EP1S20F672I5N - 18,460 Logic Elements Stratix FPGA, 672-FBGA | Intel
부품 번호: EP1S20F672I5N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $261.5 | $2,615.00 |
| 100 | $232.75 | $23,275.00 |
| 500 | $210.4 | $105,200.00 |
| 1,000 | $188.9 | $188,900.00 |
EP1S20F672I5N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined after manufacturing by a user-supplied configuration bitstream. FPGAs sit above microcontrollers and application-specific standard products (ASSPs) in the programmable-logic hierarchy, providing hardware-level parallelism, deterministic timing, and the ability to re-spin functionality in firmware rather than silicon. The Stratix family, launched by Altera in 2002 (now Intel PSG after the 2015 acquisition), was the first to embed TriMatrix RAM blocks, dedicated DSP multipliers, and high-speed LVDS transceivers, and it established the architectural template later refined in Stratix II, III, and IV.
Key features of the EP1S20F672I5N include 18,460 LEs, 1.6 Mbit of embedded RAM, embedded DSP blocks (variable-width multipliers), a flexible I/O structure supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards, and an internal clock network with PLL support. The 672-pin FBGA package uses a 1.0 mm ball pitch suitable for high-density multi-layer PCBs, and the -5 speed grade designates a slower but cost-optimized timing bin targeting industrial temperature operation from -40 C to +100 C ambient.
Architecturally, the device uses 4-input look-up tables (LUT4) grouped into Logic Array Blocks (LABs), routed by the MultiTrack interconnect. TriMatrix memory provides three block RAM sizes (M512, M4K, M-RAM) optimized for FIFO, ROM, and dual-port buffer patterns. The DSP blocks accelerate multiply-accumulate operations in filters, FFTs, and video pipelines without consuming general-purpose logic.
Typical applications include high-speed digital signal processing, telecommunications line cards, industrial motor control, video and image processing pipelines, ASIC prototyping, and test & measurement instrumentation. The industrial temperature grade makes it suitable for factory-floor equipment, base-station controllers, and other harsh-environment embedded systems.
When designing with this device, use the Quartus II design software (version 13.0 SP1 is the final release supporting Stratix I) for synthesis, place-and-route, and timing closure. Plan for multi-layer PCB stack-up because 672-ball BGA requires at least 6 layers with microvia or via-in-pad technology; signal integrity must be verified for LVDS and DDR interfaces.
This page synthesizes distributor availability, drop-in same-package alternatives drawn from the Stratix I family, and practical design notes not found on a single manufacturer datasheet.
드롭인 대체품: EP1S20F672I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S20F672I5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Family, PLLs.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S20F672C7N
✅ 드롭인✓ 재고 있음
$109.2 / 개
데이터시트 보기 →EP1S20F672C7
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1S20F672C6N
✅ 드롭인✓ 재고 있음
$68.9 / 개
데이터시트 보기 →EP1S20F672C6
✅ 드롭인✓ 재고 있음
$470 / 개
데이터시트 보기 →EP1S20F672I6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S20F672I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$198 / 개
데이터시트 보기 →EP1S20F672I5N 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 18,460 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Embedded Memory (TriMatrix) | 1,638,400 bits (1.6 Mbit) |
| Maximum Operating Frequency | 500 MHz (internal logic) |
| DSP Blocks | Yes (variable-width multipliers) |
| PLLs | Yes (on-chip) |
| 패키지 | 672-ball FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm |
| Speed Grade | -5 (industrial) |
| Operating Temperature (Industrial) | -40 C to +100 C ambient |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant (lead-free FBGA) |
EP1S20F672I5N 672-ball fbga (fineline bga) 핀 구성 가이드
EP1S20F672I5N(672-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S20F672I5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S20F672I5N 적합 용도: 6 애플리케이션s: Telecommunications Line Card Processing, ASIC Prototyping and Emulation, Industrial Motor Control and Drives, Video and Image Processing Pipelines, Test and Measurement Instrumentation, Aerospace and Defense Signal Processing.
Telecommunications Line Card Processing
The EP1S20F672I5N fits telecommunications line cards because it delivers 18,460 LEs of programmable logic with embedded TriMatrix memory and DSP blocks on a 130 nm process, all packaged in a 672-ball FBGA that supports multi-lane LVDS I/O for backplane interconnect. The DSP blocks accelerate FEC (forward error correction), echo cancellation, and channel equalization functions that previously required ASSP silicon. Designers map multi-channel processing onto parallel logic structures, achieving deterministic latency far below that of a CPU-based approach. At 500 MHz internal operation the device can sustain OC-48 (2.5 Gbps) aggregate throughput when LVDS pairs are aggregated.
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ASIC Prototyping and Emulation
The EP1S20F672I5N is widely used for ASIC prototyping because its 18,460 LEs combined with 1.6 Mbit of TriMatrix memory can host sub-blocks of larger ASIC designs mapped via synthesis. Quartus II supports rapid place-and-route iteration, and the FPGA can be linked through a Multi-FPGA partitioner to scale to multi-million-gate ASIC prototypes. Its industrial temperature rating lets the same prototype board move between development labs and field trials without re-qualifying thermal margins. The 672-ball FBGA exposes abundant user I/O, allowing designers to break out ASIC pins to external logic analyzers and oscilloscopes for real-time debug.
