EP2S30F672C5N - Stratix II FPGA 30K LE FBGA-672 | Intel
부품 번호: EP2S30F672C5N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $589.45 | $589.45 |
| 10 | $565 | $5,650.00 |
| 100 | $530 | $53,000.00 |
| 250 | $495 | $123,750.00 |
| 1,000 | $450 | $450,000.00 |
EP2S30F672C5N 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnect, and programmable I/O that allows engineers to implement custom digital circuits after manufacturing. Stratix II devices introduced the innovative Adaptive Logic Module (ALM) architecture, which provides finer-grained logic utilization than traditional 4-input LUT designs, achieving up to twice the logic density per area. This places Stratix II FPGAs in the broader hierarchy of programmable logic devices: PLD -> CPLD/FPGA -> high-performance FPGA with embedded transceivers and DSP blocks.
Key features of the EP2S30F672C5N include up to 16 global clock networks, dedicated multiplier blocks for high-speed DSP, TriMatrix embedded memory (M512, M4K, M-RAM blocks), and support for external memory interfaces including DDR, DDR2, SDRAM, QDRII, and RLDRAM II. The device also includes 4 phase-locked loops (PLLs) for clock management and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL.
The C5 speed grade designation indicates a specific timing closure for the -5 commercial speed grade, while the F672 package refers to a 672-ball FineLine BGA. The 'N' suffix indicates lead-free / RoHS-compliant lead finish. The Stratix II family provides a balanced combination of logic, memory, and DSP resources, making it suitable for high-throughput parallel processing tasks.
Typical applications include high-end DSP and image processing, ASIC prototyping and emulation, high-speed serial protocol bridging, telecommunications infrastructure, and military/aerospace signal processing. The wide I/O count and high memory bandwidth also make it suitable for test and measurement equipment where parallel data acquisition and real-time processing are required.
When designing with this device, pay close attention to power distribution and decoupling on the BGA package, as well as signal integrity for high-speed differential pairs. Designers should use the Quartus II development environment (legacy versions support Stratix II) for synthesis, place-and-route, and timing analysis. For new designs, consider newer Cyclone, Arria, or Stratix families as Stratix II is now a legacy device family.
드롭인 대체품: EP2S30F672C5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S30F672C5N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, Total RAM Bits, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S30F672C5
✅ 드롭인✓ 재고 있음
$155 / 개
데이터시트 보기 →EP2S30F672C4N
✅ 드롭인✓ 재고 있음
$121 / 개
데이터시트 보기 →EP2S30F672C3N
✅ 드롭인✓ 재고 있음
$55 / 개
데이터시트 보기 →EP2S30F672C4
✅ 드롭인✓ 재고 있음
$498.43 / 개
데이터시트 보기 →EP2S30F672C3
✅ 드롭인✓ 재고 있음
$780 / 개
데이터시트 보기 →EP2S30F672C5N 최대 정격 & 전기적 특성
| Series | Stratix II |
| Family Name | Stratix II |
| Logic Elements | 33,880 |
| Embedded Memory (bits) | 1,369,728 |
| Logic Array Blocks (LABs) | 1694 |
| User I/O Count | 500 |
| 패키지 | 672-ball FBGA (FineLine BGA) |
| Speed Grade | C5 (-5 commercial) |
| Process Technology | 90 nm CMOS |
| 동작 온도 범위 | Commercial (0C to +85C) |
| Number of PLLs | 4 |
| Global Clock Networks | 16 |
| Configuration Method | Serial / Passive Parallel / Fast Passive Parallel |
| Lead-Free / RoHS | Yes (N suffix) |
| Architecture | Adaptive Logic Module (ALM) |
EP2S30F672C5N 672-ball fbga (fineline bga) 핀 구성 가이드
EP2S30F672C5N(672-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S30F672C5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S30F672C5N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Performance DSP and Image Processing, Telecommunications Infrastructure, Test and Measurement Equipment, Military and Aerospace Signal Processing, High-Speed Memory Interfaces and Bridging.
