EP2SGX90EF1508C3N - Stratix II GX FPGA 90K LEs 1.2V FC-FBGA1508 | Intel
부품 번호: EP2SGX90EF1508C3N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 25 | $1640 | $41,000.00 |
| 100 | $1525 | $152,500.00 |
| 250 | $1450 | $362,500.00 |
EP2SGX90EF1508C3N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing resources that the designer programs after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits (ICs) -> semiconductors. The Stratix II GX family adds multi-gigabit transceivers (MGTs) to the standard Stratix II fabric, enabling protocol bridging for PCI Express, Serial RapidIO, XAUI, and custom serial links. EP2SGX90EF1508C3N therefore occupies the high-end segment of Altera's 90 nm programmable-logic portfolio.
Key features of this device include 4,548 LABs, 252 18x18 multipliers, 192 PLLs/DLLs, and 4 phase-locked loops for clock management. The Enhanced speed grade is tuned for higher internal clock performance compared with the standard speed grade. Hardware debug via SignalTap II logic analyzer and on-chip bitstream encryption (AES) are supported, and configuration can be loaded via JTAG, passive serial, or fast passive parallel modes. The 1508-ball FC-FBGA exposes all 12 transceiver channels, 16 global clocks, and 4 PLL pairs.
The architecture combines an 8-input adaptive look-up table (ALUT) fabric with TriMatrix memory (MLAB, M512, M4K, M-RAM blocks). The 6.375 Gbps transceivers integrate clock-data recovery, transmit pre-emphasis, and receive equalization. Embedded DSP blocks accelerate 18x18 signed multiplications at pipeline rates up to 450 MHz, and the dedicated PCML I/O simplifies connection to external optical modules or backplanes.
Typical applications for the EP2SGX90EF1508C3N include multi-gigabit serial backplane aggregation, protocol bridge cards for telecom line cards, radar and beamforming baseband processing, and high-end video broadcast equipment. The combination of logic density, on-chip memory, and embedded transceivers reduces bill-of-materials cost by removing external PHY chips.
When designing with this device, provide four independent 1.2 V/2.5 V/3.3 V power rails with proper sequencing, route 100 ohm differential pairs to all MGT pins, and use the Altera Quartus II design suite (version 13.0 or earlier, since this is a mature device) for synthesis, place-and-route, and timing closure. Ensure the 1508-ball BGA PCB stackup supports matched impedance and via-in-pad microvia structures for the transceiver channels.
This page synthesizes distributor stock indicators, drop-in same-package alternatives, and practical design notes for the EP2SGX90EF1508C3N beyond the manufacturer datasheet.
드롭인 대체품: EP2SGX90EF1508C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX90EF1508C3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, RoHS Status, DSP Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX90FF1508C3N
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2SGX90EF1508C3
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2SGX90EF1508
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1750 / 개
데이터시트 보기 →EP2SGX130GF1508C3N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2S90F1508C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3200 / 개
데이터시트 보기 →EP2SGX90EF1508C3N 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Logic Elements (LEs) | 90960 |
| Logic Array Blocks (LABs) | 4548 |
| Embedded Memory (bits) | 4520448 |
| DSP Blocks / 18x18 Multipliers | 192 |
| Maximum User I/Os | 650 |
| Transceiver Channels | 12 |
| Transceiver Data Rate | up to 6.375 Gbps |
| PLLs / DLLs | 8 PLLs / 16 DLLs |
| Maximum Internal Clock Frequency | 816.9 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | C3 (Enhanced, commercial) |
| 패키지 | 1508-ball FC-FBGA |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| Bitstream Encryption | AES-128 supported |
| RoHS 상태 | Compliant (lead-free) |
EP2SGX90EF1508C3N 1508-ball fc-fbga 핀 구성 가이드
EP2SGX90EF1508C3N(1508-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX90EF1508C3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX90EF1508C3N 적합 용도: 6 애플리케이션s: 10 Gigabit Ethernet / XAUI Aggregation, PCI Express Gen1 Endpoint / Root Complex, Telecom Backplane SERDES Aggregation, Radar and Beamforming Baseband Processing, High-End Video Broadcast Routing and Processing, Industrial Imaging and Machine Vision.
