EP2SGX90FF40C5N - Stratix II GX FPGA 90K LE, 40Gbps Tranceivers | Altera
부품 번호: EP2SGX90FF40C5N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $240 | $24,000.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
EP2SGX90FF40C5N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include simple CPLDs. Modern FPGAs like the Stratix II GX integrate hard IP cores (transceivers, memory controllers, DSP blocks, processors) alongside the programmable fabric, allowing system designers to implement custom digital logic, high-speed serial protocols, and parallel processing pipelines on a single chip.
Key features of the EP2SGX90FF40C5N include up to 6.375 Gbps embedded transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G; dedicated DSP blocks for high-throughput signal processing; TriMatrix memory with up to ~4.5 Mbits of block RAM; and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The device also integrates a hard PCIe endpoint and supports up to four PCIe lanes at Gen1 rates.
Architecturally, the Stratix II GX uses a 90 nm process node and an ALM-based logic fabric that delivers improved performance and lower power compared to first-generation Stratix. The 6.375 Gbps transceivers feature adaptive equalization and pre-emphasis, enabling reliable serial link operation across backplanes and across long FR-4 PCB traces. Hard IP for PCI Express eliminates the need for soft IP licensing for that interface.
Typical applications include 10 Gbps networking line cards, telecom baseband processing, high-speed serial interface bridging (PCIe to SRIO, XAUI conversion), military radar signal processing, and broadcast video transport. Designers also use the EP2SGX90 family for ASIC prototyping where high logic density and large memory bandwidth are required.
When designing with this device, pay close attention to PCB BGA breakout routing, decoupling network placement, and transceiver channel utilization. The 1.00 mm ball pitch is workable but still demands 6-8 layer stackup with microvia or via-in-pad technology for clean signal integrity above 5 Gbps.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix II GX family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP2SGX90FF40C5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX90FF40C5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Mounting Type, Embedded Memory Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX90FF1508C5N
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP2SGX90FF1508C5ES
✅ 드롭인✓ 재고 있음
$350 / 개
데이터시트 보기 →EP2SGX90FF1508C4N
✅ 드롭인✓ 재고 있음
$1500 / 개
데이터시트 보기 →EP2SGX90FF1508C3N
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2SGX90FF1508C5
✅ 드롭인✓ 재고 있음
$1350 / 개
데이터시트 보기 →EP2SGX90FF1508I5N
✅ 드롭인✓ 재고 있음
$1450 / 개
데이터시트 보기 →EP2SGX90FF40C5N 최대 정격 & 전기적 특성
| Series | Stratix II GX |
| Family | Stratix II GX |
| Logic Elements | 90,960 |
| Logic Array Blocks (LABs) | 4,548 |
| Maximum User I/O Pins | 650 |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Core Voltage | 1.2 V |
| Process Node | 90 nm |
| 패키지 | 1,508-ball FineLine BGA (FBGA) |
| Ball Pitch | 1.00 mm |
| 동작 온도 | Commercial (0C to +85C) |
EP2SGX90FF40C5N 1,508-ball fineline bga (fbga) 핀 구성 가이드
EP2SGX90FF40C5N(1,508-ball fineline bga (fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX90FF40C5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX90FF40C5N 적합 용도: 6 애플리케이션s: 10 Gigabit Ethernet Networking Line Cards, PCI Express Endpoint Cards, Telecom Baseband Signal Processing, High-Speed Serial Protocol Bridging, ASIC Prototyping, Broadcast Video Transport Systems.
