EP2S130F1508C3N - Stratix II 132K LE FPGA 1508-FCBGA | Intel
부품 번호: EP2S130F1508C3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $350 | $3,500.00 |
| 25 | $325 | $8,125.00 |
| 100 | $295 | $29,500.00 |
| 500 | $270 | $135,000.00 |
EP2S130F1508C3N 개요
What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to configure digital logic blocks and interconnect them after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) → FPGAs → high-density FPGAs → ASIC prototyping platforms → semiconductor ICs. They are widely used for parallel processing, hardware acceleration, DSP, and interface bridging where fixed-function ASICs are too costly or inflexible.
Key features include 132,540 logic elements (LEs), 6,747,840 bits of on-chip RAM (M4K/M-RAM blocks), 252 embedded 18x18 multipliers for DSP, up to 12 high-speed transceivers (1.25 Gbps per channel, depending on variant), and a DDR/SDR/DDR2 memory interface support via dedicated PHY. The 1508-ball FCBGA package provides high pin density for I/O-rich designs and supports multi-gigabit signaling. The device also includes embedded PLL blocks (up to 12) for clock management and skew control.
The Stratix II EP2S130 architecture replaces the classic 4-input LUT with the 8-input ALM (Adaptive Logic Module), enabling wider combinational logic per slice and roughly doubling logic density per LAB versus the original Stratix family. Internal M-RAM blocks (512 Kbit each) provide bulk on-chip memory suitable for packet buffering and lookup tables, while the column-based DSP block layout simplifies floorplanning for DSP-heavy designs. The device operates from multiple on-chip voltage rails (core VCC, VCCL, VCCPD, VCCA) and requires a structured power-on sequencing scheme.
Typical applications include high-throughput data acquisition, ASIC prototyping, telecom baseband processing, high-end video broadcast, radar/signal-intelligence front-ends, and PCIe/serial RapidIO bridge cards. The dense logic and high I/O count make it well suited to multi-channel processing where multiple DSP data paths must be implemented in parallel on a single device. The C3 speed grade is the slowest commercial speed grade, which is usually adequate for ASIC prototyping and non-timing-critical logic consolidation.
When designing with the EP2S130F1508C3N, ensure all four supply rails are properly decoupled with low-ESR ceramics near each ball cluster, and respect the Stratix II power-on sequencing specification (VCCINT → VCCPD → VCCA → VCCIO). Designers migrating from first-generation Stratix (EP1S) should fully re-validate timing, as the ALM architecture and timing models differ. Quartus II (legacy) is the supported design tool chain.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical Stratix II design considerations beyond what is found in the datasheet alone.
드롭인 대체품: EP2S130F1508C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S130F1508C3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Mounting Type, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S130F1508C3
✅ 드롭인✓ 재고 있음
$1350 / 개
데이터시트 보기 →EP2S130F1508C5N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S130F1508C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2S130F1508I4N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S130F1508C3ES
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2S130F1508C3N 최대 정격 & 전기적 특성
| Family | Stratix II |
| Device | EP2S130 |
| Logic Elements (LEs) | 132,540 |
| LABs/CLBs | 6,627 |
| Total RAM Bits | 6,747,840 |
| Embedded Memory | M4K + M-RAM blocks |
| Number of I/O | 1,126 |
| Number of Logic Elements/Cells | 132,540 |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial) |
| 패키지 | 1508-FCBGA |
| Speed Grade | C3 |
| Process Node | 90 nm |
EP2S130F1508C3N 1508-fcbga 핀 구성 가이드
EP2S130F1508C3N(1508-fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S130F1508C3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S130F1508C3N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Throughput Data Acquisition, Telecom Baseband Signal Processing, High-End Video Broadcast Processing, Radar and Signal-Intelligence Front-End, Industrial Control and Machine Vision.
ASIC Prototyping and Emulation
The EP2S130F1508C3N's 132,540 logic elements and 6,747,840 bits of embedded memory (M4K + M-RAM blocks) make it a strong fit for ASIC prototyping and multi-block RTL emulation. Designers partition an ASIC's RTL into the FPGA's ALM-based fabric, using the device's high Logic Element (LE) count to absorb tens of millions of gates of pre-silicon verification. With 1,126 user I/Os, the EP2S130 can interface to real-world ASIC pads via speed-bridge daughter boards, supporting pre-silicon validation of complex SoC designs. Quartus II synthesis and incremental compilation shorten iteration cycles. Source: Stratix II handbook SII51002.
추천
High-Throughput Data Acquisition
For data-acquisition systems sampling multiple analog input channels simultaneously, the EP2S130F1508C3N provides 252 embedded 18x18 multipliers and 6,747,840 bits of on-chip RAM, enabling FIR filtering, FFT processing, and on-chip buffering without off-chip memory accesses. The 1,126 user I/Os allow parallel interface to multiple high-speed ADCs (LVDS/LVCMOS), and the dedicated PLL blocks (up to 12) provide low-jitter sampling clocks. Estimated throughput: a fully pipelined 256-tap FIR at 250 MHz is achievable within the EP2S130's DSP resource budget. Source: Stratix II DSP block reference.
추천
Telecom Baseband Signal Processing
Stratix II devices were widely adopted in WCDMA/HSPA/early LTE baseband cards. The EP2S130F1508C3N's 252 18x18 multipliers and 6.7 Mbit embedded RAM support multi-channel rake receivers, chip-rate processing, and turbo-decoder accelerators, while the high-I/O FCBGA package enables CPRI/OBSAI fronthaul interconnect. The 1.25 Gbps transceivers (where populated) handle serial RapidIO or Aurora links between FPGAs and DSP processors. The C3 speed grade is acceptable for baseband work, which is typically not the most timing-critical subsystem.
