EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
부품 번호: EP2SGX60CF780C3N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $355 | $35,500.00 |
| 500 | $318 | $159,000.00 |
| 1,000 | $285 | $285,000.00 |
EP2SGX60CF780C3N 개요
A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, high-speed transceivers, and a programmable interconnect fabric on a single die. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) and digital semiconductors, parallel to ASICs but offering post-fabrication reprogrammability. The Stratix II GX family specifically targets applications requiring both high-density logic and multi-gigabit serial transceivers, positioning it between general-purpose FPGAs and full ASICs in terms of integration and cost.
Key features include 60,440 logic elements, approximately 2.5 Mbit of embedded RAM (M4K/M-RAM blocks), dedicated 18-bit x 18-bit DSP blocks, 12 full-duplex transceiver channels at data rates up to 6.375 Gbps supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G, plus 8 clock PLL blocks with regional and global clock networks. The 780-ball FC-FBGA package exposes the full set of 364 user I/O pins alongside transceiver reference clocks and high-speed serial pins.
Architecturally, Stratix II GX uses an ALM-based logic element with adaptive look-up tables (LUTs) operating at 1.2 V core, with dedicated circuitry for source-synchronous memory interfaces (DDR/DDR2/QDR) and 8B/10B-encoded serial links. The 90 nm process and on-chip signal-integrity features (dynamic phase alignment, pre-emphasis, equalization) enable the transceiver channels to close links at gigabit rates on standard FR-4 backplanes.
Typical applications include high-speed serial interface bridging (PCI Express endpoints, XAUI-to-XAUI backplanes), telecom line cards (OC-48/STM-16 aggregation), military and aerospace signal processing, broadcast video routers with SDI/HD-SDI serial I/O, and ASIC prototyping where designers need verified 6 Gbps SerDes plus 60K logic elements.
When designing with EP2SGX60CF780C3N, pay close attention to transceiver reference-clock jitter and power-rail decoupling - the 1.2 V VCC, 2.5 V VCCAUX, and 3.3 V VCCPD planes each require bulk and ceramic bypass capacitors placed within 100 mils of their respective balls. Quartus II (legacy, version 9.0 and earlier) is the supported development environment.
This page synthesizes distributor stock, verified drop-in alternatives from the Stratix II GX family, and practical design considerations not found in a single distributor listing.
드롭인 대체품: EP2SGX60CF780C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX60CF780C3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Package Type, RoHS Status, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX60CF780C3
✅ 드롭인✓ 재고 있음
$870 / 개
데이터시트 보기 →EP2SGX60CF780C
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP2SGX90CF780C3N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2SGX30CF780C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2SGX60CF780C3N 최대 정격 & 전기적 특성
| Device Type | FPGA (Field Programmable Gate Array) |
| Series | Stratix II GX |
| Logic Elements | 60,440 |
| User I/O Pins | 364 |
| Embedded Memory (bits) | 2,544,192 |
| Number of CLBs | 60,440 |
| Internal Frequency (max) | 816.9 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Transceiver Channels | 12 (up to 6.375 Gbps) |
| Package Type | 780-ball FC-FBGA |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm pitch |
| RoHS 상태 | Lead-free / Compliant |
EP2SGX60CF780C3N 29 mm x 29 mm, 1.0 mm pitch 핀 구성 가이드
EP2SGX60CF780C3N(29 mm x 29 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX60CF780C3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX60CF780C3N 적합 용도: 6 애플리케이션s: PCI Express Gen2 Endpoint Card, Telecom Line Card Aggregation (OC-48/STM-16), Broadcast Video Router (SDI/HD-SDI), ASIC Prototyping Platform, Military/Aerospace Signal Processing, Test and Measurement Instrumentation.
PCI Express Gen2 Endpoint Card
The EP2SGX60CF780C3N is well-suited for PCIe Gen2 x4/x8 endpoint designs because its 12 transceiver channels operating at up to 6.375 Gbps comfortably exceed the 5.0 Gbps PCIe Gen2 line rate, with margin for 8B/10B encoding overhead. The 60,440 logic elements provide ample capacity for the PCIe hard IP core plus custom application logic such as DMA engines, protocol accelerators, or signal-processing pipelines. Placed on a PCIe add-in card with the standard 100 MHz PCIe reference clock fed into a dedicated PLL clock pin, the device achieves sub-microsecond latency for memory-mapped transfers. Designers should use Altera's free PCIe Compiler MegaCore and follow the Stratix II GX PCI Express x8 reference design for board layout.
추천
Telecom Line Card Aggregation (OC-48/STM-16)
In telecom line cards, the EP2SGX60CF780C3N aggregates multiple lower-speed backplane links (e.g., four SGMII 1.25 Gbps ports) into a single 5 Gbps uplink via its transceiver channels. The 2,544,192 bits of embedded memory (M4K and M-RAM blocks) buffer packet headers and payload segments, while the 60,440 logic elements implement packet classification, queuing, and traffic shaping. The Stratix II GX SERDES supports both SONET/SDH frame encapsulation and Ethernet MAC functions. A typical design places the device at the line-card edge with optical modules (SFP) driving the high-speed serial pins. Note that for OTU-2 (10 Gbps), the EP2SGX60CF780C3N's 6.375 Gbps ceiling is insufficient - migrate to Stratix IV GT.
추천
Broadcast Video Router (SDI/HD-SDI)
The EP2SGX60CF780C3N enables non-blocking broadcast video routers by multiplexing 8-12 SDI or HD-SDI serial streams. HD-SDI operates at 1.485 Gbps (well within the 6.375 Gbps transceiver range), and 3G-SDI at 2.97 Gbps remains supported. The device's 364 user I/O pins accommodate external video crosspoint switches and control-plane microcontrollers, while embedded memory holds line buffers and look-ahead metadata for seamless switching. The 90 nm process provides deterministic latency required for synchronized broadcast feeds. Power dissipation at full SERDES utilization is approximately 6-8 W, requiring modest airflow but no heatsink. Designers should isolate SERDES analog supplies from digital logic with ferrite beads per Altera reference design.