10 Gigabit Ethernet / XAUI Aggregation
The EP2SGX90EF1508C3N is well suited to 10 Gigabit Ethernet aggregation on telecom line cards. Its 12 multi-gigabit transceivers operate up to 6.375 Gbps, which directly drives four XAUI lanes (3.125 Gbps each) per port or one 10GbE port. Designers place a soft 10G MAC and XGXS PCS in the 90,960 LEs, and the 4.5 Mbit of TriMatrix memory holds packet buffers and PCS elasticity FIFOs. Versus a discrete PHY plus glue logic, the integrated transceivers cut board area by roughly 40% and simplify FCC/CE EMI compliance. The device's 650 user I/Os support multiple SFP+ cages and backplane SERDES links, with the Enhanced C3 speed grade providing timing margin for the XAUI PCS.
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PCI Express Gen1 Endpoint / Root Complex
Stratix II GX FPGAs are the classic Altera platform for PCI Express Gen1 endpoint and root complex designs. The EP2SGX90EF1508C3N exposes four hard PCI Express IP cores via the hard PCS, delivering x1, x2, and x4 Gen1 (2.5 Gbps) links without external PHYs. Engineers instantiate the Altera PCIe Compiler IP and dedicate up to 32,000 LEs to user application logic, with the remaining logic available for DMA engines, BAR mappers, or custom protocol layers. The Enhanced C3 speed grade closes timing on the Gen1 PHY layer with comfortable margin, and the device's 192 DSP blocks accelerate AES or signal-processing accelerators. This combination shrinks a 2-chip PHY+ASIC solution into a single FPGA.
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Telecom Backplane SERDES Aggregation
On AdvancedTCA and proprietary telecom backplanes, the EP2SGX90EF1508C3N aggregates SERDES traffic from multiple line cards at rates up to 3.125 Gbps per channel. The 12 transceivers handle 12 backplane lanes in parallel, and the 4.5 Mbit of embedded memory serves as a shared buffer for TDM and packet reassembly. The 8 PLLs and 16 DLLs generate the precise reference clocks required for CPRI and OBSAI fronthaul links, and the Enhanced C3 speed grade closes timing at 300 MHz core for protocol processing. With 650 user I/Os, the FPGA also services slower 1 Gbps Ethernet and management-plane GPIO without external bridges.
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Radar and Beamforming Baseband Processing
Phased-array radar and electronic-warfare systems use the EP2SGX90EF1508C3N for high-throughput baseband processing, taking advantage of its 192 18x18 DSP blocks (operational up to 450 MHz) and 4.5 Mbit of TriMatrix memory for FFT and pulse-Doppler computation. Each DSP block performs 36 GMACs, supporting real-time beamforming and channelization on 4-8 antenna streams. The 12 transceivers interface to ADCs and DACs over JESD204B-equivalent LVDS, and the 90,960 LEs host state machine and buffer logic. The 1.2 V core supply keeps per-board power manageable in 6U VPX enclosures, and the Enhanced speed grade is preferred for the tightest DSP feedback paths.
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High-End Video Broadcast Routing and Processing
In broadcast studios and video routers, the EP2SGX90EF1508C3N routes uncompressed SDI and HDMI streams at rates up to 6 Gbps. The 12 transceivers accept SDI/HD-SDI/3G-SDI/6G-SDI streams and forward them through a low-latency crosspoint implemented in the 90,960 LEs. The 4.5 Mbit TriMatrix memory holds line buffers, audio de-embedders, and ancillary data FIFOs. Multi-channel audio mixing and on-screen-display (OSD) overlay benefit from the 192 DSP blocks and 650 user I/Os, which connect to DDR2 SDRAM frame stores and HDMI output PHYs. The Enhanced C3 speed grade meets the strict 1-frame video latency budgets required for live broadcast.
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Industrial Imaging and Machine Vision
Multi-camera factory-automation and medical imaging systems use the EP2SGX90EF1508C3N as a Camera Link or CoaXPress frame grabber. Each transceiver channel receives 6.375 Gbps CoaXPress downlink, aggregating up to 12 cameras per board. The 192 18x18 DSP blocks perform Bayer demosaic, color correction, and edge detection in real time at 250-450 MHz, while the 4.5 Mbit memory buffers raw image tiles. The Enhanced C3 speed grade closes timing for high-resolution 25 MP sensors at 80 fps. The 650 user I/Os interface to external DDR2 SDRAM, Gigabit Ethernet, and USB 3.0 host controllers for host-side image transfer. Compared with a DSP+ASIC solution, the FPGA delivers a single-chip image pipeline with sub-frame latency.