10 Gigabit Ethernet Networking Line Cards
The EP2SGX90FF40C5N is well-suited for 10 Gigabit Ethernet line card designs where its 6.375 Gbps embedded transceivers can directly drive four XAUI lanes at 3.125 Gbps each for 10GbE aggregation. The 90,960 logic elements provide capacity for layer-2 switching logic, packet classification engines, and queuing buffers. With 650 user I/O pins, designers can connect to external SFP+ cages, RLDRAM-II buffers, and multiple SGMII PHYs simultaneously. The device integrates a hard PCIe endpoint that simplifies co-design with host CPUs on AdvancedTCA or ATX backplane architectures. Compared to a discrete PHY + ASIC approach, the Stratix II GX reduces BOM cost and PCB area while allowing post-silicon feature updates via firmware. Power dissipation for a fully-utilized 4-port 10GbE design typically runs 8-12 W, requiring a moderate heatsink.
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PCI Express Endpoint Cards
The EP2SGX90FF40C5N integrates a hard PCI Express endpoint supporting up to x4 Gen1 lanes at 2.5 Gbps per lane, making it ideal for high-performance PCIe endpoint cards in server, storage, and instrumentation applications. Designers can implement DMA engines, custom peripherals, and protocol bridges (PCIe-to-SRIO, PCIe-to-XAUI) on the 90K-LE fabric without licensing external IP. The 6.375 Gbps transceivers can be repurposed for additional PCIe Gen2 lanes or other high-speed serial protocols. With 1,508 balls, the FF1508 package provides sufficient I/O for downstream connections (SFP, SATA, GPIO) alongside the PCIe lanes. Quartus II software provides complete PCIe reference designs with driver examples for common operating systems. Typical applications include PCIe-based protocol analyzers, software-defined radio cards, and FPGA accelerator cards for HPC workloads.
추천
Telecom Baseband Signal Processing
The EP2SGX90FF40C5N delivers the DSP throughput required for telecom baseband signal processing including WCDMA, LTE, and WiMAX physical-layer implementations. Its dedicated DSP blocks accelerate chip-rate processing, FFT/iFFT computations, and channel coding, while the 90,960 logic elements handle MAC-layer state machines and packet scheduling. The 6.375 Gbps transceivers support CPRI or OBSAI backhaul links to remote radio heads at 3.072 Gbps or 6.144 Gbps rates. With on-chip block RAM and TriMatrix memory, designers can buffer multi-frame data without external memory bottlenecks. The 650 I/O pins accommodate glueless connection to DDR2/QDR/RLDRAM external memories for working data sets. Power consumption scales with logic utilization; a fully-loaded 2x2 MIMO LTE reference design typically draws 10-15 W.
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High-Speed Serial Protocol Bridging
The EP2SGX90FF40C5N excels as a protocol bridge silicon between mismatched high-speed serial interfaces such as PCIe to Serial RapidIO, XAUI to SATA, or SGMII to PCIe. The 6.375 Gbps transceivers support multiple protocol configurations through soft IP cores, while the logic fabric handles packet translation, buffer management, and flow control. With 90,960 LEs, the device can manage multiple concurrent bridges simultaneously, reducing chip count on complex system boards. The hard PCIe endpoint eliminates one IP licensing fee for PCIe-based bridge applications. Designers use this approach in radar signal aggregation, video broadcast routers, and storage controller cards where multiple protocol domains must interoperate. Quartus II provides reference designs for common bridge topologies including PCIe-to-SRIO and XAUI-to-PCIe.
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ASIC Prototyping
The EP2SGX90FF40C5N is widely used as an ASIC prototyping platform because its 90,960 logic elements provide capacity for partitioning and validating complex ASIC RTL designs before mask tape-out. The 1.2 V core, abundant block RAM, and flexible I/O standards (LVDS, HSTL, SSTL) closely match the operating characteristics of many production ASIC nodes. Designers can implement multi-million-gate ASIC prototypes by combining multiple Stratix II GX FPGAs through LVDS inter-board connections, achieving a high-fidelity prototype environment. The 6.375 Gbps transceivers enable I/O-heavy ASIC designs with SERDES interfaces to be validated at near-real speed. Quartus II synthesis and the Chip Planner provide visibility into timing and routing that mirrors final ASIC implementation, reducing re-spin risk. Typical ASIC prototypes in this device include network processors, storage controllers, and baseband modems.