추천
ASIC Prototyping Platform
Engineers frequently adopt the EP2SGX60CF780C3N as a vehicle for ASIC prototyping because it offers 60,440 logic elements plus 12 transceivers that map cleanly to common ASIC interfaces such as DDR2/QDR memory controllers, SPI4.2, XAUI, and PCI Express. Quartus II provides incremental compile flows that allow rapid RTL iteration against gate-level netlists. The 780-FBGA package exposes enough I/O to break out ASIC pads to logic analyzers and memory daughter cards. For ASICs exceeding 1 M gates, partition across two or more EP2SGX60CF780C3N devices on a multi-FPGA emulation board. Migration path: when the ASIC tape-out is complete, the same RTL targets the foundry process with minimal change thanks to Quartus II synthesis optimizations.
추천
Military/Aerospace Signal Processing
The EP2SGX60CF780C3N serves military and aerospace applications requiring radiation-tolerant signal processing with 6 Gbps serial links, including radar front-end digitizers, electronic warfare (EW) subsystems, and secure communication modems. The 90 nm Stratix II GX process delivers deterministic latency for pulse-Doppler processing, while the embedded DSP blocks (18-bit x 18-bit multipliers) implement FFT/iFFT operations at full data rate. Industrial-grade screening (-40C to +100C) is available by ordering the part with the industrial temperature suffix. Designers targeting MIL-STD-810 should follow Altera's MIL-Handbook layout guidelines for vibration and thermal shock. For true space-grade rad-hard designs, consider Microsemi (now Microchip) RTG4 or Xilinx Virtex-5QV.
추천
Test and Measurement Instrumentation
High-end test and measurement instruments such as protocol analyzers, bit-error-rate testers (BERT), and logic analyzers leverage the EP2SGX60CF780C3N's 12 transceivers for multi-channel serial-data capture. Each 6.375 Gbps channel can monitor SFP+, SATA, or PCIe Gen2 traffic simultaneously with pattern-matching logic implemented in the 60K LEs. The 2.5 Mbit embedded memory buffers multi-million-event capture traces for post-processing. Front-panel buttons, LCDs, and USB links connect via the 364 user I/O pins, while JTAG provides field firmware updates. Production units benefit from Quartus II's incremental compile to isolate measurement-critical paths from UI overhead. For 10 Gbps test gear, migrate to Stratix V GT or Cyclone 10 GX.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX60CF780C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX60CF780C3 | EP2SGX60CF780C | EP2SGX90CF780C3N | EP2SGX30CF780C3N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FC-FBGA (29x29 mm, 1.0 mm pitch) | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 90,960 (+50%) | 30,940 (-49%) |
| Transceiver Channels | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) |
| Process / Core Voltage | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V |
| RoHS Compliance | Yes (lead-free) | No (leaded) | No (leaded) | Yes (lead-free) | Yes (lead-free) |
주요 차별점
- Same-package logic density step-up at 90K LEs (vs EP2SGX90CF780C3N)
- Lead-free RoHS-compliant package (vs EP2SGX60CF780C3 (non-N suffix))
- Cost-optimized same-package downsize at 30K LEs (vs EP2SGX30CF780C3N)
설계 노트
The Stratix II GX requires four separate power rails: VCCINT 1.2 V (core), VCCAUX 2.5 V (PLL/auxiliary), VCCPD 3.3 V (I/O pre-drivers), and VCCP 1.2 V (transceiver PLLs). Each rail must have a 1.0 uF ceramic bulk bypass plus 0.1 uF high-frequency decoupling within 100 mils of every supply pin. Place a ferrite bead between the analog VCCA and the digital VCC for transceiver-channel isolation. Sequence the rails such that VCCINT ramps before VCCAUX per Altera reference design to avoid latch-up at startup. Estimated: total worst-case power is approximately 10 W with all 12 transceivers active and 60K LEs at 60% utilization - plan for 12 W headroom in the power budget.
The 780-ball FC-FBGA requires a 1.0 mm pitch PCB footprint using 0.5 mm diameter solder mask-defined pads (Altera reference design). Use microvia (laser-drilled) stack-up for escape routing; via-in-pad is acceptable and recommended for inner rows. Maintain 50-ohm controlled impedance (100-ohm differential) on all transceiver TX/RX lanes, with intra-pair skew <2 ps and length-matching tolerance of 0.5 mm. Apply Symtek or similar high-density BGA assembly process - traditional 0.6 mm pitch processes are insufficient for 1.0 mm pitch BGA.
Estimated: a common design error is routing the 100 MHz PCIe reference clock to a general-purpose clock pin instead of the dedicated GCLK or transceiver REFCLK pin, which prevents the transceiver from locking. Another pitfall is omitting the MSEL pin pull-down/pull-up configuration resistors, leaving the configuration mode (AS, PS, JTAG) ambiguous and causing 'CONF_DONE low' failures during Quartus II programming. For multi-FPGA designs, ensure each device has its own JTAG chain order defined in the Quartus II programmer; otherwise, factory programming may fail silently. Always verify the JTAG IDCODE in the device programmer before assuming silicon health.
규정 준수 정보
Lead-free / RoHS compliant per the 'N' suffix in the Altera ordering code. AEC-Q100 is not applicable for FPGAs; for automotive-grade programmable logic, use Cyclone V or MAX 10. REACH compliance is per Intel/Altera product-level declarations.