10AS048H4F34E3SG - Arria 10 SX SoC FPGA, 480K LE, 1152-FBGA | Intel
부품 번호: 10AS048H4F34E3SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2720 | $27,200.00 |
| 100 | $2580 | $258,000.00 |
| 500 | $2410 | $1,205,000.00 |
| 1,000 | $2250 | $2,250,000.00 |
10AS048H4F34E3SG 개요
A System-on-Chip (SoC) FPGA is an integrated circuit that merges a general-purpose processor subsystem with programmable logic on the same silicon die, enabling software programmability and hardware parallelism to coexist with low-latency interconnects. Arria 10 SX belongs to Intel's mid-range programmable logic family, sitting between Cyclone (low-power/cost) and Stratix (high-performance), and is engineered for transceiver-rich, DSP-intensive applications such as wireless baseband, broadcast, medical imaging, and defense signal processing.
Key differentiating features include 480K logic elements, on-chip HPS peripherals (USB, Gigabit Ethernet, DDR controllers), transceivers supporting multi-gigabit serial links, and an integrated CoreSight debug infrastructure. The 1152-ball FC-FBGA package provides high I/O density for memory interfaces and multi-channel transceiver routing, while the 20 nm process balances static and dynamic power for fan-cooled deployments.
Architecturally, the device partitions into FPGA fabric (logic elements, MLABs, DSP blocks, M20K memory blocks, and 14.1 Gbps transceivers) and the HPS subsystem (dual ARM Cortex-A9, L1/L2 caches, hardware floating-point, NEON media engine, and a rich peripheral set). The FPGA-to-HPS bridges provide AXI-based coherent and non-coherent paths for tight CPU-加速器 coupling. Configuration is supported via JTAG, Active Serial, and fast passive parallel modes.
Typical applications include software-defined radio (SDR) platforms, radar and electronic-warfare preprocessing, medical imaging accelerators, broadcast video processing, and 5G fronthaul prototyping. For board-level integration, ensure a 0.9 V core supply with sufficient decoupling and a robust thermal solution given the FC-FBGA substrate's thermal resistance. Quartus Prime is the primary toolchain; the SoC EDS provides ARM Development Studio and a tailored Linux distribution for HPS bring-up.
This page synthesizes distributor pricing snapshots, drop-in same-package alternatives, and practical design notes drawn from the official datasheet — content not bundled on the OEM's product page alone.
드롭인 대체품: 10AS048H4F34E3SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS048H4F34E3SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Process Technology, Core Voltage, DSP Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS048H4F34E3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2295 / 개
데이터시트 보기 →10AS048H4F34I3SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2580 / 개
데이터시트 보기 →10AS048H3F34E3SG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS048H3F34I2SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3450 / 개
데이터시트 보기 →10AS032H4F34E3SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3490 / 개
데이터시트 보기 →10AS048H4F34E3SG 최대 정격 & 전기적 특성
| Product Type | System on Chip (SoC) FPGA |
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed | 1.5 GHz (max) |
| 패키지 | 1152-ball FC-FBGA (35 x 35 mm) |
| Core Voltage | 0.9 V |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| Supply Configuration | Tray |
| Toolchain | Intel Quartus Prime + SoC EDS |
| Market Segment | Embedded / Industrial / Defense / Medical |
10AS048H4F34E3SG 1152-ball fc-fbga (35 x 35 mm) 핀 구성 가이드
10AS048H4F34E3SG(1152-ball fc-fbga (35 x 35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS048H4F34E3SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS048H4F34E3SG 적합 용도: 6 애플리케이션s: Software-Defined Radio (SDR) Baseband, Medical Imaging Acceleration, Defense Radar and EW Preprocessing, Broadcast Video Processing, Industrial Machine Vision, 5G Fronthaul Prototyping.
Software-Defined Radio (SDR) Baseband
The 10AS048H4F34E3SG is well suited to SDR baseband platforms because its 480K logic elements and high-density variable-precision DSP blocks can implement multi-channel LTE/5G NR physical-layer processing at line rate. The integrated dual-core ARM Cortex-A9 HPS runs a real-time Linux stack for MAC scheduling, RF management, and network stack offload, while the FPGA fabric accelerates FFT, channel estimation, and turbo decoding. Transceivers capable of multi-gigabit serial link rates connect to RF ADCs/DACs and CPRI/eCPRI fronthaul. A typical design places the chip between the analog front-end and an Ethernet aggregator, achieving deterministic latency that pure-software DSP cannot match.
추천
Medical Imaging Acceleration
In CT, MRI, and ultrasound imaging systems, the 10AS048H4F34E3SG accelerates back-projection, beamforming, and image-reconstruction pipelines using its parallel DSP fabric, while the Cortex-A9 HPS handles patient I/O, display rendering, and DICOM networking. The 480K logic elements provide headroom for multi-channel beamforming in portable ultrasound, and the 1152-FBGA package allows dense PCB layouts inside compact cart-based systems. Medical-grade variants within the same family (where qualified) simplify regulatory documentation; designers should validate IEC 60601 compliance at the system level rather than relying on component-level ratings.