추천
Broadcast Video Transport Systems
The EP2SGX90FF40C5N supports broadcast video transport applications including SDI to IP conversion, video format translation, and uncompressed HD/3G-SDI routing. Its 6.375 Gbps transceivers handle HD-SDI (1.485 Gbps), 3G-SDI (2.97 Gbps), and emerging 6G/12G-SDI standards, while the 90K-LE fabric implements video processing functions such as scaling, frame-rate conversion, and color space transformation. With 650 user I/O pins, the device can aggregate multiple video streams and present them to host processors or backplane networks. The hard PCIe endpoint simplifies connection to video servers and GPU arrays. Broadcast equipment manufacturers appreciate the ability to support multiple video formats on a single device, reducing SKU complexity. Power consumption is moderate; a 4-channel HD-SDI processing design typically draws 6-8 W, suitable for fanless chassis implementations.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX90FF40C5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX90FF1508C5N | EP2SGX90FF1508C5ES | EP2SGX90FF1508C4N | EP2SGX90FF1508C3N | EP2SGX90FF1508C5 | EP2SGX90FF1508I5N |
|---|---|---|---|---|---|---|---|
| Package | 1,508-ball FineLine BGA (1.00 mm pitch) | 1,508-ball FineLine BGA - same | 1,508-ball FineLine BGA - same | 1,508-ball FineLine BGA - same | 1,508-ball FineLine BGA - same | 1,508-ball FineLine BGA - same | 1,508-ball FineLine BGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| Speed Grade | C5 (commercial, fastest) | C5 | C5 | C4 | C3 | C5 | I5 (industrial) |
| Operating Temperature | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| Transceiver Rate | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| User I/O Pins | 650 | 650 | 650 | 650 | 650 | 650 | 650 |
주요 차별점
- Fastest commercial speed grade option (vs EP2SGX90FF1508C4N)
- Higher logic capacity than Stratix II non-GX (vs EP2S90F1508C5)
- Largest user I/O count in Stratix II GX family (vs EP2SGX90FF1152C3)
설계 노트
The 1,508-ball FineLine BGA with 1.00 mm pitch requires a 6-8 layer PCB stackup with microvia or via-in-pad technology for clean signal integrity above 5 Gbps. Use a symmetrical stackup with continuous power and ground planes adjacent to signal layers. Assign dedicated GND balls to a low-impedance ground plane for return current continuity under high-speed differential pairs. Place decoupling capacitors directly beneath the BGA on the opposite PCB side using short via connections. Estimated: a typical 10-layer stackup with 4 signal layers, 2 dedicated ground planes, 1 power plane, and microvia technology supports the FF1508 package reliably for 6.375 Gbps transceiver operation.
The EP2SGX90FF40C5N requires a multi-rail power supply topology with proper sequencing. The 1.2 V core must ramp before the I/O supply voltages to prevent latch-up. Use a power sequencer such as the LTC2923 or equivalent Altera-recommended controller. Separate analog and digital supplies for the transceiver blocks (VCCA, VCCAUX, VCCH, VTT) must be filtered with ferrite beads and bulk decoupling to minimize jitter. Estimated: a fully-utilized design draws 8-15 W; use a switching regulator with at least 85% efficiency to manage thermal dissipation.
Do not assume the EP2SGX90FF40C5N designation reveals the complete spec - the 'FF40' in the part number is an internal Altera encoding where the FF indicates FineLine BGA family and 40 maps to the 1508-ball package count. Engineers migrating from a 780-ball or 1152-ball Stratix II GX design must redesign the BGA breakout since the FF1508 footprint is significantly larger. Also verify that the Quartus II software version supports your specific device revision - older Quartus versions may not include recent die errata fixes for Stratix II GX.
규정 준수 정보
Compliance information not present in verified web data. As a legacy Altera/Intel FPGA introduced in the 2000s, RoHS compliance is uncertain - confirm with authorized distributors before procurement for EU markets.