ASIC Prototyping and Emulation
The EP2S30F672C5N is well-suited to ASIC prototyping due to its 33,880 logic elements, 1.37 Mbit of embedded TriMatrix memory, and 500 user I/O pins that allow multiple ASIC blocks to be emulated on a single device. The Adaptive Logic Module (ALM) architecture provides finer-grained logic utilization than traditional 4-input LUT FPGAs, achieving higher effective logic density for mapping RTL designs. Designers can partition an ASIC across one or more EP2S30 devices, using the 672-ball FBGA package to support the high pin count of typical ASICs. The Quartus II design flow supports multi-FPGA partitioning tools.
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High-Performance DSP and Image Processing
The EP2S30F672C5N's DSP blocks and embedded 18x18 multipliers enable high-throughput DSP applications such as image processing, video codecs, and baseband signal processing. The Stratix II device supports hundreds of GMACS (giga multiply-accumulates per second) of DSP performance, well-suited for FIR filters, FFTs, and matrix operations. The 672-ball FBGA package provides the I/O bandwidth required to feed the DSP engines at high data rates. Combined with external DDR/DDR2 memory controllers, the device can implement real-time video pipelines in surveillance and machine vision.
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Telecommunications Infrastructure
Telecommunications equipment uses the EP2S30F672C5N for high-speed packet processing, traffic management, and protocol bridging where its 33,880 logic elements and 1.37 Mbit embedded memory handle deep FIFOs and lookup tables. The Stratix II family supports LVDS, HSTL, and SSTL I/O standards required by telecom backplane interfaces, and the 4 PLLs allow multiple independent clock domains for TDM, packet, and system timing. NRND status makes it best for maintaining legacy telecom line cards rather than new platform designs.
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Test and Measurement Equipment
Test and measurement instruments use the EP2S30F672C5N for real-time waveform processing, pattern generation, and parallel data acquisition where its 500 user I/O pins can directly interface with high-speed ADCs and DACs. The 1.37 Mbit of embedded TriMatrix memory serves as deep capture buffers, and the 4 PLLs synthesize the multiple clock domains needed in mixed-signal test gear. The 672-ball FBGA also supports LVDS pairs for connecting to modern high-speed converters. Best for maintaining legacy test platforms.
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Military and Aerospace Signal Processing
Military and aerospace systems leverage the EP2S30F672C5N for radar signal processing, electronic warfare, and secure communications where its high logic density and radiation tolerance characteristics make it suitable for harsh environments. The -5 commercial speed grade is appropriate for ground-based and airborne platforms where industrial or military temperature grades are not required. Designers should verify lot acceptance testing and reliability screening requirements with the component vendor for mission-critical applications.
추천
High-Speed Memory Interfaces and Bridging
The EP2S30F672C5N supports external DDR, DDR2, SDRAM, QDRII, and RLDRAM II memory interfaces through dedicated DQS circuitry and the ALTDQ/DQS IP cores in Quartus II. The device can implement high-bandwidth memory bridges between incompatible protocols, such as PCI to local bus, or RapidIO to DDR2, common in legacy industrial and telecom equipment. With 16 global clock networks and 4 PLLs, it can manage multiple independent memory channels in parallel for data aggregation systems.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S30F672C5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S30F672C5 | EP2S30F672C4N | EP2S30F672C3N | EP2S30F672C4 | EP2S30F672C3 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-ball FBGA (FineLine BGA) | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Logic Elements | 33,880 | 33,880 - same | 33,880 - same | 33,880 - same | 33,880 - same | 33,880 - same |