추천
Defense Radar and EW Preprocessing
Phased-array radar and electronic-warfare subsystems require deterministic, low-latency signal processing that the 10AS048H4F34E3SG delivers through parallel DSP pipelines and high-speed transceivers. Pulse compression, moving-target indication, and digital-beamforming fit comfortably in 480K logic elements, and the HPS subsystem coordinates mode control, track management, and datalink interfacing. The FC-FBGA package supports the ruggedized board stack-ups typical of defense electronics, with thermal paths engineered for conduction-cooled VPX slots.
추천
Broadcast Video Processing
The 10AS048H4F34E3SG accelerates 4K/UHD video processing pipelines — including deinterlacing, scaling, color-space conversion, and codec pre-processing — by mapping parallel datapaths into the FPGA fabric. The HPS runs a Linux control plane for IP streaming, captioning insertion, and audio routing. Transceivers handle SMPTE ST 425 / ST 2082 SDI and emerging IP-based ST 2110 workflows. The wide logic capacity lets one device replace multiple discrete ASSPs in studio-grade broadcast encoders.
추천
Industrial Machine Vision
High-speed line-scan and area-scan inspection systems leverage the 10AS048H4F34E3SG's parallel fabric to run edge detection, defect classification, and convolutional neural-network inference at line rate. The HPS manages the GigE Vision / USB3 Vision stack and PLC handshaking, while the FPGA pipelines raw pixels into feature maps in real time. With 480K logic elements, multi-camera aggregation (4-8 sensors) is feasible on a single chip, reducing bill-of-material cost and footprint for smart-factory deployments.
추천
5G Fronthaul Prototyping
The 10AS048H4F34E3SG supports CPRI and eCPRI fronthaul interfaces through its multi-gigabit transceivers, while the FPGA fabric implements the lower PHY and fronthaul-split processing required between the radio unit and the baseband unit. The dual-core ARM Cortex-A9 HPS runs the O-RAN near-RT-RIC and timing synchronization stack, including IEEE 1588 and SyncE. Designers use this combination to prototype O-RAN Alliance 7-2x splits before committing to ASIC-based production hardware.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS048H4F34E3SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS048H4F34E3LG | 10AS048H4F34I3SG | 10AS048H3F34E3SG | 10AS032H4F34E3SG |
|---|---|---|---|---|---|
| Package | 1152-FBGA (35x35) | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 320,000 (-33%) |
| Speed Grade | 4 (fastest) | 4 | 3 | 3 (-10-15% Fmax) | 4 |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Extended (E) |
| Hard Processor System | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active | Active |
주요 차별점
- Fastest commercial speed grade in the 480K LE Arria 10 SX family (vs 10AS048H3F34E3SG)
- Same-footprint lead-free variant for RoHS-strict OEM builds (vs 10AS048H4F34E3LG)
- 480K LE density in the same 1152-FBGA, preserving PCB layout across speed/temp variants (vs 10AS032H4F34E3SG)
- Integrated dual-core ARM Cortex-A9 HPS eliminates external host CPU (vs Xilinx XC7Z100-2FFG1156I)
설계 노트
Estimated: at typical Arria 10 SX utilization (~70% LE, ~50% DSP, full HPS active), the device draws roughly 15-20 W from a 0.9 V core rail plus 1.8 V / 2.5 V / 3.3 V auxiliary rails. Use a multi-rail PMIC such as the LTM4677 or Intel's recommended uModule sequencer to control in-rush; stagger HPS and fabric power-up per Intel's power-management guide to avoid latch-up. Decouple every VCC pin with a 0.1 µF X7R plus a 10 µF bulk, placed within 2 mm of the BGA pad.
The 1152-FBGA (35 x 35 mm) substrate has a theta_JB around 0.5 C/W with a properly stitched thermal via array. Estimated: a 25 W dissipation yields a 12.5 C rise above the board — acceptable for extended temp but tight for industrial -40 to 100 C. Use at least 4 oz copper inner layers, a 5x5 thermal-via grid under the die, and a heat-spreader for sealed enclosures. Apply thermal interface material rated for the FC-BGA standoff.
Route the transceiver channels on the top layer with reference to a continuous ground plane; never split the reference plane under a transceiver lane. Maintain 100 Ω differential impedance with 5 mil trace width / 8 mil gap on a low-loss substrate such as Megtron 6. Keep DDR3/4 address/command traces within 50 mils of the SoC to satisfy the 1152-FBGA breakout constraints; use the Intel pin-connection guidelines for exact break-out pattern.
Configuration mode pins (MSEL) must be set before VCC ramps; a wrong MSEL state is the most common brick on first power-up. Always include a JTAG header with a recognized buffer (FTDI FT232H or Intel USB-Blaster II clone) for rescue programming. For HPS boot, validate the SD card boot image with the Intel SoC EDS bootloader tool before committing to eMMC; corrupted HPS boot images lock the device into JTAG-only recovery.
Place the HPS reference clock as close as possible to the CLK1 ball with a guarded keep-out zone; HPS jitter budgets are tighter than FPGA fabric clocks and directly impact Ethernet PHY timing. Series-terminate SD card signals with 33 Ω near the SoC; the SD controller's pull-ups are weak and 50 mm+ SD trace lengths will fail SDR104 mode. Keep high-speed serial lanes on a single routing layer to avoid via stubs.
규정 준수 정보
RoHS compliance stated by all authorized distributor listings (DigiKey, Mouser) and confirmed by datasheets.com; halogen-free status and exact MSL rating are not surfaced in the verified distributor listings and require direct Intel documentation lookup.
