EP2SGX90FF40C5NES - 90nm Stratix II GX FPGA 90,960 Cells | Altera
부품 번호: EP2SGX90FF40C5NES ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 25 | $1680 | $42,000.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1580 | $158,000.00 |
EP2SGX90FF40C5NES 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O cells are defined at design-time by the user's bitstream rather than at wafer fab. Within the broader programmable-logic hierarchy, the Stratix II GX family sits in the high-performance transceiver-enabled tier: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The 'GX' suffix denotes integrated multi-gigabit transceivers, distinguishing the family from transceiver-less Stratix II 'E' variants and positioning the device above CPLD and low-density FPGA families such as Cyclone II in both logic capacity and serial bandwidth.
Key features include 90,960 equivalent logic elements, 4,828 CLBs, embedded transceiver channels capable of multi-gigabit serial rates, dedicated DSP blocks for high-throughput arithmetic, and 90 nm process technology. The Stratix II GX architecture introduces an 'adaptive logic module' (ALM) that combines adaptive LUT and register structures, giving roughly 50 percent greater logic efficiency than previous-generation ALMs. The 1,508-pin FC-FBGA package provides high signal and power-pin density, which is essential for routing the parallel I/O, transceiver lanes, clock tree, and power rails without compromising signal integrity.
Architecturally, the device combines a logic fabric of ALMs, embedded M512/M4K/M-RAM memory blocks, and DSP blocks arranged in columns. Multi-gigabit transceivers (CMU channels) sit on the periphery, supporting standard serial protocols and reference-clock forwarding, while PLLs generate the on-chip clocking backbone. The 90 nm process enables higher integration and lower dynamic power per MHz than older 130 nm or 180 nm nodes, although static power at 1.2 V core is non-negligible in dense designs.
Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, XAUI, Fibre Channel), wireless baseband signal processing, high-definition video processing, and ASIC prototyping. It is also widely used in telecom line cards, military/aerospace signal processing, and test-and-measurement instrumentation where reconfigurable logic with on-chip transceivers reduces bill of materials.
When designing with this device, plan for a robust multi-rail power architecture: 1.2 V core, dedicated PLL analog supply, transceiver supply, and reference-clock supply each require low-noise LDOs and decoupling. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure, and consult the Stratix II GX Device Handbook for transceiver PCB layout guidelines.
This page consolidates distributor pricing, package-level information, and design guidance for engineers evaluating the EP2SGX90FF40C5NES, including drop-in alternatives from the Stratix II GX family and comparable high-density FPGAs.
드롭인 대체품: EP2SGX90FF40C5NES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX90FF40C5NES (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Mounting Type, Process Technology, Maximum Transceiver Data Rate.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX90FF40C4NES
✅ 드롭인✓ 재고 있음
$1485 / 개
데이터시트 보기 →EP2SGX90FF40C3NES
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2SGX90FF40C5N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2SGX130GF40C5NES
✅ 드롭인✓ 재고 있음
$1530 / 개
데이터시트 보기 →EP2SGX90EF35C5NES
✅ 드롭인✓ 재고 있음
$1285 / 개
데이터시트 보기 →EP2SGX90FF40C4N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2SGX90FF40C5NES 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Series | EP2SGX90 |
| Logic Elements | 90,960 |
| Configurable Logic Blocks (CLBs) | 4,828 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Maximum Core Frequency | 609.76 MHz |
| 패키지 | 1508-pin FC-FBGA |
| 실장 유형 | Surface Mount (flip-chip BGA) |
| Temperature Grade | Commercial Extended |
| Embedded Transceivers | Multi-gigabit transceiver (CMU) channels |
| On-chip Memory | M512/M4K/M-RAM blocks (TriMatrix memory) |
| DSP Blocks | Embedded multiplier/accumulator DSP blocks |
| PLL Count | Multiple PLLs with dedicated analog supply pins |
| RoHS 상태 | Compliant (lead-free) |
| Speed Grade | C5 |
EP2SGX90FF40C5NES 1508-pin fc-fbga 핀 구성 가이드
EP2SGX90FF40C5NES(1508-pin fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX90FF40C5NES.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX90FF40C5NES 적합 용도: 6 애플리케이션s: Multi-Gigabit Serial Interface Bridging, Wireless Baseband Signal Processing, High-Definition Video Processing, ASIC Prototyping and Emulation, Telecom Line Cards and Backhaul, Military and Aerospace Signal Processing.
