting to set the MSEL[2:0] pins correctly - leaving them floating produces non-deterministic configuration at power-up. (2) Connecting the JTAG TCK pin to a clock source faster than 33 MHz violates the IEEE 1149.1 spec and can cause unreliable boundary-scan operation. (3) Using non-volatile CONFIG memory devices larger than EPCS16/EPCS64 without checking Quartus II compatibility - some newer EPCQ devices require a different programming flow that older Quartus II versions do not support. Designers should reference the Stratix II Device Handbook, Volume 2, Chapter 4 (Configuration) before PCB layout freeze.
The 1,126 user I/O distributed across multiple I/O banks means that LVDS pairs, SSTL memory interfaces, and LVCMOS GPIO can be routed simultaneously without contention if the bank voltages are configured correctly. Each bank has its own VCCIO rail - mixing 2.5 V and 3.3 V interfaces requires careful bank partitioning in the Quartus II pin planner before PCB layout. For DDR/DDR2 memory interfaces running at 200 MHz+ DDR, follow the DDR2 Controller MegaCore pin-out guidelines and route the byte-lane signals with matched-length constraints (typically +/- 25 mil within a byte group). Use IBIS simulation to validate SI margins at the prototype stage.
규정 준수 정보
RoHS compliance inferred from the -NRB suffix per Intel/Altera packaging nomenclature (lead-free finish). REACH, halogen-free, and conflict-minerals status were not stated in the verified web data. AEC-Q100 is not applicable - this is a commercial-grade FPGA, not an automotive-qualified IC. Last-time-buy notification per Altera/Intel PCN Mult Dev EOL 4/Dec/2020.