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Industrial Motor Control and Drives
The EP1S20F672I5N suits industrial motor control because its industrial temperature rating (-40 C to +100 C) survives factory-floor environments and the 18,460 LEs run encoder decoding, current-loop control, and space-vector PWM generation in parallel hardware. DSP blocks accelerate Park/Clark transforms and sensorless estimators, while the PLL-rich clock network synchronizes PWM to back-EMF sampling. The 672-ball FBGA exposes sufficient I/O to drive multiple power stages and feedback channels. Migration to newer Cyclone III/IV devices is recommended for new designs, but the Stratix I remains a long-life choice for installed equipment platforms.
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Video and Image Processing Pipelines
The EP1S20F672I5N is a strong fit for video processing pipelines because its DSP blocks accelerate FIR filters, color-space conversion, and discrete-cosine transform stages that form the core of video codec implementations. The 1.6 Mbit embedded memory acts as line buffers for HD resolution streams, and the 672-ball FBGA exposes LVDS pairs for camera sensor and display panel interconnects. Engineers implement ITU-R BT.656, BT.1120, or HDMI bridge logic in parallel fabric with deterministic timing. Industrial temperature rating allows the design to live in outdoor digital signage and surveillance enclosures.
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Test and Measurement Instrumentation
The EP1S20F672I5N is ideal for test and measurement instruments because the parallel fabric drives real-time waveform capture, trigger logic, and DSP-based signal analysis at speeds unattainable by microcontrollers. 18,460 LEs implement complex triggering state machines and on-the-fly FFT/Goertzel analysis, while TriMatrix memory stores sample buffers. The industrial temperature grade allows portable instruments to operate from -40 C in field work, and the FBGA package provides ample LVDS for parallel ADC/DAC interfaces. Replacement parts for legacy instruments are critical, and Stratix I remains in long-term supply via last-time-buy channels.
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Aerospace and Defense Signal Processing
The EP1S20F672I5N has historically served aerospace and defense applications where deterministic latency and high logic density in an industrial-temperature BGA are mandatory. The 18,460 LEs implement radar pulse compression, beamforming weights, and digital IF stages in parallel fabric, while TriMatrix memory acts as a fast scratchpad for FFT stages. Its 1.5 V core and proven 130 nm process technology have flown in numerous deployed systems over two decades. New programs should consider radiation-hardened Microsemi/PolarFire or newer Intel Stratix V/V10 parts, but legacy systems rely on Stratix I for the rest of their lifecycle.
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추천 제품 요약
엔지니어링 참조 데이터: EP1S20F672I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S20F672C7N | EP1S20F672C7 | EP1S20F672C6N | EP1S20F672C6 | EP1S20F672I6N | EP1S20F672I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA (FineLine BGA) | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 |
| Speed Grade | -5 | -7 (fastest) | -7 (fastest) | -6 | -6 | -6 | -7 (fastest industrial) |
| Operating Temperature | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded Memory | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
| Packaging Carrier | Tray (N suffix = tape & reel) | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel | Tape & Reel |
주요 차별점
- Industrial temperature rating at speed grade -5 (vs EP1S20F672C7N)
- Drop-in compatible with all 672-ball Stratix I variants (vs EP1S20F672C6)
- Slowest speed grade offers cost advantage in non-timing-critical designs (vs EP1S20F672I7N)
설계 노트
Estimated: at 100% LE utilization running at 300 MHz with toggling I/O, the EP1S20F672I5N dissipates roughly 2.5 W. The 672-ball FBGA's theta_JA is approximately 18 C/W with a 1-oz 4-layer JEDEC test board, so junction temperature rises about 45 C above ambient. Designers must keep ambient below +55 C to stay within the +100 C industrial ceiling, or attach a heatsink spreader through the central ball grid for high-thermal-load designs.
The 672-ball FBGA uses 1.0 mm pitch - plan a 6-layer stack-up with 0.5 oz copper on outer layers and 1 oz on inner planes. Use 0.2 mm laser-drilled microvias or via-in-pad technology with copper-filled plating because dog-bone fan-out exceeds escape routability for 0.15 mm trace/space rules. Provide continuous GND and PWR planes under the BGA to minimize inductance for the multi-rail decoupling network (VCCINT, VCCIO banks, VCC_PLL, VCC_CLK).
LVDS pairs and DDR interfaces require matched-length routing within 50 ps skew per byte group. Use 100-ohm differential impedance for LVDS with broadside-coupled stripline routing on inner layers; SSTL I/O for DDR requires 50-ohm single-ended impedance plus external VTT termination. Always reference the Stratix I device handbook Pin Connection Guidelines because some balls are reserved (no-connect) and others are power/ground depending on configuration scheme.
Do not confuse speed grade -5 with temperature grade I: I5 = industrial temperature, speed grade -5. The C7/C6 variants are commercial-temperature. Substituting I5N with C7N drops the operating temperature range from -40C/+100C to 0C/+85C, which may fail field deployments. Also confirm Quartus II version compatibility - versions older than 13.0 SP1 may not support the latest Stratix I errata fixes.
규정 준수 정보
RoHS compliant per FBGA lead-free termination; reach compliant per Intel product declarations; AEC-Q100 not applicable for industrial-grade FPGAs (this part is industrial, not automotive qualified).