Multi-Gigabit Serial Interface Bridging
The EP2SGX90FF40C5NES is well-suited to multi-gigabit serial bridging designs such as PCI Express, Serial RapidIO, XAUI, and Fibre Channel, where its integrated multi-gigabit transceivers, hard PCS/PMA blocks, and 90,960 logic elements provide both the SERDES bandwidth and the protocol state-machine logic in a single device. The 1,508-pin FC-FBGA package supplies sufficient I/O banks to break out multiple lanes while isolating high-speed serial signals from lower-speed parallel logic. Typical clock rates of 156.25 MHz and 312.5 MHz are easily supported by the on-chip PLLs. Compared with smaller Stratix II GX parts, the 90,960-LE count gives headroom for application-layer protocol stacks without off-chip ASICs. Designers should use the Stratix II GX Transceiver Design Guide and the Quartus II ALTGX megafunction to lock transceiver parameters.
추천
Wireless Baseband Signal Processing
In wireless baseband applications, the EP2SGX90FF40C5NES combines its 90,960 logic elements, embedded DSP blocks, and high-speed transceivers to implement LTE, WiMAX, and proprietary OFDM physical layers on a single die. The DSP blocks deliver up to 18x18 multiplies with high accumulator density, while the transceiver channels digitize antenna data at IF or baseband. The 1.2 V core and 90 nm process keep per-MIPS power competitive for a high-density design. Compared with a DSP+ASIC solution, the FPGA allows late-binding of channel-bandwidth and protocol revisions, accelerating time to market. Designers should consult Altera's AN 514 (DSP Builder) and the Stratix II GX DSP Performance guide to size filter and FFT pipelines.
추천
High-Definition Video Processing
The EP2SGX90FF40C5NES supports HD and emerging 4K video processing pipelines, where real-time deinterlacing, scaling, color space conversion, and frame-rate conversion demand thousands of multiply-accumulates per pixel. The TriMatrix memory hierarchy (M512/M4K/M-RAM) provides per-line buffers, while the DSP blocks accelerate 2D filter kernels. The 1,508-pin FC-FBGA package routes multiple digital video ports (BT.1120, DisplayPort, HDMI) plus a host CPU bus. The commercial-extended temperature grade supports industrial video walls and broadcast equipment enclosures. Compared with general-purpose DSPs, the FPGA delivers deterministic per-frame latency required for synchronized multi-display applications.
추천
ASIC Prototyping and Emulation
Engineers use the EP2SGX90FF40C5NES as an ASIC prototyping platform because the 90,960 logic elements and 1,508-pin FC-FBGA package can host million-gate ASIC partitions with sufficient I/O to map real-world signals. The high transceivers count accelerates verification of SERDES-based ASICs, while the embedded M-RAM blocks emulate large register files and FIFOs. The Quartus II incremental compilation and TimeQuest timing analyzer support gate-level ASIC netlist synthesis with back-annotation. Compared with structured ASICs, the FPGA reduces NRE cost and shortens bring-up to days rather than months. The commercial-extended temperature grade also suits chassis-based emulation hardware.
추천
Telecom Line Cards and Backhaul
The EP2SGX90FF40C5NES is deployed in telecom line cards and backhaul equipment, where the multi-gigabit transceivers terminate OC-48/STM-16, CPRI, and OBSAI links while the 90,960 logic elements run packet processing, traffic shaping, and OAM (operations, administration, maintenance) functions. The device's 1.2 V core and 90 nm process provide a balanced power/performance profile for chassis-based platforms with forced-air cooling. Compared with discrete SERDES+NP solutions, an integrated Stratix II GX reduces board area, BOM cost, and inter-chip latency. Designers should leverage Altera's AN 580 (CPRI) and AN 531 (OBSAI) reference designs for protocol bring-up.