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추천 제품 요약
엔지니어링 참조 데이터: EP2SGX90EF1508C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX90FF1508C3N | EP2SGX90EF1508C3 | EP2SGX90EF1508 | EP2SGX130GF1508C3N | EP2S90F1508C3N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Logic Elements | 90960 | 90960 | 90960 | 90960 | 130720 | 90960 (no transceivers) |
| Transceiver Channels | 12 | 12 | 12 | 12 | 20 | 0 (logic only) |
| Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | N/A (no transceivers) |
| Embedded Memory (bits) | 4520448 | 4520448 | 4520448 | 4520448 | 6744576 | 4520448 |
| 18x18 Multipliers | 192 | 192 | 192 | 192 | 252 | 192 |
| User I/Os | 650 | 650 | 650 | 650 | 650 | 650 |
주요 차별점
- Enhanced speed grade with 816.9 MHz Fmax (vs EP2SGX90FF1508C3N)
- Higher logic density on identical footprint (vs EP2S90F1508C3N)
- Lower pin density than larger Stratix II GX parts (vs EP2SGX130GF1508C3N)
설계 노트
The EP2SGX90EF1508C3N requires four independent power rails: VCC (1.2 V core), VCCPD (2.5 V/3.3 V I/O pre-driver), VCCIO (1.2-3.3 V I/O bank), and VCCR/VCCT (1.2 V transceiver analog). Altera recommends a 4-rail power-on sequence with VCC first and the transceivers last; mis-sequencing can latch-up the device. The enhanced 1.2 V core current at full utilization is roughly 6 A, so use a 10 A-rated buck regulator and place it within 25 mm of the BGA. For transceiver rails, use an LDO (e.g., TI TPS74401) with 1 mV peak-to-peak ripple to keep jitter under 5 ps.
Route all 12 transceiver channels with 100 ohm differential impedance over a low-loss stackup (e.g., Panasonic Megtron 6 or Isola FR408HR). Use via-in-pad microvias (0.1 mm pad, 0.3 mm drill) to escape the 1 mm pitch FC-FBGA, and maintain length matching of +/- 0.127 mm (5 mils) within a transceiver pair. Stitch the BGA perimeter with a 0.5 mm pitch GND via fence to provide a low-impedance return path. For the 1508-ball FC-FBGA, plan a minimum 14-layer stackup with two core layers and eight prepreg layers; the Stratix II GX device handbook AN531 provides reference stackups.
Estimated: at 1.2 V core and 6 A worst-case load, plus transceiver power of about 0.5 W per channel at 6.375 Gbps, total device dissipation can reach 10-12 W. The 1508-ball FC-FBGA's theta_JA is approximately 7.5 C/W on a 12-layer JEDEC test board with adequate airflow, so the junction temperature can rise 60-90 C above ambient. Mount a heatsink with 1 C/W or better and provide 200 LFM of forced air for industrial-temperature operation. Use the on-chip TEMP_SENSE diode (read via JTAG) to monitor junction temperature at run time.
Do not hot-swap the EP2SGX90EF1508C3N; the FC-FBGA is not designed for socketing, and a single mis-aligned pin will short VCC to GND. Always program the bitstream through the factory-default fast passive parallel mode first to validate the configuration chain, then enable AES-128 encryption. The Stratix II GX family is mature and only supported up to Quartus II 13.0; using a newer Quartus version will fail to detect the device. For production, place a 4.7 kohm pull-up on nCONFIG and a 1 kohm pull-down on nSTATUS per the device handbook reset guidelines.
규정 준수 정보
RoHS and REACH compliance per Altera/Intel product declaration. AEC-Q100 not applicable - this is a commercial-grade FPGA; for automotive select an industrial-temperature speed grade variant. Halogen-free status not explicitly stated in the verified data; treat as unknown until the certificate of compliance is reviewed.