| Embedded Memory (bits) | 1,369,728 | 1,369,728 - same | 1,369,728 - same | 1,369,728 - same | 1,369,728 - same | 1,369,728 - same |
| Speed Grade | C5 (-5 commercial) | C5 (-5) - same | C4 (-4) - slower ~15-20% | C3 (-3) - slowest ~30% | C4 (-4) - slower | C3 (-3) - slowest |
| Lead Finish | Lead-free (RoHS) | SnPb (non-RoHS) | Lead-free (RoHS) | Lead-free (RoHS) | SnPb (non-RoHS) | SnPb (non-RoHS) |
| User I/O Count | 500 | 500 - same | 500 - same | 500 - same | 500 - same | 500 - same |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Widely available lead-free RoHS variant (vs EP2S30F672C5 (SnPb))
- C5 speed grade - fastest Stratix II commercial tier (vs EP2S30F672C4N)
- EP2S30F672C3N exists as cost-optimized slower drop-in (vs EP2S30F672C3N)
- Stratix II mid-density tier with 1.37 Mbit embedded memory (vs EP2S15F672C5N)
설계 노트
The EP2S30F672C5N 672-ball FBGA package requires careful thermal management for high-utilization designs. Stratix II devices at full toggle rate can dissipate 5-10W depending on logic utilization and clock frequency. Use a multi-layer PCB with at least one full ground plane and thermal vias under the BGA to conduct heat from the die to the bottom-side copper pour. Without proper thermal design, junction temperature can exceed the commercial 85C limit. Estimated: at 8W dissipation with theta_JA of approximately 12 C/W (typical 672-BGA), junction rise above ambient is ~96C - active cooling or airflow may be required.
The EP2S30F672C5N supports LVDS I/O at data rates up to 1 Gbps and SSTL/HSTL for DDR/DDR2 memory interfaces. For high-speed differential pairs (LVDS), maintain 100 ohm differential impedance, match trace lengths within 10 mils, and place series-termination resistors close to the driver. For DDR memory interfaces, follow the Stratix II External Memory Interface Design Guidelines from the datasheet and use the ALTDQ/DQS IP core to constrain DQS-to-DQ skew. The Quartus II TimeQuest analyzer should be used for all high-speed timing closure.
BGA-672 packages require 0.8 mm or 1.0 mm pitch fan-out routing, typically using 4-6 layer PCB stackup with microvia (HDI) technology. Each BGA ball requires a non-solder-mask-defined (NSMD) pad to improve joint reliability. Escape routing must account for via-in-pad if thermal vias are placed under the die. Reference decouplers (0.1 uF, 0.01 uF, 2.2 nF) must be placed as close to the power balls as possible. Decoupling requirements are detailed in the Stratix II Hardware Design Guidelines chapter of the datasheet.
Do not use Quartus Prime (newer versions) for Stratix II designs - it does NOT support this family. Use Quartus II 13.0sp1 or earlier with ModelSim-Altera for simulation. Configuration mode selection (AS, PS, FPP, PPA) must match the EPCS or EPCQ flash device. JTAG chain ordering must include all devices in the chain before BSDL testing. NRND status means long-term availability is not guaranteed - always stock sufficient spares for production. The 'N' suffix is required for RoHS-compliant Pb-free assembly; non-N parts use SnPb lead finish.
Stratix II EP2S30 requires multiple supply rails: VCCINT (core, typically 1.2V), VCCIO (I/O banks, 1.5V/1.8V/2.5V/3.3V depending on standard), VCCPD (pre-driver, 3.3V), VCC_CLKIN (PLL analog, 1.2V), and VCCA_PLL (PLL analog, 2.5V). Use a multi-output power regulator or PMIC with proper sequencing - VCCINT must reach 1.0V before VCCIO. The PowerPlay Early Power Estimator (EPE) spreadsheet should be used during design to estimate worst-case power before layout finalization. Inrush current during configuration can exceed 2A - size the regulator accordingly.
규정 준수 정보
RoHS compliant per 'N' suffix in part number (lead-free lead finish). Not AEC-Q100 qualified - this is a commercial-grade FPGA. REACH compliance assumed per Intel product policy but not separately stated in retrieved data. Halogen-free status and conflict minerals declaration not found in provided web data.