추천
Military and Aerospace Signal Processing
The EP2SGX90FF40C5NES (commercial extended temperature grade) is widely used in military and aerospace signal processing platforms for radar, electronic warfare (EW), and software-defined radio (SDR) subsystems, where its 90,960 logic elements, DSP blocks, and hardened SERDES accelerate channelization, beamforming, and demodulation workloads. The 1,508-pin FC-FBGA package supports high-bandwidth data converters (ADCs/DACs) and mezzanine standards such as VPX and VME. Designers benefit from Quartus II's DO-254 and Mil-Std-810 design support collateral, and from Altera's long-life-cycle program for defense programs. Compared with ASICs, the FPGA allows late-binding of waveforms and threat libraries, which is critical for agile EW systems.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX90FF40C5NES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX90FF40C4NES | EP2SGX90FF40C3NES | EP2SGX90FF40C5N | EP2SGX130GF40C5NES |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1508-pin FC-FBGA (FF40) | 1508-pin FC-FBGA (FF40) - same | 1508-pin FC-FBGA (FF40) - same | 1508-pin FC-FBGA (FF40) - same | 1508-pin FC-FBGA (FF40) - same |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 130,000 |
| Speed Grade | C5 | C4 | C3 | C5 | C5 |
| Temperature Grade | Commercial Extended | Commercial Extended | Commercial Extended | Commercial | Commercial Extended |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Embedded Transceivers | Yes (multi-gigabit) | Yes (multi-gigabit) | Yes (multi-gigabit) | Yes (multi-gigabit) | Yes (multi-gigabit, more channels) |
주요 차별점
- Higher logic capacity than the EP2SGX60 family with the same package family (vs EP2SGX60EF1152C5N)
- Integrated multi-gigabit transceivers, versus Stratix II (non-GX) parts (vs EP2S90F1508C5N)
- Commercial-extended temperature grade, versus commercial-only FF1508C5N (vs EP2SGX90FF1508C5N)
설계 노트
The EP2SGX90FF40C5NES requires a multi-rail power architecture: 1.2 V core, dedicated PLL analog supply (VCCA_PLL), transceiver supply (VCCH_GXB, VCCA_GXB), and reference-clock supply. Each rail must be sourced from a low-noise LDO (e.g., 1.2 V LDO with sub-30 uVrms noise); do not power PLLs or transceivers directly from switching regulators. Add bulk tantalum or polymer capacitors (220-470 uF) plus 0.1 uF and 0.01 uF ceramic decoupling on every power pin per Altera's Stratix II GX PowerPlay recommendations. Power-on sequence (VCC core before VCCIO) must be enforced to avoid latch-up; use power sequencer ICs or MOSFET load switches if regulators do not provide tracking.
Although the 90 nm Stratix II GX family is more power-efficient than older 130 nm nodes, sustained utilization of all 90,960 logic elements with high toggle rates can dissipate 10-15 W. The 1,508-pin FC-FBGA package exposes the die through the BGA balls and a thermal lid; design a 6+ layer PCB with a 0.5 oz inner copper plane and 1 oz top/bottom pours to spread heat. A thermal pad (TIM) between the BGA lid and an optional heatsink is recommended for industrial enclosures with no airflow. Estimate: at 12 W dissipation, junction temperature rise is approximately 30-40 C above ambient with a properly designed thermal stack. (Estimated; verify with manufacturer PDN and thermal model.)
Use at least a 6-layer PCB stack-up with stripline or microstrip-controlled impedance (50 ohm single-ended, 100 ohm differential) for multi-gigabit transceiver channels. Route transceiver lanes as short, length-matched differential pairs with continuous reference planes; skew within a channel should not exceed 150 mil. Keep SERDES traces away from switching DC-DC converter edges and parallel buses. Reference Altera's Stratix II GX PCB Design Guide (AN 532) for via pattern, AC-coupling capacitor placement, and channel loss budget. For the 1,508-pin BGA, use laser-drilled microvias (8 mil pads, 4 mil drills) on a 1.0 mm pitch to escape all signals on the top two layers without dog-bone fanouts.
Do not assume pinout compatibility across the FF40, FF1508, FF1152, and other FF package codes - the BGA ball map differs even though logic capacity may be identical. Also avoid mixing the Stratix II (EP2S) and Stratix II GX (EP2SGX) pinouts, since 'GX' parts add transceiver balls that are absent on non-GX variants. When migrating from C5 to C4 or C3 speed grades, re-run TimeQuest timing analysis: a C5 design may fail timing at C4 due to ~15% slower Fmax. Finally, never power the device without proper VCCIO configuration - I/O banks must be configured to 1.5 V, 1.8 V, 2.5 V, or 3.3 V via VCCIO pins before any I/O is driven, or the I/O cells can latch-up.
규정 준수 정보
RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable - this is a commercial/industrial-grade FPGA, not an automotive-qualified part. Halogen-free status not explicitly stated in available data; marked as unknown per the data authenticity rules.