추천
High-End Video Broadcast Processing
Studio-grade video routers, multi-format format converters, and uncompressed 4:4:4 video processing pipelines benefit from the EP2S130F1508C3N's 1,126 I/Os (which can drive parallel BT.1120 / SDI / DisplayPort interfaces) and 6,747,840 bits of embedded RAM for line and frame buffers. The DSP blocks accelerate chroma upsampling, color-space conversion, and real-time scaling. Designers typically instantiate multiple SDI/HDMI receivers and route pixels through the FPGA fabric with deterministic low-latency paths. Estimated line-buffer size at 1080p60: 1920*4 = 7.5 Kbit per line - easily fitting in M4K blocks.
추천
Radar and Signal-Intelligence Front-End
The EP2S130F1508C3N's combination of high-density logic, 252 multipliers, and embedded M-RAM bulk memory is well-suited to radar pulse compression, beamforming pre-processing, and electronic-warfare channelization. The 1,126 user I/Os accept multi-channel LVDS A/D data streams (e.g., from a bank of 14-bit ADCs at 250 MSPS), while the embedded DSP blocks execute FFTs and matched filters in real time. Industrial-grade variant EP2S130F1508I4N is preferred for fielded radar/EW hardware. Source: Stratix II DSP and memory white papers.
추천
Industrial Control and Machine Vision
Machine-vision inspection systems and high-channel-count industrial controllers leverage the EP2S130F1508C3N for parallel image processing (Sobel, morphology, blob analysis) and deterministic I/O handling. The 1,126 I/Os accommodate multi-camera LVDS interfaces, encoder counters, and high-speed fieldbus (EtherCAT, PROFINET) MACs in soft logic. The 90 nm Stratix II process is robust for industrial environments, and the commercial 0C-to-85C range is sufficient for enclosed cabinet installations. Source: Altera industrial reference designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S130F1508C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S130F1508C3 | EP2S130F1508C5N | EP2S130F1508C7N | EP2S130F1508I4N | EP2S130F1508C3ES |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-FCBGA | 1508-FCBGA - same | 1508-FCBGA - same | 1508-FCBGA - same | 1508-FCBGA - same | 1508-FCBGA - same |
| Logic Elements | 132,540 LEs | 132,540 LEs | 132,540 LEs | 132,540 LEs | 132,540 LEs | 132,540 LEs |
| Embedded RAM | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits |
| User I/Os | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 |
| Speed Grade | C3 (commercial, slowest) | C3 | C5 (faster) | C7 | I4 (industrial) | C3 (engineering sample) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C |
| Terminal Finish | Lead-free (N suffix, RoHS) | SnPb (non-RoHS) | Lead-free | Lead-free | Lead-free | Lead-free (engineering sample) |
| Lifecycle | Obsolete (EOL) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (ES) |
주요 차별점
- Lead-free / RoHS terminal finish (vs EP2S130F1508C3)
- Commercial temperature range vs industrial (vs EP2S130F1508I4N)
- Slowest commercial speed grade - lower dynamic power (vs EP2S130F1508C5N)
- Highest-density Stratix II in 1508-ball FCBGA (vs EP2S90F1508C3N)
설계 노트
The EP2S130F1508C3N requires four independent supply rails: VCCINT (core, typically 1.2V), VCCPD (I/O pre-driver, 2.5V or 3.0V), VCCA (PLL analog, 2.5V), and VCCIO (bank I/O, 1.2V-3.3V depending on I/O standard). Altera specifies a strict power-on sequence: VCCINT first, then VCCPD, then VCCA, then VCCIO. Reverse sequencing or simultaneous ramp-up can permanently damage the device. Estimated: total core current at 100% toggle on 132K LEs is 1-2 A; pair a 4-layer PCB with low-ESR ceramic decoupling per Altera's pin connection guidelines.
Estimated: at full utilization (132K LEs, 252 DSP blocks, 6.7 Mbit RAM, ~50% toggle rate) the EP2S130F1508C3N can dissipate 8-12 W. The 1508-ball FCBGA package requires thermal vias under the central die region (per Altera AN 484). Without a thermal via array or heatsink, junction temperature can exceed 100C and trigger thermal-sensor-based throttling. Industrial variant EP2S130F1508I4N tolerates 100C junction vs 85C for the commercial part.
Stratix II 1508-ball FCBGA requires 1.0 mm or 1.27 mm ball pitch with controlled-impedance routing for high-speed I/O and transceiver channels. Pair 0.1 uF decoupling within 100 mil of each VCCIO/VCCPD ball, and use power planes (not traces) for VCCINT and GND. Route all differential pairs with matched length (within 50 mil) and 100 ohm differential impedance. Source: Altera AN 484 (Stratix II Hardware Design Guide).
Do not assume EP2S130F1508C3 and EP2S130F1508C3N are fully interchangeable without checking your application's RoHS requirement: the non-N variant uses SnPb finish and is non-RoHS. Do not confuse 'C3' speed grade with 'C8' or 'I8' - the digits encode both speed and temperature. The 1508-FCBGA ball map is package-specific; do not assume pin compatibility with other Stratix II packages (e.g. 1020-FBGA).
규정 준수 정보
N suffix denotes lead-free / RoHS-compliant terminal finish per Altera legacy product numbering. AEC-Q100 not applicable for FPGAs. REACH, halogen-free, and conflict-minerals status not stated in the verified datasheet excerpt; confirm via Intel product declaration request before automotive/medical use.
